Thermoformable multilayer films and blister packs produced therefrom

Abstract

A multi-layer film structure for use in forming blister packaging. The multi-layer structure includes a first polymeric layer having a first surface and a second surface, the first polymeric layer comprising a metalized polyethylene teraphthalate, a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer disposed adjacent the second surface of the first polymeric layer, the second polymeric layer comprising a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer disposed adjacent the second surface of the second polymeric layer, the third polymeric layer comprising polypropylene or polyvinyl chloride. A method of making a multi-layer film structure and a packaging structure are also provided.

1 . (canceled) 
     
     
         2 . A method of making a multi-layer film structure, the method comprising:
 forming a first polymeric layer having a first surface and a second surface;   forming a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer positioned adjacent the second surface of the first polymeric layer;   forming a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer positioned adjacent the second surface of the second polymeric layer; and   forming a lid-stock film arranged between a flat film and the multi-layer film structure to provide support.   
     
     
         3 . The method of  claim 2 , wherein the first polymeric layer includes a metalized polyethylene teraphthalate. 
     
     
         4 . The method of  claim 2 , wherein the second polymeric layer includes a cyclic-olefin. 
     
     
         5 . The method of  claim 4 , wherein
 the cyclic-olefin includes a cyclo-olefin copolymer, and   the cyclo-olefin copolymer is a copolymer of norbornene and ethylene.   
     
     
         6 . The method of  claim 2 , wherein the third polymeric layer includes polypropylene or polyvinyl chloride. 
     
     
         7 . The method of  claim 2 , further comprising:
 thermoforming the multi-layer film structure so as to define a plurality of domed receptacle portions.   
     
     
         8 . The method of  claim 7 , further comprising:
 covering a plurality of cavities defined by the plurality of domed receptacle portions with the flat film, a flat surface of the flat film extending over each of the plurality of cavities, and the flat film including a metallic foil.   
     
     
         9 . The method of  claim 2 , wherein
 the forming the first polymeric layer includes extruding the first polymeric layer to form the first polymeric layer,   the forming the second polymeric layer includes extruding the second polymeric layer to form the second polymeric layer, and   the forming the third polymeric layer includes extruding the third polymeric layer to form the third polymeric layer.   
     
     
         10 . The method of  claim 2 , wherein the multi-layer film structure is coextruded. 
     
     
         11 . The method of  claim 2 , wherein the forming the first polymeric layer, the forming the second polymeric layer, and the forming the third polymeric layer forms the multi-layer film structure having a laminated construction. 
     
     
         12 . The method of  claim 2 , further comprising:
 positioning a first tie layer between the second surface of the first polymeric layer and the first surface of the second polymeric layer; and   positioning a second tie layer between the second surface of the second polymeric layer and the first surface of the third polymeric layer.   
     
     
         13 . The method of  claim 12 , wherein the first tie layer and the second tie layer each include an adhesive lacquer. 
     
     
         14 . The method of  claim 2 , further comprising:
 forming a metalized layer on the first polymeric layer.   
     
     
         15 . The method of  claim 14 , further comprising:
 forming the metalized layer on the first polymeric layer by vacuum deposition, indirect metallization, electro-less plating, electrolytic plating, lacquer painting, or any combination thereof.