Method of fitting fastener to object

Abstract

A method of fitting a fastener to an object is introduced. The fastener has a weldable surface and an engaging portion or a hole portion. One end of the hole portion or one end of the engaging portion has a holding portion. During a welding heating process, solder flows into or enters the holding portion and then cools down and solidifies therein so as to be held therein. Therefore, the weldable surface and the holding portion together enable the fastener to be firmly coupled to an object. The engaging portion and the hole portion together enable an object to be coupled to or removed from another object, so as to couple together and separate at least two objects repeatedly and quickly.

What is claimed is: 
     
         1 . A method of fitting a fastener to an object, the fastener having a weldable surface and an engaging portion or a hole portion, the method comprising the steps of:
 providing a tool for gripping the fastener;   moving the fastener to a predetermined height above a fitting position of the object with the tool; and   causing the tool to release or loosen its grip on the fastener, thereby positioning the fastener at the fitting position of the object.   
     
     
         2 . The method of  claim 1 , wherein an end of the hole portion or an end of the engaging portion has a holding portion, such that liquid-state solder flows into or enters the holding portion during a welding heating process, thereby allowing the liquid-state solder in the holding portion to cool and solidify. 
     
     
         3 . The method of  claim 2 , wherein the fastener is adapted to be welded to a first object, and the first object has a corresponding weldable surface, wherein solder between the weldable surface and the corresponding weldable surface turns into liquid state when heated up, such that the liquid-state solder flows into the holding portion, thereby allowing the liquid-state solder in the holding portion to cool and solidify, a solder layer or weldable layer, intended to be heated and then cooled to solidify, is disposed between the weldable surface of the fastener and the corresponding weldable surface of the first object. 
     
     
         4 . The method of  claim 2 , wherein the holding portion, where the liquid-state solder flows into, solidifies and thus is held, prevents the solder which turns into liquid state when heated up from flowing into the hole portion or the engaging portion and then cooling and solidifying, such that the solidified solder is unlikely to fall off, because it is impossible for interference or impacts to happen when a second object engages with or enters the hole portion or the engaging portion. 
     
     
         5 . The method of  claim 1 , wherein the fastener has a joining portion with a weldable surface, and the joining portion is adapted to be welded to a first object, the joining portion is adapted to be welded to a penetrating hole of the first object from inside, to a penetrating hole of the first object from outside, or to a flat surface at an end of the first object. 
     
     
         6 . The method of  claim 1 , wherein the fastener has a joining portion, and a solder layer, intended to be heated and then cooled to solidify, is disposed between the joining portion and a penetrating hole of the object or between the fastener and the object. 
     
     
         7 . The method of  claim 1 , wherein, having an interposer, the fastener is taken out with a tool through the interposer and then positioned on a first object to undergo welding.