Oled panel for lighting device with moisture intrusion delay effect

Abstract

An organic light-emitting diode panel for a lighting device includes a substrate including an array area having an emission area and a dummy area disposed outside the array area, an auxiliary wiring pattern, a first electrode, a passivation pattern, an OLED emission structure, a second electrode, an adhesive layer, and an encapsulation layer. The passivation pattern and the adhesive layer have an uneven boundary surface therebetween in the dummy area. Alternatively, a lower surface of the adhesive layer has a 3D structure. Thus, a moisture intrusion path between the passivation pattern and the adhesive layer of the dummy area of the substrate may be increased. Thus, degradation of the OLED emission structure due to external moisture intrusion may be reduced or prevented.

1 . An organic light-emitting diode panel for a lighting device, the organic light-emitting diode panel comprising:
 a substrate including an array area having an emission area, and including a dummy area disposed outside the array area;   an auxiliary wiring pattern disposed on the substrate;   a first electrode disposed on the substrate where the auxiliary wiring pattern is disposed;   a passivation pattern disposed on the substrate where the first electrode is disposed, and surrounding on at least four sides the auxiliary wiring pattern and the first electrode in the dummy area;   an organic light-emitting diode emission structure disposed on the substrate where the passivation pattern is disposed in the array area;   a second electrode disposed on the substrate where the organic light-emitting diode emission structure is disposed; an adhesive layer disposed on the substrate where the second electrode is disposed and contacting the passivation pattern in the dummy area, a lower surface of the adhesive layer having a three-dimensional structure in the dummy area; and   at least one groove that penetrates through the passivation pattern disposed in the dummy area of the substrate,   wherein a part of the adhesive layer is disposed in the at least one groove.   
     
     
         2 . The organic light-emitting diode panel for the lighting device of  claim 1 , wherein each of the at least one groove further penetrates through the first electrode disposed in the dummy area of the substrate or further penetrates through the first electrode and the auxiliary wiring pattern disposed in the dummy area of the substrate. 
     
     
         3 . The organic light-emitting diode panel for the lighting device of  claim 2 , wherein a side wall of the at least one groove has a step shape. 
     
     
         4 . The organic light-emitting diode panel for the lighting device of  claim 1 , wherein a capping layer is on the second electrode. 
     
     
         5 . The organic light-emitting diode panel for the lighting device of  claim 1 , wherein the auxiliary wiring pattern is a material having resistance lower than a resistance of a material of the first electrode. 
     
     
         6 . The organic light-emitting diode panel for the lighting device of  claim 1 , wherein the passivation pattern is at least in an area where the auxiliary wiring pattern is disposed. 
     
     
         7 . The organic light-emitting diode panel for the lighting device of  claim 1 , further comprising an encapsulation layer disposed on the adhesive layer. 
     
     
         8 . An organic light-emitting diode panel for a lighting device, the organic light-emitting diode panel comprising:
 a substrate including an array area and a pad area disposed near the array area;   an auxiliary wiring pattern disposed on the substrate;   a first electrode disposed on the substrate where the auxiliary wiring pattern is disposed;   a passivation pattern disposed on the substrate where the first electrode is disposed;   an organic light-emitting diode emission structure disposed on the substrate where the passivation pattern is disposed in the array area;   a second electrode disposed on the substrate where the organic light-emitting diode emission structure is disposed; and   a pad including a same material as a material of the auxiliary wiring pattern, the pad disposed on the substrate in the pad area and in contact with the passivation pattern, wherein the passivation pattern and the pad have an uneven boundary surface therebetween.   
     
     
         9 . The organic light-emitting diode panel for the lighting device of  claim 8 , wherein one or more dummy structure patterns are disposed in the pad, and wherein the passivation pattern in the pad area has a surface with an uneven structure corresponding to a surface of the pad having an uneven structure where the dummy structure pattern is disposed. 
     
     
         10 . The organic light-emitting diode panel for the lighting device of  claim 9 , wherein the dummy structure pattern comprises a light extraction material. 
     
     
         11 . The organic light-emitting diode panel for the lighting device of  claim 10 , wherein in the array area of the substrate, a light extraction pattern made of the light extraction material is disposed under the auxiliary wiring pattern. 
     
     
         12 . The organic light-emitting diode panel for the lighting device of  claim 9 , wherein the dummy structure pattern comprises a same material as a material of the auxiliary wiring pattern. 
     
     
         13 . The organic light-emitting diode panel for the lighting device of  claim 8 , wherein a capping layer is further disposed on the second electrode. 
     
     
         14 . The organic light-emitting diode panel for the lighting device of  claim 8 , wherein the auxiliary wiring pattern is a material having resistance that is lower than a resistance of a material of the first electrode. 
     
     
         15 . The organic light-emitting diode panel for the lighting device of  claim 10 , wherein the passivation pattern is at least in an area where the auxiliary wiring pattern is disposed and a part of the pad area. 
     
     
         16 . The organic light-emitting diode panel for the lighting device of  claim 8 , further comprising an encapsulation layer disposed on the adhesive layer. 
     
     
         17 . The organic light-emitting diode panel for the lighting device of  claim 8 , wherein the pad includes a first layer made of a same material as a material of the auxiliary wiring pattern and a second layer disposed on the first layer and made of a same material as a material of the first electrode.