Recharge/telemetry coil

Abstract

An implantable medical device (IMD) including an insulating frame defining a drop-in coil channel adjacent a perimeter of the insulating frame, a rechargeable power source configured to supply power for the implantable medical device, a secondary coil including a first and a second wire end, where the secondary coil is received within the drop-in coil channel and is configured to inductively couple with a primary coil of an external charging device to transcutaneously charge the rechargeable power source. The IMD also includes a circuit board attached to the insulating frame and a pair of electrical connectors each having a respective first arm that is electrically coupled to the respective first and second wire ends of the secondary coil and respective second arm that is electrically coupled to the circuit board.

1 - 10 . (canceled) 
     
     
         11 . A method of forming an implantable medical device comprising:
 mounting a secondary coil in a drop-in coil channel defined within a first side of an insulating frame, wherein the secondary coil is configured to electrically couple to a rechargeable power source of the implantable device and configured to inductively couple with a primary coil of an external charging device to transcutaneously charge the rechargeable power source;   electrically coupling a first and a second wire end of the secondary coil to respective first ends of a pair of electrical connectors; and   electrically coupling respective second ends of the electrical connectors to a circuit board of the implantable medical device.   
     
     
         12 . The method of  claim 11 , further comprising:
 wrapping an insulated wire on a mandrel, separate and distinct from the insulating frame, to form the secondary coil.   
     
     
         13 . The method of  claim 12 , further comprising heating or exposing the secondary coil to a solvent to bind an insulating layer of the wire together so the secondary coil defines a loop sized by the mandrel, wherein the loop is the same size as the drop-in coil channel. 
     
     
         14 . The method of  claim 11 , further comprising:
 positioning the electrical connectors within respective receiving channels defined in a second side of the insulating frame.   
     
     
         15 . The method of  claim 11 , further comprising:
 partially surrounding the insulating frame within a first and a second encapsulating sleeve; and   welding the first and second encapsulating sleeves along a seam, wherein the insulating frame defines a protective barrier positioned between the seam and the secondary coil.   
     
     
         16 . The method of  claim 15 , wherein the first and the second encapsulating sleeve comprise titanium. 
     
     
         17 - 20 . (canceled) 
     
     
         21 . A method of forming an implantable medical device comprising:
 causing a secondary coil to be mounted in a drop-in coil channel defined within a first side of an insulating frame, wherein the secondary coil is configured to electrically couple to a rechargeable power source of the implantable device and configured to inductively couple with a primary coil of an external charging device to transcutaneously charge the rechargeable power source;   causing a first and a second wire end of the secondary coil to be electrically coupled to respective first ends of a pair of electrical connectors; and   causing respective second ends of the electrical connectors to be coupled to a circuit board of the implantable medical device.   
     
     
         22 . The method of  claim 21 , further comprising:
 causing an insulated wire to be wrapped on a mandrel, separate and distinct from the insulating frame, to form the secondary coil.   
     
     
         23 . The method of  claim 22 , further comprising causing the secondary coil to be heated or exposed to a solvent to bind an insulating layer of the wire together so the secondary coil defines a loop sized by the mandrel, wherein the loop is the same size as the drop-in coil channel. 
     
     
         24 . The method of  claim 21 , further comprising:
 causing the electrical connectors to be positioned within respective receiving channels defined in a second side of the insulating frame.   
     
     
         25 . The method of  claim 21 , further comprising:
 causing the insulating frame to be partially surrounded within a first and a second encapsulating sleeve; and   causing the first and second encapsulating sleeves to be welded along a seam, wherein the insulating frame defines a protective barrier positioned between the seam and the secondary coil.   
     
     
         26 . The method of  claim 25 , wherein the first and the second encapsulating sleeve comprise titanium.