Smartcards with multiple coupling frames

Abstract

RFID devices comprising (i) a transponder chip module (TCM, 1410) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.

1 . A method for manufacturing an RFID device, comprising:
 sintering a plurality of substantially conductive particles to form a coupling frame, wherein the coupling frame includes a first face, a second face opposite the first face, and a slit extending from the first face to the second face, and extending from an outer edge of the coupling frame to an inner position of the coupling frame, wherein the coupling frame further includes at least one recess in at least one of the first face or the second face; and   filling, at least partially, at least one of the at least one recess or the slit with a substantially non-conductive material.   
     
     
         2 . The method of  claim 1 , further comprising binding the plurality of substantially conductive particles in a second substantially non-conductive material. 
     
     
         3 . The method of  claim 2 , wherein the second substantially non-conductive material comprises a polymer resin. 
     
     
         4 . The method of  claim 2 , further comprising laminating the second substantially non-conductive material to a substrate. 
     
     
         5 . The method of  claim 4 , wherein the substrate comprises a second coupling frame. 
     
     
         6 . The method of  claim 1 , wherein said filling at least partially at least one of the at least one recess or the slit comprises filling at least partially the at least one recess. 
     
     
         7 . The method of  claim 1 , wherein said filling at least partially at least one of the at least one recess or the slit comprises filling at least partially the slit. 
     
     
         8 . The method of  claim 1 , wherein the substantially non-conductive material comprises at least one of ceramic, plastic, glass, or wood. 
     
     
         9 . The method of  claim 8 , wherein the substantially non-conductive material comprises ceramic. 
     
     
         10 . The method of  claim 1 , wherein the plurality of substantially conductive particles comprise a diameter between 20 and 500 μm. 
     
     
         11 . The method of  claim 1 , further comprising forming an insert comprising the substantially non-conductive material prior to said filling, at least partially, the at least one recess with the substantially non-conductive material. 
     
     
         12 . The method of  claim 1 , wherein the substantially non-conductive material conceals the slit. 
     
     
         13 . The method of  claim 1 , wherein said filling, at least partially, the at least one recess with the substantially non-conductive material comprises implanting the substantially non-conductive material in the at least one recess. 
     
     
         14 . The method of  claim 1 , wherein said filling, at least partially, the at least one recess with the substantially non-conductive material comprises laminating the substantially non-conductive material in the at least one recess with the coupling frame. 
     
     
         15 . A radio-frequency identification device (RFID) device, comprising:
 a coupling frame comprising sintered, substantially conductive particles, wherein the coupling frame includes a first face, a second face opposite the first face, and a slit extending from the first face to the second face, and extending from an outer edge of the coupling frame to an inner position of the coupling frame, wherein the coupling frame further includes at least one recess in at least one of the first face or the second face; and   at least one substantially non-conductive material at least partially filling at least one of the at least one recess or the slit.   
     
     
         16 . The RFID device of  claim 15 , wherein the coupling frame further comprises a polymer resin. 
     
     
         17 . The RFID device of  claim 15 , further comprising a substrate, wherein the polymer resin is laminated to the substrate. 
     
     
         18 . The RFID device of  claim 15 , wherein the at least one substantially non-conductive material at least partially fills the at least one recess. 
     
     
         19 . The RFID device of  claim 15 , wherein the at least one substantially non-conductive material at least partially fills the slit.