Four dimensional energy-field package assembly

Abstract

Four dimensional (4D) energy-field package assembly for projecting energy fields according to a 4D coordinate function. The 4D energy-field package assembly includes an energy-source system having energy sources capable of providing energy to energy locations, and energy waveguides for directing energy from the energy locations from one side of the energy waveguide to another side of the energy waveguide along energy propagation paths.

1 .- 45 . (canceled) 
     
     
         46 . An energy-field package assembly comprising:
 a plurality of modular energy-field packages wherein each modular energy-field package comprises;
 an energy-source system configured to provide energy to a plurality of energy locations; and 
 at least one energy waveguide wherein each energy waveguide is configured to direct energy from the plurality of energy locations from a first side of the energy waveguide to a second side of the energy waveguide; 
 wherein at least one energy propagation path of at least one modular energy-field package and at least one energy propagation path of at least one other modular energy field package converge at a location on the first side of the at least one energy waveguide of the at least one modular energy-field package; and 
   a mount to which the plurality of modular energy-field packages are attached assembled to form an energy-projection surface such that the plurality of modular energy-field packages are operable to direct energy according to respective independent energy propagation functions that together operate as a collection of energy propagation functions for the assembled energy projection surface.   
     
     
         47 . The energy-field package assembly of  claim 46 , wherein at least one of the plurality of modular energy-field packages is integrated onto a chip. 
     
     
         48 . The energy-field package assembly of  claim 47 , wherein the chip of the at least one of the plurality of modular energy-field packages comprises a silicon chip. 
     
     
         49 . The energy-field package assembly of  claim 46 , wherein at least one modular energy-field package further comprises a border surrounding the at least one energy waveguide of the at least one modular energy-field package. 
     
     
         50 . The energy-field package assembly of  claim 49 , wherein the border of the at least one modular energy-field package surrounds each energy waveguide of the at least one modular energy-field package. 
     
     
         51 . The energy-field package assembly of  claim 49 , wherein the at least one border comprises a black region. 
     
     
         52 . The energy-field package assembly of  claim 49 , wherein the border is configured to separate the at least one energy waveguide of the plurality of modular energy-field packages when attached to the mount. 
     
     
         53 . The energy-field package assembly of  claim 52 , wherein the distance between the at least one energy waveguide of the plurality of modular energy-field packages prevents seams in the energy field. 
     
     
         54 . The energy-field package assembly of  claim 46  wherein the plurality of energy-field packages are attached to the mount to form a grid of modular energy field-packages wherein each modular energy-field package attached to the mount further comprises a border that evenly separates all of the at least one energy waveguide of the plurality of energy-field packages attached to the mount. 
     
     
         55 . The energy-field package assembly of  claim 54 , wherein the border of each modular energy-field package attached to the mount evenly separates each energy waveguide of the at least one energy waveguide of each modular energy-field package attached to the mount. 
     
     
         56 . The energy-field package assembly of  claim 46 , wherein at least one additional energy propagation path of the at least one modular energy-field package and at least one other additional energy propagation path of the at least one other energy-field package converge at a location on the second side of the at least one energy waveguide of the at least one modular energy-field package. 
     
     
         57 . The energy-field package assembly of  claim 46 , further comprising at least one second mount to which the plurality of modular energy-field packages are attached to form at least one second energy-projection surface. 
     
     
         58 . The energy-field package assembly of  claim 46 , wherein the mount comprises a printed circuit board. 
     
     
         59 . The energy-field package assembly of  claim 46 , wherein energy directed along the pluralities of energy propagation paths of the plurality of modular energy-field packages is electromagnetic energy defined by a wavelength, the wavelength belonging to a regime selected from a group consisting of:
 a. visible light;   b. ultraviolet;   c. infrared; or   d. x-ray.   
     
     
         60 . The energy-field package assembly of  claim 46 , wherein energy directed along the pluralities of energy propagation paths of the plurality of modular energy-field packages is mechanical energy defined by pressure waves, the waves selected from a group consisting of:
 a) tactile pressure waves;   b) acoustic sound vibrations; or   c) ultrasound waves.   
     
     
         61 . The energy-field package assembly of claim  1 , wherein each energy waveguide of the at least one energy waveguide of at least one modular energy-field package comprises a structure for attenuating or modifying at least one energy propagation path of each energy waveguide, the structure selected from a group consisting of:
 a) an energy blocking structure;   b) an element configured to alter the at least one energy propagation path of each energy waveguide to alter a fill factor of an aperture of each energy waveguide; or   c) a structure configured to limit an angular extent of energy proximate an energy location of each modular energy-field package.