Shielding Tape With Features For Mitigating Micro-Fractures And The Effects Thereof

Abstract

In an electronic cable embodiment, a shielding tape includes a first metallic layer having a first orientation along which micro-fractures are predisposed to form, and a second metallic layer having a second orientation along which micro-fractures are predisposed to form. The first and second orientations have a non-zero transverse relation with respect to each other. An adhesive is disposed between the first and second metallic layers. Metallic solids are dispersed throughout the adhesive so as to define the adhesive with electrically conductive material characteristics.

The invention claimed is: 
     
         1 . Shielding tape in an electronic cable, the shielding tape comprising:
 a first metallic layer having a first orientation along which micro-fractures are predisposed to form;   a second metallic layer having a second orientation along which micro-fractures are predisposed to form;   the first and second orientations have a non-zero transverse relation with respect to each other;   an adhesive disposed between the first and second metallic layers; and   metallic solids dispersed throughout the adhesive so as to define the adhesive with electrically conductive material characteristics.   
     
     
         2 . The shielding tape of  claim 1 , wherein the first and second orientations in the first and second metallic layers are formed by burnishing the first and second metallic layers. 
     
     
         3 . The shielding tape of  claim 1 , wherein the first and second metallic layers are coaxial to each other. 
     
     
         4 . The shielding tape of  claim 1 , wherein the adhesive is an elastomeric adhesive. 
     
     
         5 . The shielding tape of  claim 1 , wherein the metallic solids are homogenously dispersed throughout the adhesive. 
     
     
         6 . The shielding tape of  claim 1 , wherein the metallic solids have a density in the adhesive sufficient to mitigate transmission of very high frequency RF signals through the adhesive. 
     
     
         7 . Shielding tape in an electronic cable, the shielding tape comprising:
 a first layer;   a second layer;   an adhesive disposed between the first and second layers; and   metallic solids dispersed throughout the adhesive so as to define the adhesive with electrically conductive material characteristics.   
     
     
         8 . The shielding tape of  claim 7 , wherein the adhesive is an elastomeric adhesive. 
     
     
         9 . The shielding tape of  claim 7 , wherein:
 The first layer has a first orientation along which micro-fractures are predisposed to form;   the second layer has a second orientation along which micro-fractures are predisposed to form; and   the first and second orientations have a non-zero transverse relation with respect to each other.   
     
     
         10 . The shielding tape of  claim 9 , wherein the first and second orientations in the first and second metallic layers are formed by burnishing the first and second metallic layers. 
     
     
         11 . The shielding tape of  claim 7 , wherein the first and second metallic layers are coaxial to each other. 
     
     
         12 . The shielding tape of  claim 7 , wherein the metallic solids are homogenously dispersed throughout the adhesive. 
     
     
         13 . An electronic cable comprising:
 a conductor;   an insulator surrounding the conductor;   shielding tape wrapped around the insulator, the shielding tape having overlapping edges forming an overlap gap therebetween;   an adhesive disposed in the overlap gap; and   metallic solids dispersed throughout the adhesive so as to define the adhesive with electrically conductive material characteristics.   
     
     
         14 . The electronic cable of  claim 13 , wherein the adhesive is an elastomeric adhesive. 
     
     
         15 . The electronic cable of  claim 13 , wherein the conductor, the insulator, and the shielding tape are all coaxial. 
     
     
         16 . The electronic cable of  claim 13 , wherein the shielding tape comprises:
 a first metallic layer having a first orientation along which micro-fractures are predisposed to form;   a second metallic layer having a second orientation along which micro-fractures are predisposed to form; and   the first and second orientations have a non-zero transverse relation with respect to each other.   
     
     
         17 . The electronic cable of  claim 16 , wherein the first and second orientations in the first and second metallic layers are formed by burnishing the first and second metallic layers.