Thermoelectric Air Conditioning System with Integrated Solid Desiccant-Based Dehumidification for Separate Sensible and Latent Cooling

Abstract

A novel cooling system is disclosed. It includes one or more thermoelectric (TE) modules, each TE module having at least one semiconductor element located between two ceramic plates. The ceramic plates also include one or more electrodes. The cooling system further includes one or more heat exchangers, where the heat exchangers are in contact with at least one ceramic plate. In addition, the system includes one or more solid desiccant-based dehumidification compartments. Further, the cooling system is configured to direct air over both the TE modules and the desiccant dehumidifier.

What is claimed is: 
     
         1 . A cooling system, comprising:
 a. one or more thermoelectric (TE) modules, each TE module comprising at least one semiconductor element located between two ceramic plates; wherein the ceramic plates further comprise one or more electrodes;   b. one or more heat exchangers; wherein the heat exchangers are in contact with at least one ceramic plate; and   c. one or more desiccant wheels, wherein the wheels are capable of rotating;   wherein the cooling system is configured to direct air over both the TE modules and the desiccant wheels.   
     
     
         2 . The cooling system of  claim 1  wherein the ceramic plates comprise a material selected from the group consisting of hexagonal boron nitride, aluminum oxide and combinations thereof. 
     
     
         3 . The cooling system of  claim 1  wherein the semiconductor element comprises a material selected from the group consisting of Bi 0.5 Sb 1.5 Te, Bi 2 Te 2.7 Se 0.3  and combinations thereof. 
     
     
         4 . The cooling system of  claim 1  wherein the at least one semiconductor element is bonded to at least one electrode. 
     
     
         5 . The cooling system of  claim 1  wherein the desiccant wheels comprise a material selected from the group consisting of micro-porous metal foam, micro-porous ceramic foam, and combinations thereof. 
     
     
         6 . The cooling system of  claim 1  wherein the desiccant wheels are coated in one or more solid desiccants selected from the group consisting of mesoporous silica particles, silica aerogels, zeolite, carbon-based materials, hygroscopic salts, and combinations thereof. 
     
     
         7 . A cooling system, comprising:
 a. one or more thermoelectric (TE) modules, each TE module comprising at least one semiconductor element located between two ceramic plates; wherein the ceramic plates further comprise one or more electrodes;   b. one or more heat exchangers; wherein the heat exchangers are in contact with at least one ceramic plate; and   c. one or more solid desiccant-coated heat exchangers (DCHX), wherein each DCHX comprises one or more substrates selected from the group consisting of micro-porous metal foam, micro-porous ceramic foam, metal plate fins with millimeter spacing, and combinations thereof;   wherein the cooling system is configured to direct air over both the TE modules and the desiccant-coated substrates.   
     
     
         8 . The cooling system of  claim 7  wherein the ceramic plates comprise a material selected from the group consisting of hexagonal boron nitride, aluminum oxide and combinations thereof. 
     
     
         9 . The cooling system of  claim 7  wherein the semiconductor element comprises a material selected from the group consisting of Bi 0.5 Sb 1.5 Te, Bi 2 Te 2.7 Se 0.3  and combinations thereof. 
     
     
         10 . The cooling system of  claim 7  wherein the at least one semiconductor element is bonded to at least one electrode. 
     
     
         11 . The cooling system of  claim 7  wherein the one or more substrates comprise metal foam. 
     
     
         12 . The cooling system of  claim 7  wherein the desiccant for the DCHX is selected from the group consisting of mesoporous silica particles, silica aerogels, zeolite, carbon-based materials, hygroscopic salts, and combinations thereof.