Electrostatic devices to influence beams of charged particles

Abstract

An electrostatic device includes a top and a bottom silicon layer, around an insulating buried layer. A beam opening allows a beam of charged particles to travel through. The device is encapsulated in an insulating layer. One or more electrodes and ground planes are deposited on the insulating layer. These also cover the inside of the beam opening. Electrodes and ground planes are physically and electrically separated by micro-trenches and micro-undercuts that provide shadow areas when the conductive areas are deposited. Electrodes may be shaped as elongated islands and may include portions overhanging the top silicon layer, supported by electrode-anchors. Manufacturing starts from a single wafer including the top, buried, and bottom layers, or it starts from two separate silicon wafers. Manufacturing includes steps to form the top and bottom beam openings and microstructures, to encapsulate the device in an insulating layer, and to deposit electrodes and ground areas.

1 . An electrostatic device, comprising:
 a top silicon layer;   a bottom silicon layer;   a buried layer, including silicon dioxide, and disposed between the top silicon layer and the bottom silicon layer;   a top beam opening through the top silicon layer;   a bottom beam opening through the bottom silicon layer;   an insulating layer encapsulating the top silicon layer and the bottom silicon layer;   a first electrode, including a first top conductive layer outside the insulating layer around a first part of the top silicon layer; and   a ground structure, including a second top conductive layer outside the insulating layer around a second part of the top silicon layer;   wherein:   the top beam opening and the bottom beam opening are concentrically aligned;   the first electrode is physically separated from the ground structure by a top micro-trench in the top silicon layer and electrically separated from the ground structure by a first micro-undercut near and/or in the insulating layer; and   the first electrode covers at least a part of the top beam opening.   
     
     
         2 . The electrostatic device of  claim 1 , further comprising:
 a bottom conductive layer around parts of the insulating layer that encapsulate the bottom silicon layer.   
     
     
         3 . The electrostatic device of  claim 2 , wherein:
 the bottom conductive layer is physically and electrically separated from the first electrode by a second micro-undercut.   
     
     
         4 . The electrostatic device of  claim 2 , wherein:
 the first electrode is recessed from the ground structure.   
     
     
         5 . The electrostatic device of  claim 1 , further comprising:
 one or more additional electrodes, wherein one of the one or more additional electrodes:   includes a third top conductive layer outside the insulating layer around a third part of the top silicon layer, wherein:   covers at least a part of the top beam opening; and   is physically separated from the ground structure by a top micro-trench in the top silicon layer and electrically separated from the ground structure by a micro-undercut near and/or in the insulating layer.   
     
     
         6 . The electrostatic device of  claim 1 , wherein:
 the first electrode has a shape of an elongated island with the top beam opening on one end and an electrical contact pad on another end near an edge of the electrostatic device.   
     
     
         7 . The electrostatic device of  claim 6 , wherein:
 the elongated island includes an overhanging portion suspended between supporting anchors.   
     
     
         8 . The electrostatic device of  claim 1 , wherein:
 a diameter of the top beam opening is smaller than a diameter of the bottom beam opening and the first electrode overhangs the bottom beam opening.   
     
     
         9 . The electrostatic device of  claim 1 , wherein:
 the bottom beam opening is surrounded by a bottom micro-fence and a bottom micro-trench, wherein the bottom micro-fence is located under an overhanging part of the top silicon layer and physically and electrically separated from the top silicon layer by a micro-undercut.   
     
     
         10 . The electrostatic device of  claim 9 , wherein:
 the bottom micro-fence is supported by overhanging micro-bridges connected to the bottom silicon layer.   
     
     
         11 . A method of manufacturing an electrostatic device, comprising:
 starting with a wafer including a top silicon layer, a bottom silicon layer, and a buried insulating layer disposed between the top silicon layer and the bottom silicon layer;   forming a top beam opening and one or more micro-trenches and/or micro-undercuts in the top silicon layer;   forming a bottom beam opening and one or more micro-trenches, micro-fences, micro-bridges, and/or micro-undercuts in the bottom silicon layer;   encapsulating surfaces with an insulating layer; and   depositing conductive layers on exposed surfaces.   
     
     
         12 . The method of  claim 11 , wherein:
 the buried insulating layer includes thermally grown silicon dioxide.   
     
     
         13 . The method of  claim 11 , wherein:
 forming a micro-trench includes etching with deep reactive ion etching (DRIE) process using a patterned masking layer including at least one of photoresist, silicon dioxide, aluminum, or deposited polymer.   
     
     
         14 . The method of  claim 11 , wherein:
 forming a micro-undercut includes time-controlled silicon etching and/or time-controlled silicon dioxide etching.   
     
     
         15 . The method of  claim 11 , wherein:
 encapsulating surfaces with the insulating layer includes thermally growing a silicon dioxide layer.   
     
     
         16 . The method of  claim 11 , wherein:
 encapsulating surfaces with the insulating layer includes depositing an atomic layer of aluminum oxide.   
     
     
         17 . The method of  claim 11 , wherein:
 depositing conductive layers on exposed surfaces includes using a shadow masking effect provided by a micro-trench and a micro-undercut.   
     
     
         18 . The method of  claim 11 , wherein:
 depositing conductive layers on exposed surfaces includes using a sputtering process.   
     
     
         19 . The method of  claim 11 , further comprising:
 using etching to separate a chip.   
     
     
         20 . A method of manufacturing an electrostatic device, comprising:
 forming a silicon recess in a first silicon wafer;   thermally growing silicon dioxide on a second silicon wafer;   bonding the first silicon wafer onto the second silicon wafer to form a top silicon layer, a bottom silicon layer, and a buried layer disposed between the top silicon layer and the bottom silicon layer;   forming a top beam opening and a first micro-trench in the top silicon layer;   forming a bottom beam opening and a second micro-trench in the bottom silicon layer;   singulating the first silicon wafer and the second silicon wafer to obtain a chip;   thermally oxidating the chip to encapsulate silicon surfaces with an insulating layer; and   depositing conductive layers on exposed surfaces.   
     
     
         21 . The method of manufacturing an electrostatic device of  claim 20 , wherein singulating comprises:
 using etching to separate a chip.