Laser-releasable bonding materials for 3-d ic applications

Abstract

Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

We claim: 
     
         1 . A polymer comprising recurring monomers of 
       
         
           
           
               
               
           
         
         where each of R 1  to R 4 :
 can be the same or different; and 
 is individually selected from the group consisting of hydrogen, alkyls, alkoxys, hydroxyls, and polyethylene glycol chains. 
 
       
     
     
         2 . The polymer of  claim 1 , wherein each R is hydrogen. 
     
     
         3 . The polymer of  claim 1 , wherein said polymer has a weight average molecular weight of from about 1,000 Daltons to about 100,000 Daltons.