Method of manufacturing a winding capacitor package structure

Abstract

A method of manufacturing a winding capacitor package structure is provided. The method of manufacturing the winding capacitor package structure includes: forming a base layer on an inner bottom surface of a casing structure; placing a winding assembly and a part of a conductive assembly inside an accommodating space of the casing structure; sequentially forming a plurality of filling layers between the winding assembly and the casing structure; and then placing a bottom carrier frame on a bottom portion of the casing structure so as to match with the casing structure. The casing structure includes a main casing for enclosing the base layer and the filling layer and a retaining body inwardly bent from a bottom side of the main casing, and the base layer and the filling layer are retained and limited inside the casing structure by the retaining body.

What is claimed is: 
     
         1 . A method of manufacturing a winding capacitor package structure, comprising:
 forming a base layer on an inner bottom surface of a casing structure;   placing a winding assembly and a part of a conductive assembly inside an accommodating space of the casing structure, wherein the winding assembly is disposed on the base layer;   sequentially forming a plurality of filling layers between the winding assembly and the casing structure; and   placing a bottom carrier frame on a bottom portion of the casing structure so as to match with the casing structure;   wherein the casing structure includes a main casing for enclosing the base layer and the filling layer and a retaining body inwardly bent from a bottom side of the main casing, and the base layer and the filling layer are retained and limited inside the casing structure by the retaining body.   
     
     
         2 . The method according to  claim 1 , wherein the step of forming the base layer on the inner bottom surface of the casing structure further comprises:
 filling an initial substrate material on the inner bottom surface of the casing structure;   evacuating air from the accommodating space of the casing structure to form a vacuum accommodating space; and   curing the initial substrate material in order to form the base layer;   wherein the casing structure includes a rough inner surface, and the base layer is limited inside the casing structure through a friction provided by the rough inner surface of the casing structure.   
     
     
         3 . The method according to  claim 1 , wherein the step of forming each of the filling layers between the winding assembly and the casing structure further comprises:
 filling an initial filling material between the winding assembly and the casing structure;   evacuating air from the accommodating space of the casing structure to form a vacuum accommodating space; and   curing the initial filling material in order to form the filling layer;   wherein the casing structure includes a rough inner surface, and the filling layer is limited inside the casing structure through a friction provided by the rough inner surface of the casing structure.   
     
     
         4 . The method according to  claim 1 , wherein the conductive assembly includes a first conductive pin and a second conductive pin, and both the first conductive pin and the second conductive pin are separate from the filling layers. 
     
     
         5 . The method according to  claim 1 , wherein the retaining body is a single body disposed around the filling layer. 
     
     
         6 . The method according to  claim 1 , wherein an enclosed moisture barrier layer contacts an entire outer surface of the winding assembly. 
     
     
         7 . The method according to  claim 1 , wherein a viscosity coefficient of the base layer is different from or equals to a viscosity coefficient of the filling layer. 
     
     
         8 . The method according to  claim 1 , wherein a heat conductivity coefficient of the base layer is different from or equals to a heat conductivity coefficient of the filling layer. 
     
     
         9 . The method according to  claim 1 , wherein the winding assembly is completely enclosed by an enclosed moisture barrier layer. 
     
     
         10 . The method according to  claim 9 , wherein the conductive assembly includes a first conductive pin and a second conductive pin, and a first junction between the winding assembly and the first conductive pin and a second junction between the winding assembly and the second conductive pin are covered by the enclosed moisture barrier layer. 
     
     
         11 . The method according to  claim 1 , wherein the bottom carrier frame tightly is connected to an outermost one of the filling layers. 
     
     
         12 . The method according to  claim 1 , wherein the casing structure includes a rough inner surface, and the filling layer is limited inside the casing structure through a friction provided by the rough inner surface of the casing structure.