Configurable heatsink

Abstract

Apparatuses, systems, and techniques to cool computing devices. In at least one embodiment, a system includes a heatsink including one or more connector pins to laterally couple the heatsink to one or more computing devices.

What is claimed is: 
     
         1 . A system comprising: a heatsink comprising one or more connector pins to laterally couple the heatsink to one or more computing devices. 
     
     
         2 . The system of  claim 1 , further comprising a flexible heat conduit to connect the heatsink to the one or more computing devices. 
     
     
         3 . The system of  claim 2 , wherein the flexible heat conduit comprises a loop siphon. 
     
     
         4 . The system of  claim 2 , further comprising the one or more computing devices connected to the heatsink via the flexible heat conduit. 
     
     
         5 . The system of  claim 1 , further comprising a support comprising one or more slots to laterally couple the heatsink to the one or more computing devices, each slot of the one or more slots to secure the heatsink to the support in a respective position of a plurality of positions via respective ones of the one or more connector pins of the heatsink. 
     
     
         6 . The system of  claim 1 , wherein a position of the heatsink is adjustable to at least one of: improve heat dissipation by the heatsink, or accommodate siting of the heatsink on a chassis. 
     
     
         7 . The system of  claim 1 , wherein a position of the heatsink is adjustable to improve utilization of airflow to a second heatsink. 
     
     
         8 . The system of  claim 1 , wherein a position of the heatsink is adjustable to improve velocity of airflow to a second heatsink. 
     
     
         9 . The system of  claim 1 , wherein a position of the heatsink is adjustable to improve temperature of airflow to a second heatsink. 
     
     
         10 . The system of  claim 1 , wherein a position of the heatsink is at least one of angularly adjustable, horizontally adjustable, or vertically adjustable, with respect a plane defined by a surface on which the one or more computing devices are mounted. 
     
     
         11 . A system comprising: a base of a heatsink assembly comprising a support having one or more slots, the one or more slots to secure a heatsink to the base in a position of a plurality of positions via one or more connector pins of the heatsink. 
     
     
         12 . The system of  claim 11 , further comprising the heatsink secured to the base via the one or more connector pins, wherein the base further comprises a flexible heat conduit to connect the heatsink to one or more computing devices. 
     
     
         13 . The system of  claim 12 , wherein the flexible heat conduit comprises a loop siphon. 
     
     
         14 . The system of  claim 12 , further comprising the one or more computing devices connected to the heatsink via the flexible heat conduit. 
     
     
         15 . The system of  claim 12 , wherein the base enables a position of the heatsink to be adjustable to at least one of:
 improve heat dissipation by the heatsink;   accommodate siting of the heatsink on a chassis;   improve utilization of airflow to a second heatsink;   improve velocity of the airflow to the second heatsink; or   improve temperature of the airflow to the second heatsink.   
     
     
         16 . The system of  claim 12 , wherein the base enables a position of the heatsink to be at least one of angularly adjustable, horizontally adjustable, or vertically adjustable, with respect a plane defined by a surface on which the one or more computing devices are mounted. 
     
     
         17 . A system comprising:
 a heatsink of a heatsink assembly, the heatsink comprising one or more connector pins; and   a base of the heatsink assembly comprising a support comprising one or more slots to laterally couple the heatsink to one or more computing devices, the one or more slots to secure the heatsink in a respective position of a plurality of positions via the one or more connector pins of the heatsink.   
     
     
         18 . The system of  claim 17 , further comprising:
 the one or more computing devices; and   a flexible heat conduit of the heatsink assembly the flexible heat conduit connecting the heatsink to the one or more computing devices, wherein the flexible heat conduit comprises a loop siphon.   
     
     
         19 . The system of  claim 17 , wherein the base enables a position of the heatsink to be adjustable to at least one of:
 improve heat dissipation by the heatsink;   accommodate siting of the heatsink on a chassis;   improve utilization of airflow to a second heatsink;   improve velocity of the airflow to the second heatsink; or   improve temperature of the airflow to the second heatsink.   
     
     
         20 . The system of  claim 17 , wherein the base enables a position of the heatsink to be at least one of angularly adjustable, horizontally adjustable, or vertically adjustable, with respect a plane defined by a surface on which the one or more computing devices are mounted.