Systems and methods of modulating flow during vapor jet deposition of organic materials

Abstract

Embodiments of the disclosed subject matter provide methods and systems including a nozzle, a source of material to be deposited on a substrate in fluid communication with the nozzle, a delivery gas source in fluid communication with the source of material to be deposited with the nozzle, an exhaust channel disposed adjacent to the nozzle, a confinement gas source in fluid communication with the nozzle and the exhaust channel, and disposed adjacent to the exhaust channel, and an actuator to adjust a fly height separation between a deposition nozzle aperture of the nozzle and a deposition target. The adjustment of the fly height separation may stop and/or start the deposition of the material from the nozzle.

We claim: 
     
         1 . A system comprising:
 a nozzle;   a source of material to be deposited on a substrate in fluid communication with the nozzle;   a delivery gas source in fluid communication with the source of material to be deposited with the nozzle;   an exhaust channel disposed adjacent to the nozzle;   a confinement gas source in fluid communication with the nozzle and the exhaust channel, and disposed adjacent to the exhaust channel; and   a nozzle block having a plurality of nozzles, with one or more exhaust channels located on the nozzle block that are not adjacent to a nozzle of the plurality of nozzles.   
     
     
         2 . The system of  claim 1 , further comprising:
 one or more confinement gas sources in fluid communication with one or more of the exhaust channels located on the nozzle block that are not adjacent to the nozzle of the plurality of nozzles.   
     
     
         3 . The system of  claim 1 , wherein the nozzle block comprises a linear array of nozzles and exhaust channels not adjacent to nozzles of the plurality of nozzles that are positioned at each end of the array. 
     
     
         4 . The system of  claim 1 , wherein the nozzle in fluid communication with the source deposits a feature with the material, and
 wherein the material is organic light emitting diode (OLED) material.   
     
     
         5 . The system of  claim 4 , wherein the nozzle is controlled to deposit the feature according to at least one of the group selected from: a chamber pressure, an exhaust pressure, an exhaust flow, and a delivery flow. 
     
     
         6 . The system of  claim 4 , wherein the deposited feature is selected from the group consisting of: lines, pixels, and patterns. 
     
     
         7 . The system of  claim 4 , wherein the feature is less than or equal to 1000 µm. 
     
     
         8 . The system of  claim 4 , wherein the feature is less than 50 µm full width at half maximum (FWHM). 
     
     
         9 . The system of  claim 4 , further comprising:
 a controller to control at least one of the nozzles of the plurality of nozzles of the nozzle block.   
     
     
         10 . A display fabricated using a nozzle, a source of material to be deposited on a substrate in fluid communication with the nozzle, a carrier gas source in fluid communication with the source of material to be deposited and with the nozzle, an exhaust vent disposed adjacent to the nozzle, a confinement gas source disposed adjacent to the exhaust vent, and an actuator to adjust a fly height separation between a deposition nozzle aperture of the nozzle and a deposition target. 
     
     
         11 . The display of  claim 10 , wherein the adjustment of the fly height separation starts or stops the deposition of the material from the nozzle. 
     
     
         12 . The display of  claim 11 , wherein the adjustment of the fly height is such that the delivery gas flow is less than or equal to an exhaust flow from the exhaust channel. 
     
     
         13 . The display of  claim 10 , wherein the display is fabricated using a displacement sensor to control the fly height over a deposition target that is moving in a plane parallel to the deposition nozzle aperture. 
     
     
         14 . The display of  claim 10 , wherein the nozzle in fluid communication with the source deposits a feature with the material, and wherein the material is organic light emitting diode (OLED) material. 
     
     
         15 . The display of  claim 14 , wherein the nozzle is controlled to deposit the feature according to at least one of the group selected from: a chamber pressure, an exhaust pressure, an exhaust flow, a delivery flow, and fly height. 
     
     
         16 . The display of  claim 14 , wherein the deposited feature is selected from the group consisting of: lines, pixels, and patterns. 
     
     
         17 . The display of  claim 14 , wherein the feature is less than or equal to 1000 µm. 
     
     
         18 . The display of  claim 14 , wherein the feature is less than 50 µm full width at half maximum (FWHM). 
     
     
         19 . The display of  claim 10 , wherein the display is fabricated using a nozzle block having a plurality of nozzles. 
     
     
         20 . The display of  claim 19 , wherein the display is fabricated using a controller to control at least one of the nozzles of the plurality of nozzles of the nozzle block.