Coating tape

Abstract

A process for manufacturing continuous ceramic tape includes steps of heating a ceramic feedstock to a molten state and spraying molten droplets of the feedstock onto a deposition surface. The method further includes forming a ceramic coating on the deposition surface by accumulating the droplets, which solidify and are directly bonded to one another. The deposition surface is non-stick with respect to the ceramic coating such that the coating may be peeled off of the deposition surface as a continuous ceramic tape, without fracture. Additionally, in embodiments, the deposition surface is removed by running the deposition over a bending edge, chemically stripping or dissolving the deposition surface, or burning the deposition surface.

What is claimed is: 
     
         1 . A tape, comprising:
 inorganic material having a melting temperature greater than 250° C. at one standard atmosphere;   microstructure of overlapping lamellae, the lamellae having a thickness less than twice a lateral dimension thereof, wherein the lamellae are directly bonded to one another but include at least some voids between at least some of the lamellae;   a length of at least 10 mm, a thickness orthogonal to the length of at least 20 μm and no more than 5 mm, and a width orthogonal to the length and the thickness of at least 2 mm.   
     
     
         2 . The tape of  claim 1 , wherein the tape is thin such that the thickness is no more than 250 μm. 
     
     
         3 . The tape of  claim 2 , wherein the tape has a length of at least 10 m. 
     
     
         4 . The tape of  claim 3 , wherein the elongate tape is wound on a reel. 
     
     
         5 . The tape of  claim 1 , wherein the lamellae are ceramic. 
     
     
         6 . The tape of  claim 1 , wherein the tape has lower thermal conductivity and/or lower electrical conductivity than the inorganic material in bulk. 
     
     
         7 . An assembly, comprising:
 a tape comprising:
 inorganic material having a melting temperature greater than 250° C. at one standard atmosphere; 
 microstructure of overlapping lamellae, the lamellae having a thickness less than twice a lateral dimension thereof, wherein the lamellae are directly bonded to one another but include at least some voids between at least some of the lamellae; 
 a length of at least 10 mm, a thickness orthogonal to the length of at least 20 μm and no more than 5 mm, and a width orthogonal to the length and the thickness of at least 2 mm; and 
   a polymeric carrier comprising a fluoropolymer surface, the tape bonded to the polymeric carrier with the fluoropolymer surface in contact with the tape.   
     
     
         8 . A sheet, comprising:
 layers of inorganic material having a melting temperature greater than 250° C. at one standard atmosphere, wherein each layer has a thickness of at least 20 μm and no more than 5 mm, wherein each layer has microstructure of overlapping lamellae, the lamellae having a thickness less than twice a lateral dimension thereof, wherein the lamellae are directly bonded to one another but include at least some voids between at least some of the lamellae; and   interfaces between the layers where each layer is bonded to an adjoining layer.   
     
     
         9 . The sheet of  claim 8 , wherein the layers are of different materials from one another in terms of composition.