US2023212387A1PendingUtilityA1

Low-refractive-index thermosetting composition, optical member formed therefrom, and display device

Assignee: DONGJIN SEMICHEM CO LTDPriority: Sep 28, 2020Filed: Mar 7, 2023Published: Jul 6, 2023
Est. expirySep 28, 2040(~14.2 yrs left)· nominal 20-yr term from priority
C08L 2203/20C08K 7/26C08K 3/011C08L 2203/16C08L 63/00C08K 7/18C08K 3/36C08K 5/5415C08F 283/10C08F 220/32C08K 9/04C08G 59/32C08K 2201/011
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Claims

Abstract

The present disclosure relates to a thermosetting composition, an optical member formed therefrom, and a display device, the composition comprising a thermosetting resin, gas-containing particles and a monomer or an oligomer having two or more thermosetting functional groups, thereby having optical effects such as a low refractive index of 1.40 or less on light with a wavelength of 450 nm, high light transmittance, and low haze.

Claims

exact text as granted — not AI-modified
1 . A thermosetting composition comprising:
 a thermosetting resin;   gas-containing particles; and   a monomer or oligomer having a thermosetting functional group, wherein the monomer or oligomer has two or more thermosetting functional groups.   
     
     
         2 . The thermosetting composition of  claim 1 , wherein the thermosetting resin comprises at least one of an epoxy group, an oxetane group, or a hydroxyl group (OH). 
     
     
         3 . The thermosetting composition of  claim 1 , wherein the thermosetting resin has a weight-average molecular weight in a range of 1,000 to 200,000. 
     
     
         4 . The thermosetting composition of  claim 1 , wherein the gas-containing particles are comprised in an amount of 30 to 80% by weight based on the total weight of the thermosetting composition. 
     
     
         5 . The thermosetting composition of  claim 1 , wherein the gas-containing particles are comprised in an amount of 50 to 80% by weight based on the total weight of the thermosetting composition. 
     
     
         6 . The thermosetting composition of  claim 1 , wherein the gas-containing particles are porogen or hollow silica. 
     
     
         7 . The thermosetting composition of  claim 1 , wherein the gas-containing particles are surface-treated with at least one functional group selected from the group consisting of an alkyl group, an acryl group, a methacrylic group, an epoxy group, and a vinyl group. 
     
     
         8 . The thermosetting composition of  claim 1 , wherein the gas-containing particles are surface-treated to have a thickness in a range of 3 to 50 nm. 
     
     
         9 . The thermosetting composition of  claim 1 , wherein the gas-containing particles have a D50 particle diameter in a range of 30 to 150 nm. 
     
     
         10 . The thermosetting composition of  claim 1 , wherein the monomer or oligomer having the thermosetting functional group comprises an alicyclic epoxy structure. 
     
     
         11 . The thermosetting composition of  claim 1 , wherein the monomer or oligomer having a thermosetting functional group comprises a compound having a chemical structure selected from the group consisting of Formulae 1 to 24: 
       
         
           
           
               
               
           
         
         
           
           
               
               
           
         
         
           
           
               
               
           
         
         wherein, in Chemical Formula 4 and Chemical Formula 6, R each independently represents a hydrocarbon group having 1 to 10 carbon atoms, R in Chemical Formula 6 is one of alkyl, alkenyl, and alkoxy groups, and in Chemical Formulae 2 to 4, Chemical Formulae 11 and 23, Chemical Formulae 20 to 21, l, m, n, and o are each independently an integer of 1 to 30. 
       
     
     
         12 . The thermosetting composition of  claim 1 , comprising:
 1% to 69% by weight of the thermosetting resin;   30% to 80 parts by weight of the gas-containing particles; and   1% to 60% by weight of the monomer or oligomer having the thermosetting functional group.   
     
     
         13 . The thermosetting composition of  claim 1 , wherein the total weight of the thermosetting resin and the monomer or oligomer having a thermosetting functional group is in a range of 20% to 70% by weight based on the total weight of the composition. 
     
     
         14 . The thermosetting composition of  claim 1 , further comprising at least one additive selected from the group consisting of a silane coupling agent, an adhesive having, as a crosslinking site, an alkoxy group, and a surfactant. 
     
     
         15 . The thermosetting composition of  claim 1 , further comprising at least one dispersant selected from the group consisting of an acrylic dispersant, an epoxy dispersant, and a silicone dispersant. 
     
     
         16 . The thermosetting composition of  claim 1 , further comprising at least one crosslinking accelerator selected from the group consisting of a thermal acid generator and a thermal base generator. 
     
     
         17 . The thermosetting composition of  claim 1 , wherein the thermosetting composition comprises one or more solvents selected from the group consisting of diethyleneglycoldimethyl ether, diethyleneglycolmethylethyl ether, propyleneglycolmethylether acetate, propyleneglycolethylether acetate, propyleneglycolpropylether acetate, propyleneglycolmethylether propionate, propyleneglycolethylether propionate, propyleneglycolpropylether propionate, propyleneglycolmethyl ether, propyleneglycolethyl ether, propyleneglycolpropyl ether, propyleneglycolbutyl ether, dipropyleneglycoldimethyl ether, dipropyleneglycoldiethyl ether, butyleneglycolmonomethyl ether, butyleneglycolmonoethyl ether, dibutyleneglycoldimethyl ether, dibutyleneglycoldiethyl ether, diethyleneglycolbutylmethyl ether, diethyleneglycolbutylethyl ether, triethyleneglycoldimethyl ether, triethyleneglycolbutylmethyl ether, diethyleneglycoltertiarybutyl ether, tetraethyleneglycoldimethyl ether, diethyleneglycolethylhexyl ether, diethyleneglycolmethylhexyl ether, dipropyleneglycolbutylmethyl ether, dipropyleneglycolethylhexyl ether, and dipropyleneglycolmethylhexyl ether. 
     
     
         18 . The thermosetting composition of  claim 1 , wherein the thermosetting composition is a solvent-free thermosetting composition containing no solvents. 
     
     
         19 . The thermosetting composition of  claim 1 , wherein the thermosetting composition has a viscosity in a range of 3 to 30 cP. 
     
     
         20 . An optical member comprising:
 a substrate; and   a cured film comprising the thermosetting composition of  claim 1 .   
     
     
         21 . The optical member of  claim 20 , wherein the cured film has a haze percentage of 3% or less for the light of 450 nm wavelength. 
     
     
         22 . A display device comprising the optical member of  claim 20 .

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