High performance modular die-cast enclosure system

Abstract

A modular die cast enclosure comprising a top section with a top mid-plane and a bottom section with a bottom mid-plane and an internal bottom cover. The bottom section having one or more of a first type of connectors. The top section having one or more of a second type of connectors on. The internal bottom cover having one or more of a third type of connectors. Wherein said first type of connectors couple with said second type of connectors when the top section is placed on the bottom section and allow to electrically connect said top and bottom sections via said third type of connectors.

What is claimed is: 
     
         1 . An enclosure system comprising:
 a bottom section including a bottom casing and a top section including a top casing, at least one of the top and bottom sections for housing one or more electronic devices installed therein; and   an internal cover comprised in one of the top and bottom sections;   wherein, when the top section is secured to the bottom section, said top casing mates with said bottom casing forming an enclosure for said one or more electronic devices.   
     
     
         2 . The enclosure system of  claim 1 , wherein said internal cover comprised in one of the top and bottom sections allows said one of the top and bottom sections to be used as a stand-alone module. 
     
     
         3 . The enclosure system of  claim 1 , wherein the internal cover comprises a plate made of one of sheet metal and a pressure molded material. 
     
     
         4 . The enclosure system of  claim 1 , wherein the internal cover is mounted to the one of the top and bottom sections via one of custom bosses and off-the-shelf standoffs. 
     
     
         5 . The enclosure system of  claim 1 , wherein the internal cover comprises material which is at least one of electrically conductive and thermally conductive. 
     
     
         6 . The enclosure system of  claim 1 , wherein the internal cover comprises material which is at least one of electrically non-conductive and thermally non-conductive. 
     
     
         7 . The enclosure system of  claim 1 , wherein the internal cover covers a substantial portion of an opening of the top or bottom casing of the one of the top and bottom sections in which the internal cover is comprised, an opening formed in the internal cover for allowing communication between the top and bottom sections. 
     
     
         8 . The enclosure system of  claim 1 , wherein the internal cover substantially covers an entire opening of the top or bottom casing of the one of the top and bottom sections in which the internal cover is comprised. 
     
     
         9 . The enclosure system of  claim 8 , wherein, when the top section is not secured to the bottom section, the internal cover provides for the one of the top and bottom sections in which it is comprised, protection from external entry of foreign objects. 
     
     
         10 . The enclosure system of  claim 8 , wherein, when the top section is secured to the bottom section, the internal cover provides a mounting surface for further connectors and other components. 
     
     
         11 . The enclosure system of  claim 8 , wherein, when the top section is secured to the bottom section, the internal cover provides RF/EMI shielding between the top and bottom sections. 
     
     
         12 . The enclosure system of  claim 8 , wherein, when the top section is secured to the bottom section, the internal cover provides thermal radiation. 
     
     
         13 . The enclosure system of  claim 1 , wherein the internal cover comprises connectors for enabling electrical communication with at least one of the one or more electronic devices. 
     
     
         14 . The enclosure system of  claim 1 , wherein at least one of the top section and the bottom section includes a mid-plane for coupling at least one of the one or more electronic devices. 
     
     
         15 . The enclosure system of  claim 14 , wherein the mid-plane is rigid. 
     
     
         16 . The enclosure system of  claim 15 , wherein the mid-plane comprises a mid-plane PCB including at least one connector for electrically coupling to the at least one of the one or more electronic devices. 
     
     
         17 . The enclosure system of  claim 1 , wherein said top section comprises a top mid-plane, and said bottom section comprises a bottom mid-plane, each of the top and bottom mid-planes including one or more connectors provided thereon, wherein said one or more electronic devices comprises a top device coupled to said top mid-plane in said top section and a bottom device coupled to said bottom mid-plane in said bottom section, wherein, when the top section is secured to the bottom section, said top and bottom mid-planes provide electrical connection between said top and bottom sections via the one or more connectors of the top and bottom mid-planes coupling to one or more connectors provided in the internal cover. 
     
     
         18 . The enclosure system of  claim 1 , further comprising:
 a second internal cover comprised in the other one of the top and bottom sections in which the internal cover is not comprised,   
       wherein said one or more electronic devices comprises a top device installed in said top section and a bottom device installed in said bottom section, 
       wherein, when the top section is secured to the bottom section, connectors provided on the internal cover couple with connectors provided on the second internal cover for providing electrical communication between said top and bottom devices. 
     
     
         19 . The enclosure system of  claim 18 , wherein the internal cover substantially covers an entire opening of the top or bottom casing of the one of the top and bottom sections in which the internal cover is comprised and wherein the second internal cover substantially covers an entire opening of the top or bottom casing of the other one of the top and bottom sections in which the second internal cover is comprised. 
     
     
         20 . The enclosure system of  claim 18 , wherein said internal cover is comprised in the bottom section and said second internal cover is comprised in the top section, wherein said top section comprises a top mid-plane, and said bottom section comprises a bottom mid-plane, each of the top and bottom mid-planes including connectors provided thereon, wherein the top device is coupled to said top mid-plane in said top section and the bottom device coupled to said bottom mid-plane in said bottom section, and
 wherein, when the top section is secured to the bottom section, said top and bottom mid-planes provide electrical connection between said top and bottom devices via the connectors of the top and bottom mid-planes coupling to the connectors provided in the internal cover and the second internal cover.