Information carrying card comprising a cross-linked polymer composition, and method of making the same

Abstract

The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. An information carrying card includes a body defining a first cavity and a second cavity. The first cavity has a first area and the second cavity has a second area. The first cavity is continuous with the second cavity and the second area is less than the first area. A circuit element is disposed within the first cavity.

What is claimed is: 
     
         1 . A method of forming a credential card, comprising:
 positioning a first thermoplastic layer in a stacked arrangement with a first release sheet;   applying a cross-linkable polymer composition to the first thermoplastic layer;   positioning an inlay layer in a stacked arrangement with the first thermoplastic layer and the first release sheet, wherein the inlay layer is in direct contact with the first thermoplastic layer and the cross-linkable polymer composition, and wherein the inlay layer defines at least one cavity;   positioning a first circuit element within the at least one cavity defined by the inlay layer;   positioning a second release sheet in a stacked arrangement with the first thermoplastic layer, first release sheet, and inlay layer to form a layered structure;   applying a predetermined pressure to the layered structure; and   heating the layered structure to a temperature sufficient to at least partially cure the cross-linkable polymer composition to form a credential core.   
     
     
         2 . The method of  claim 1 , wherein the inlay layer comprises metal. 
     
     
         3 . The method of  claim 1 , wherein the first circuit element comprises a printed circuit board having at least one electronic component formed on a supporting film. 
     
     
         4 . The method of  claim 1 , wherein the first circuit element comprises an antenna. 
     
     
         5 . The method of  claim 1 , comprising:
 positioning a second thermoplastic layer on a first side of the credential core;   positioning a third thermoplastic layer on a second side of the credential core, wherein the second thermoplastic layer, the credential core, and the third thermoplastic layer form a card stack;   laminating the card stack under a predetermined pressure at a predetermined temperature to form a credential card.   
     
     
         6 . The method of  claim 5 , wherein at least one of the second thermoplastic layer and the third thermoplastic layer comprises a printable thermoplastic layer, a transparent thermoplastic layer, or both a printable and transparent thermoplastic layer. 
     
     
         7 . The method of  claim 1 , wherein the first thermoplastic layer comprises a polyvinyl chloride (PVC) material. 
     
     
         8 . A credential card core, comprising:
 a first thermoplastic layer;   a cross-linkable polymer composition disposed on at least a portion of the first thermoplastic layer;   an inlay layer positioned in a stacked arrangement with the first thermoplastic layer, wherein the inlay layer is in direct contact with the first thermoplastic layer and the cross-linkable polymer composition, and wherein the inlay layer defines at least one cavity; and   a first circuit element positioned within the at least one cavity defined by the inlay layer.   
     
     
         9 . The credential card of  claim 8 , wherein the inlay layer comprises metal. 
     
     
         10 . The credential card of  claim 8  wherein the first circuit element comprises a printed circuit board having at least one electronic component formed on a supporting film. 
     
     
         11 . The credential card of  claim 8 , wherein the first circuit element comprises an antenna. 
     
     
         12 . The credential card of  claim 8 , comprising:
 positioning a second thermoplastic layer on a first side of the credential core;   positioning a third thermoplastic layer on a second side of the credential core, wherein the second thermoplastic layer, the credential core, and the third thermoplastic layer form a card stack;   laminating the card stack under a predetermined pressure at a predetermined temperature to form a credential card.   
     
     
         13 . The credential card of  claim 12 , wherein at least one of the second thermoplastic layer and the third thermoplastic layer comprises a printable thermoplastic layer, a transparent thermoplastic layer, or both a printable and transparent thermoplastic layer. 
     
     
         14 . The credential card of  claim 8 , wherein the first thermoplastic layer comprises a polyvinyl chloride (PVC) material. 
     
     
         15 . A method of forming a credential card, comprising:
 positioning a first thermoplastic layer in a stacked arrangement with a first release sheet;   applying a cross-linkable polymer composition to the first thermoplastic layer;   positioning an inlay layer in a stacked arrangement with the first thermoplastic layer and the first release sheet, wherein the inlay layer is in direct contact with the first thermoplastic layer and the cross-linkable polymer composition, and wherein the inlay layer defines at least one cavity;   positioning a first circuit element within the at least one cavity defined by the inlay layer;   positioning a second release sheet in a stacked arrangement with the first thermoplastic layer, first release sheet, and inlay layer to form a layered structure;   applying a predetermined pressure to the layered structure;   heating the layered structure to a temperature sufficient to at least partially cure the cross-linkable polymer composition to form a credential core; and   laminating, subsequent to heating the layered structure, a card stack under a predetermined pressure at a predetermined temperature to form a credential card, wherein the card stack comprises the credential core and at least one additional thermoplastic layer.   
     
     
         16 . The method of  claim 15 , wherein the inlay layer comprises metal. 
     
     
         17 . The method of  claim 15 , wherein the first circuit element comprises a printed circuit board having at least one electronic component formed on a supporting film. 
     
     
         18 . The method of  claim 15 , wherein the first circuit element comprises an antenna. 
     
     
         19 . The method of  claim 15 , wherein the at least one additional thermoplastic layer of the card stack comprises a printable thermoplastic layer, a transparent thermoplastic layer, or both a printable and transparent thermoplastic layer. 
     
     
         20 . The method of  claim 15 , wherein the first thermoplastic layer comprises a polyvinyl chloride (PVC) material.