US2023133556A1PendingUtilityA1

Benzoxazines and compositions containing the same

81
Assignee: CYTEC IND INCPriority: Dec 29, 2014Filed: Dec 22, 2022Published: May 4, 2023
Est. expiryDec 29, 2034(~8.5 yrs left)· nominal 20-yr term from priority
C08J 2361/34C08G 14/06C08J 5/24C08J 5/04C08G 73/0233B29C 39/003C08L 61/34C08G 73/02C08J 2379/02B29C 43/003B32B 27/04C07D 265/14B29C 43/00C08K 5/357C08L 2203/16C07D 265/16C08J 5/18B29C 45/0005C08L 2205/025
81
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A curable composition containing more than 80% by weight of a blend of benzoxazines, wherein the blend includes (A) one or more multifunctional benzoxazines and (B) a liquid, non-halogenated monofunctional benzoxazine. This composition has been found to be stable at high temperatures, e.g. 180° C.-250° C., and suitable for making composite materials using conventional techniques such as prepregging and liquid resin infusion.

Claims

exact text as granted — not AI-modified
1 . A curable composition comprising more than 80% by mass of a benzoxazine blend, said benzoxazine blend comprising:
 (A) a non-halogenated, benzoxazine compound in liquid form at temperature range of 20° C.-30° C. and the following Structure 1   
       
         
           
           
               
               
           
         
       
       and
 (B) a multifunctional benzoxazine component comprising at least one trifunctional benzoxazine compound selected from: 
 
       
         
           
           
               
               
           
         
       
     
     
         2 . The curable composition of  claim 1 , wherein the mass ratio of (A) to (B) is from about 50:50 to about 10:90. 
     
     
         3 . The curable composition of  claim 1 , wherein the composition exhibits an uncured T g  of room temperature (20° C.-30° C.) or lower as measured by Differential Scanning Calorimetry (DSC). 
     
     
         4 . The curable composition of  claim 1 , wherein the composition has viscosity of 5 Pa·s or less at processing temperature in the range of 100° C.-150° C. 
     
     
         5 . (canceled) 
     
     
         6 . (canceled) 
     
     
         7 . The curable composition of  claim 1 , wherein the multifunctional benzoxazine component (B) further comprises a difunctional benzoxazine compound, and wherein the at least one tri-functional benzoxazine compound is present in an amount of no more than 25% by weight based on the total weight of the benzoxazine blend. 
     
     
         8 . The curable composition of  claim 7 , wherein the difunctional benzoxazine compound is selected from: 
       
         
           
           
               
               
           
         
       
     
     
         9 . (canceled) 
     
     
         10 . (canceled) 
     
     
         11 . The curable composition of  claim 1 , wherein the curable composition is void of or contains less than 5% by weight, based on the total weight of the composition, of any thermosettable resin selected from epoxy, cyanate ester, bismaleimide, and phenol-formaldehyde. 
     
     
         12 . The curable composition of  claim 1 , wherein the curable composition is void of any organic solvent. 
     
     
         13 . The curable composition of  claim 1 , wherein the curable composition is thermally stable at a temperature in the range of about 180° C. to about 250° C. 
     
     
         14 . A continuous resin film formed from the curable composition of  claim 1 . 
     
     
         15 . A composite material comprising reinforcement fibers impregnated or infused with the curable composition of  claim 1 . 
     
     
         16 . The composite material of  claim 15 , wherein the reinforcement fibers are selected from carbon fibers, glass fibers, and aramid fibers. 
     
     
         17 . The composite material of  claim 1 , wherein the reinforcement fibers are in the form of unidirectional fibers, a fabric, or a preform comprised of an assembly of fibers or fabric plies. 
     
     
         18 - 22 . (canceled)

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.