Thermal Optimizations for OSFP Optical Transceiver Modules

Abstract

Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

1 . An assembly comprising:
 an octal small form factor pluggable (OSFP) module comprising a data connector;   a first heatsink having a top surface and an opposed bottom surface facing toward the OSFP module;   
       a first plurality of hollow channels formed between the OSFP module and the bottom surface; 
       a second heatsink having a surface overlying the top surface of the first heatsink and thermally connected with the top surface; and 
       a plurality of fins extending away from the surface of the second heatsink.