Polishing pad, method for manufacturing polishing pad and polishing apparatus

Abstract

The present disclosure relates to a polishing pad including a polishing layer. The polishing layer defines a plurality of foaming pores, and a diameter of each of the foaming pores is 1 μm to 10 μm. The present disclosure also relates to a method for manufacturing a polishing pad and a polishing apparatus.

What is claimed is: 
     
         1 . A polishing pad, comprising:
 a polishing layer, defining a plurality of foaming pores, wherein a diameter of each of the foaming pores is in the range of 1 μm to 10 μm.   
     
     
         2 . The polishing pad of  claim 1 , wherein the foaming pores are continuous pores. 
     
     
         3 . The polishing pad of  claim 1 , wherein the polishing layer has a polishing surface, the foaming pores are exposed on the polishing surface, and a distribution density of the foaming pores on the polishing surface is in the range of 15,000/mm 2  to 20,000/mm 2 . 
     
     
         4 . The polishing pad of  claim 1 , wherein a material of the polishing layer includes polyurethane. 
     
     
         5 . The polishing pad of  claim 1 , further comprising a base layer, wherein the polishing layer is attached to the base layer, and the base layer is a nonwoven fabric or a polyethylene terephthalate film. 
     
     
         6 . A method for manufacturing the polishing pad of  claim 1 , comprising:
 (a) providing a base layer;   (b) forming a resin foam on the base layer, wherein the resin foam comprises a polishing layer and a nap layer, the polishing layer defines a plurality of foaming pores, and a diameter of each of the foaming pores is in the range of 1 μm to 10 μm; and   (c) removing the nap layer.   
     
     
         7 . The method of  claim 6 , wherein in (a), the base layer is a nonwoven fabric or a polyethylene terephthalate film. 
     
     
         8 . The method of  claim 6 , wherein (b) comprises forming the resin foam through a wet process. 
     
     
         9 . The method of  claim 8 , wherein in (b), a material of the resin foam includes polyurethane. 
     
     
         10 . The method of  claim 6 , wherein in (b), the foaming pores are continuous pores. 
     
     
         11 . The method of  claim 6 , wherein (c) comprises removing one-tenth to one-half of a thickness of the resin foam. 
     
     
         12 . The method of  claim 6 , wherein before (c), the method further comprises:
 (c0) removing the base layer.   
     
     
         13 . A polishing apparatus comprising:
 a polishing plate;   a substrate;   the polishing pad of  claim 1 , which is adhered on the polishing plate for polishing the substrate; and   a slurry contacting the substrate for polishing.   
     
     
         14 . The polishing apparatus of  claim 13 , wherein the foaming pores of the polishing layer of the polishing pad are continuous pores. 
     
     
         15 . The polishing apparatus of  claim 13 , wherein the polishing layer of the polishing pad has a polishing surface, the foaming pores are exposed on the polishing surface, and a distribution density of the foaming pores on the polishing surface is in the range of 15,000/mm 2  to 20,000/mm 2 . 
     
     
         16 . The polishing apparatus of  claim 13 , wherein a material of the polishing layer of the polishing pad includes polyurethane. 
     
     
         17 . The polishing apparatus of  claim 13 , wherein the polishing pad further comprises a base layer, the polishing layer of the polishing pad is attached to the base layer, and the base layer is a nonwoven fabric or a polyethylene terephthalate film.