Double-sided package structure and manufacturing method thereof

Abstract

A manufacturing method of a double-sided package structure includes securing at least two discrete double-sided mount structures to a first side of a master at intervals; molding the first side of the master to form a molded body encasing the at least two discrete double-sided mount structures; removing the master; and splitting the molded body to obtain individual double-sided package structures.

What is claimed is: 
     
         1 . A manufacturing method of a double-sided package structure, comprising:
 securing at least two discrete double-sided mount structures to a first side of a master at intervals;   molding the first side of the master to form a molded body encasing the at least two discrete double-sided mount structures;   removing the master; and   splitting the molded body to obtain individual double-sided package structures.   
     
     
         2 . The manufacturing method according to  claim 1 , wherein securing the at least two discrete double-sided mount structures to the first side of the master at intervals comprises:
 soldering, onto pads of the master, electrical connection structures in the at least two discrete double-sided mount structures.   
     
     
         3 . The manufacturing method according to  claim 2 , after removing the master, the method further comprising:
 thinning and removing the molded body on one side of the master to expose the electrical connection structures.   
     
     
         4 . The manufacturing method according to  claim 3 , after thinning and removing the molded body on the one side of the master to expose the electrical connection structures, the method further comprising:
 embedding a solder ball in the exposed electrical connection structures; and   reflowing the solder ball to fuse the solder ball and the electrical connection structures into an external solder ball.   
     
     
         5 . The manufacturing method according to  claim 1 , wherein securing the at least two discrete double-sided mount structures to the first side of the master at intervals comprises:
 partially sinking, into a temporary adhesive layer of the master, electrical connection structures in the at least two discrete double-sided mount structures.   
     
     
         6 . The manufacturing method according to  claim 5 , wherein the temporary adhesive layer comprises at least one of a pyrolysis adhesive tape, a photolysis adhesive tape or a chemical etching adhesive tape. 
     
     
         7 . The manufacturing method according to  claim 5 , wherein removing the master comprises:
 removing the temporary adhesive layer to separate the master from the molded body.   
     
     
         8 . The manufacturing method according to  claim 1 , before securing the at least two discrete double-sided mount structures to the first side of the master at intervals, further comprising:
 mounting components onto a first face of a substrate;   mounting components onto a second face of the substrate, wherein the first face is opposite to the second face; and   splitting the substrate whose two faces are mounted with the components to form individual double-sided mount structures.   
     
     
         9 . The manufacturing method according to  claim 1 , wherein splitting the molded body to obtain the individual double-sided package structures comprises:
 splitting the molded body by cutting the molded body to obtain the individual double-sided package structures,   wherein a cutting line has a width greater than a width of a gap between adjacent ones of the at least two double-sided mount structures.   
     
     
         10 . A double-sided package structure manufactured by a manufacturing method, wherein the manufacturing method of the double-sided package structure comprises:
 securing at least two discrete double-sided mount structures to a first side of a master at intervals;   molding the first side of the master to form a molded body encasing the at least two discrete double-sided mount structures;   removing the master; and   splitting the molded body to obtain individual double-sided package structures;   wherein the double-sided package structure comprises a double-sided mount structure and a molded body encasing the double-sided mount structure, wherein   the double-sided mount structure comprises a substrate and components mounted onto two opposite surfaces of the substrate.   
     
     
         11 . The double-sided package structure manufactured by the manufacturing method according to  claim 10 , wherein securing the at least two discrete double-sided mount structures to the first side of the master at intervals comprises:
 soldering, onto pads of the master, electrical connection structures in the at least two discrete double-sided mount structures.   
     
     
         12 . The double-sided package structure manufactured by the manufacturing method according to  claim 11 , after removing the master, the method further comprising:
 thinning and removing the molded body on one side of the master to expose the electrical connection structures.   
     
     
         13 . The double-sided package structure manufactured by the manufacturing method according to  claim 12 , after thinning and removing the molded body on the one side of the master to expose the electrical connection structures, the method further comprising:
 embedding a solder ball in the exposed electrical connection structures; and   reflowing the solder ball to fuse the solder ball and the electrical connection structures into an external solder ball.   
     
     
         14 . The double-sided package structure manufactured by the manufacturing method according to  claim 10 , wherein securing the at least two discrete double-sided mount structures to the first side of the master at intervals comprises:
 partially sinking, into a temporary adhesive layer of the master, electrical connection structures in the at least two discrete double-sided mount structures.   
     
     
         15 . The double-sided package structure manufactured by the manufacturing method according to  claim 14 , wherein the temporary adhesive layer comprises at least one of a pyrolysis adhesive tape, a photolysis adhesive tape or a chemical etching adhesive tape. 
     
     
         16 . The double-sided package structure manufactured by the manufacturing method according to  claim 14 , wherein removing the master comprises:
 removing the temporary adhesive layer to separate the master from the molded body.   
     
     
         17 . The double-sided package structure manufactured by the manufacturing method according to  claim 10 , before securing the at least two discrete double-sided mount structures to the first side of the master at intervals, further comprising:
 mounting components onto a first face of a substrate;   mounting components onto a second face of the substrate, wherein the first face is opposite to the second face; and   splitting the substrate whose two faces are mounted with the components to form individual double-sided mount structures.   
     
     
         18 . The double-sided package structure manufactured by the manufacturing method according to  claim 10 , wherein splitting the molded body to obtain the individual double-sided package structures comprises:
 splitting the molded body by cutting the molded body to obtain the individual double-sided package structures,   wherein a cutting line has a width greater than a width of a gap between adjacent ones of the at least two double-sided mount structures.