Device for supporting and fastening heating pipes of a heating system placed in subfloors, walls or ceilings of buildings

Abstract

The invention relates to a device for supporting and fastening heating pipes of a heating system placed in subfloors, walls or ceilings of a building. The device comprises: a laminar body having a first face and an opposite second face, a plurality of fastening elements made in one piece on the first face of the laminar body and configured to fasten said heating pipes on the first face. The invention is characterized in that both the laminar body and the fastening elements of the device are in a mixture comprising at least one thermoplastic polymer and thermally conductive inorganic fillers.

1 . A heating system placed in subfloors, walls or ceilings of a building comprising:
 a device for supporting and fastening heating pipes;   one or more heating pipes fastened to said device, wherein said device comprises:   a laminar body having a first face and an opposite second face,   a plurality of reliefs or bosses spaced apart equally from one another on the first face of the laminar body, protruding from the first face of the laminar body and configured to fasten said heating pipes on the first face,   wherein both the laminar body and the reliefs or bosses of the device are made of a mixture comprising:   at least one thermoplastic polymer, and   thermally conductive inorganic fillers consisting of graphite or ceramics; and   wherein a concentration of the thermally conductive inorganic fillers in the mixture is selected from the group consisting of:   30% by weight of the total mixture, and   50% by weight of the total mixture.   
     
     
         2 . The heating system according to  claim 1 , wherein each relief or boss of the device for supporting and fastening heating pipes has a section, with a plane parallel to a base surface plane of the laminar body, which is square in shape with rounded corners. 
     
     
         3 . The heating system according to  claim 1 , wherein the ceramics of the mixture are selected from the group consisting of:
 Magnesia (MgO) having thermal conductivity of 37.7 W/mK;   Zirconia (ZrO 2 ) having thermal conductivity of 2.9 W/mK;   Alumina (Al 2 O 3 ) having thermal conductivity of 35-39 W/mK;   Mullite (3Al 2 O 3 -2SiO 2 ) having thermal conductivity of 6.1 W/mK;   Silicon carbide (SiC) having thermal conductivity from 71 to 490 W/mK;   Silica glass (SiO 2 ) having thermal conductivity of 1.4 W/mK;   Silicon nitride (Si 3 N 4 ) having thermal conductivity of 10-33 W/mK;   Aluminum nitride (AlN) having thermal conductivity of 50-170 W/mK.   
     
     
         4 . The heating system according to  claim 1 , wherein the graphite of the mixture has a thermal conductivity between 50 and 100 W/mK. 
     
     
         5 . The heating system according to  claim 1 , wherein said at least one thermoplastic polymer is selected from the group consisting of:
 polypropylene (PP);   low-density polyethylene (LDPE) or high-density polyethylene (HDPE);   polyphenylene sulfide (PPS);   polyamide (PA);   thermoplastic polyurethane (TPU).   
     
     
         6 . The heating system according to  claim 1 , wherein said mixture further comprises one or more conductive materials selected from the group consisting of: metal powders, conductive pastes, metal wires. 
     
     
         7 . The heating system according to  claim 1 , wherein said system is an electric heating system and said one or more heating pipes are electric heating wires. 
     
     
         8 . The heating system according to  claim 1 , wherein said system is a heating system of hydropic type and said one or more heating pipes are coil piping in which heated water flows. 
     
     
         9 . The heating system according to  claim 1 , wherein said mixture comprising at least one thermoplastic polymer, and thermally conductive inorganic fillers has a thermal conductivity between 2 and 10 W/mK. 
     
     
         10 . An insulation panel for the installation of floor or wall heating systems, comprising:
 a layer in a thermally insulating material including a first surface and an opposite second surface;   a device for supporting and fastening heating pipes to the panel, said device being glued to one of said first and second surfaces of the insulating layer,   wherein said device comprises:   a laminar body having a first face and an opposite second face,   a plurality of reliefs or bosses spaced apart equally from one another on the first face of the laminar body, protruding from the first face of the laminar body and configured to fasten said heating pipes on the first face,   wherein both the laminar body and the reliefs or bosses of the device are made of a mixture comprising:   at least one thermoplastic polymer, and   thermally conductive inorganic fillers consisting of graphite or ceramics; and   wherein a concentration of the thermally conductive inorganic fillers in the mixture is selected from the group consisting of:   30% by weight of the total mixture, and   50% by weight of the total mixture.   
     
     
         11 . The insulation panel according to  claim 10 , wherein the layer in a thermally insulating material comprises polyurethane foam. 
     
     
         12 . The insulation panel according to  claim 10 , wherein the ceramics of the mixture are selected from the group consisting of:
 Magnesia (MgO) having thermal conductivity of 37.7 W/mK;   Zirconia (ZrO 2 ) having thermal conductivity of 2.9 W/mK;   Alumina (Al 2 O 3 ) having thermal conductivity of 35-39 W/mK;   Mullite (3Al 2 O 3 -2SiO 2 ) having thermal conductivity of 6.1 W/mK;   Silicon carbide (SiC) having thermal conductivity from 71 to 490 W/mK;   Silica glass (SiO 2 ) having thermal conductivity of 1.4 W/mK;   Silicon nitride (Si 3 N 4 ) having thermal conductivity of 10-33 W/mK;   Aluminum nitride (AlN) having thermal conductivity of 50-170 W/mK.   
     
     
         13 . The insulation panel according to  claim 10 , wherein the graphite of the mixture has a thermal conductivity between 50 and 100 W/mK. 
     
     
         14 . The insulation panel according to  claim 10 , wherein said at least one thermoplastic polymer is selected from the group consisting of:
 polypropylene (PP);   low-density polyethylene (LDPE) or high-density polyethylene (HDPE);   polyphenylene sulfide (PPS);   polyamide (PA);   thermoplastic polyurethane (TPU).   
     
     
         15 . The insulation panel according to  claim 10 , wherein said mixture further comprises one or more conductive materials selected from the group consisting of: metal powders, conductive pastes, metal wires. 
     
     
         16 . The insulation panel according to  claim 10 , wherein said mixture comprising at least one thermoplastic polymer, and thermally conductive inorganic fillers has a thermal conductivity between 2 and 10 W/mK. 
     
     
         17 . A device for supporting and fastening heating pipes of a heating system placed in subfloors, walls or ceilings of a building, said device comprising:
 a laminar body having a first face and an opposite second face,   a plurality of reliefs or bosses spaced apart equally from one another on the first face of the laminar body, protruding from the first face of the laminar body and configured to fasten said heating pipes on the first face,   wherein both the laminar body and the reliefs or bosses of the device are made of a mixture comprising:   at least one thermoplastic polymer, and   thermally conductive inorganic fillers consisting of graphite or ceramics; and   wherein a concentration of the thermally conductive inorganic fillers in the mixture is selected from the group consisting of:   30% by weight of the total mixture, and   50% by weight of the total mixture.   
     
     
         18 . The device for supporting and fastening heating pipes according to  claim 17 , wherein the ceramics of the mixture are selected from the group consisting of:
 Magnesia (MgO) having thermal conductivity of 37.7 W/mK;   Zirconia (ZrO 2 ) having thermal conductivity of 2.9 W/mK;   Alumina (Al 2 O 3 ) having thermal conductivity of 35-39 W/mK;   Mullite (3Al 2 O 3 -2SiO 2 ) having thermal conductivity of 6.1 W/mK;   Silicon carbide (SiC) having thermal conductivity from 71 to 490 W/mK;   Silica glass (SiO 2 ) having thermal conductivity of 1.4 W/mK;   Silicon nitride (Si 3 N 4 ) having thermal conductivity of 10-33 W/mK;   Aluminum nitride (AlN) having thermal conductivity of 50-170 W/mK.   
     
     
         19 . The device for supporting and fastening heating pipes according to  claim 17 , wherein the graphite of the mixture has a thermal conductivity between 50 and 100 W/mK. 
     
     
         20 . The device for supporting and fastening heating pipes according to  claim 17 , wherein said at least one thermoplastic polymer is selected from the group consisting of:
 polypropylene (PP);   low-density polyethylene (LDPE) or high-density polyethylene (HDPE);   polyphenylene sulfide (PPS);   polyamide (PA);   thermoplastic polyurethane (TPU).   
     
     
         21 . The device for supporting and fastening heating pipes according to  claim 17 , wherein said mixture comprising at least one thermoplastic polymer, and thermally conductive inorganic fillers has a thermal conductivity between 2 and 10 W/mK.