Method for producing a floorboard
Abstract
A method for producing a floorboard having a topside veneer includes forming a multilayer body which includes a starting carrier plate, a plurality of veneers placed on the starting carrier plate so that a gap is formed between neighboring ones of the veneers, a resin layer including a resin provided between the starting carrier plate and the veneers, and a balancing layer arranged on a bottom side of the starting carrier plate; joining the starting carrier plate, the resin layer, the veneers and the balancing layer by pressing the multilayer body in a press; separating the multilayer body into individual boards between the neighboring veneers in a region of the gap; profiling the individual boards at side borders of the boards; and providing the individual boards with joining means.
Claims
exact text as granted — not AI-modified1 - 14 . (canceled)
15 . A multilayer body comprising:
a substrate; a topside veneer; a cured thermosetting resin between the substrate and the topside veneer; and a balancing layer arranged on a bottom side of the substrate, wherein the multilayer body comprises at least one cured thermosetting resin side border, wherein the at least one thermosetting resin side border is formed by curing thermosetting resin adhering to at least one outer side surface of the topside veneer.
16 . The multilayer body according to claim 15 , wherein the topside veneer is a plurality of veneers.
17 . The multilayer body according claim 16 , wherein the plurality of veneers comprises neighboring veneers, wherein the neighboring veneers are positioned spaced apart relative to each other on the substrate such that there is a gap between two neighboring veneers.
18 . The multilayer body according to claim 17 , wherein the gap is filled with the cured thermosetting resin.
19 . The multilayer body according to claim 15 , wherein the cured thermosetting resin is permeated into the topside veneer.
20 . The multilayer body according to claim 19 , wherein the cured thermosetting resin is visible at a surface of the topside veneer facing away from the substrater.
21 . The multilayer body according to claim 15 , wherein the thickness of the topside veneer is smaller than 2.5 mm.
22 . The multilayer body according to claim 15 , wherein the substrate is made of a wood material.
23 . The multilayer body according to claim 15 , wherein the substrate is made of solid wood, chipboard, wood fiber material, MDF (Medium Density Fiber Board) or HDF (High Density Fiber Board).
24 . The multilayer body according to claim 15 , wherein the cured thermosetting resin comprises a filler.
25 . The multilayer body according to claim 15 , further comprising a second cured thermosetting resin between the substrate and the balancing layer.
26 . The multilayer body according to claim 16 , wherein the multilayer body is a building panel or is configured to be divided into building panels.
27 . The multilayer body according to claim 16 , wherein the multilayer body is configured to be divided into floorboards.
28 . The multilayer body according to claim 15 , wherein the multilayer body comprises a plurality of thermosetting resin side borders formed by curing thermosetting resin adhering to a plurality of outer side surfaces of the topside veneer.
29 . The multilayer body according to claim 15 , wherein the multilayer body is rectangular with four thermosetting resin side borders.
30 . A floorboard comprising:
a substrate; a topside veneer; a cured thermosetting resin between the substrate and the topside veneer; and a balancing layer arranged on a bottom side of the substrate, wherein the floorboard comprises at least one thermosetting resin side border, wherein the at least one thermosetting resin side border is formed by curing a thermosetting resin adhering to at least one outer side surface of the topside veneer.
31 . The floorboard according to claim 30 , wherein the floorboard comprises connecting means on side borders.
32 . The floorboard according to claim 31 , wherein the connecting means are formed in the thermosetting resin side border.
33 . The floorboard according to claim 30 , wherein the substrate is made of a wood material.
34 . The floorboard according to claim 30 , wherein the substrate is made of solid wood, chipboard, wood fiber material, MDF (Medium Density Fiber Board) or HDF (High Density Fiber Board).Join the waitlist — get patent alerts
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