Electrically Functional Circuit Board Core Material

Abstract

An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor.

1 - 58 . (canceled) 
     
     
         59 . A method of making a circuit board core material by:
 providing a laminate comprising prepreg and at least one clad layer one side of said prepreg;   forming a pocket in said prepreg;   inserting an electronic component in said prepreg wherein said electronic component comprises a first external termination and a second external termination;   curing said prepreg to form prepreg with said electronic component in said prepreg;   forming a first electrical connection by laminating said first external termination to said first clad layer; and   forming a second electrical connection to said second external termination.   
     
     
         60 . The method of making a circuit board of  claim 59  wherein said laminate further comprises a second clad layer and said forming said second electrical connection includes laminating said second external termination to said second clad layer 
     
     
         61 . The method of making a circuit board of  claim 59  further laminating at least one printed circuit board to said circuit board core material. 
     
     
         62 . The method of making a circuit board of  claim 61  further comprising forming at least one via in said printed circuit board. 
     
     
         63 . The method of making a circuit board of  claim 59  further comprising at least one electronic component on said circuit board. 
     
     
         64 . The method of making a circuit board of  claim 63  wherein said electronic component is selected from the group consisting of capacitor, resistor, silicon die, diode, inductive material and magnetic device. 
     
     
         65 . The method of making a circuit board of  claim 64  wherein said capacitor is selected from a foil capacitor, a pressed powder capacitor and a ceramic capacitor. 
     
     
         66 . The method of making a circuit board of  claim 64  wherein said capacitor comprises a porous valve metal layer. 
     
     
         67 . The method of making a circuit board of  claim 66  wherein said capacitor comprises a dielectric on said porous valve metal layer. 
     
     
         68 . The method of making a circuit board of  claim 66  wherein said valve metal is selected from the group consisting of aluminum, tantalum, niobium and NbO. 
     
     
         69 . The method of making a circuit board of  claim 66  wherein said porous valve metal layer is a foil. 
     
     
         70 . The method of making a circuit board of  claim 66  wherein said capacitor comprises a capacitor core. 
     
     
         71 . The method of making a circuit board of  claim 59  wherein said first external termination is a counter electrode. 
     
     
         72 . The method of making a circuit board of  claim 71  further comprising a conductive paint on said counter electrode. 
     
     
         73 . The method of making a circuit board of  claim 72  wherein said conductive paint comprises at least one of a carbon filled resin or a metal filled resin. 
     
     
         74 . The method of making a circuit board of  claim 59  wherein said first clad layer comprises copper. 
     
     
         75 . The method of making a circuit board of  claim 59  further comprising a cathode isolation region. 
     
     
         76 . The method of making a circuit board of  claim 75  further wherein said cathode isolation region comprises an isolation material. 
     
     
         77 . The method of making a circuit board of  claim 59  further comprising an anode isolation region. 
     
     
         78 . The method of making a circuit board of  claim 77  further wherein said anode isolation region comprises an isolation material. 
     
     
         79 . The method of making a circuit board of  claim 59  further comprising a via pass through section. 
     
     
         80 . The method of making a circuit board of  claim 59  further comprising a conductive node. 
     
     
         81 . The method of making a circuit board of  claim 80  wherein said conductive node is an anode conductive node. 
     
     
         82 . The method of making a circuit board of  claim 59  comprising multiple electronic components. 
     
     
         83 . The method of making a circuit board of  claim 59  further comprising forming at least one clad bonding layer. 
     
     
         84 . The method of making a circuit board of  claim 59  further comprising forming at least one electrical connection layer between adjacent clad layer. 
     
     
         85 . The method of making a circuit board of  claim 59  further comprising forming a prepreg layer laminated on opposite side of electronic component from first clad layer. 
     
     
         86 . The method of making a circuit board of  claim 59  further comprising etching said first clad layer. 
     
     
         87 . The method of making a circuit board of  claim 59  wherein said circuit board core material is flexible.