US2023302567A1PendingUtilityA1

Ultrasonic additive manufacturing of cold plates with pre-formed fins

Assignee: RAYTHEON COPriority: Nov 12, 2020Filed: Jun 2, 2023Published: Sep 28, 2023
Est. expiryNov 12, 2040(~14.3 yrs left)· nominal 20-yr term from priority
B23K 20/103B23K 20/2333B23P 15/26F28F 3/025F28F 9/0224F28F 9/18B33Y 10/00B23K 20/10B23K 20/233B23K 20/2336B23K 2101/14B23K 2101/36B23K 2103/10B23K 2103/08B33Y 80/00
72
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A method for making a cold plate includes the steps of positioning a finstock structure in a cavity of a substrate; and applying a cover to the finstock structure and substrate, wherein the applying step comprises ultrasonically additive manufacturing the cover to the substrate and the finstock structure, whereby the cover joins with the substrate and the finstock structure. The resulting cold plate assembly includes a substrate having a cavity, a finstock structure within the cavity, and a cover closing the finstock structure within the cavity, the cover being integrally joined to the substrate and to the finstock structure.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 - 12 . (canceled) 
     
     
         13 . A cold plate assembly, comprising:
 a substrate having a cavity,   a finstock structure within the cavity, and   a cover closing the finstock structure within the cavity, the cover being integrally joined to the substrate and to the finstock structure.   
     
     
         14 . The assembly of  claim 13 , wherein the finstock structure comprises material formed into a plurality of substantially parallel walls connected by folds, and wherein the cover is joined to the finstock structure along the folds. 
     
     
         15 . The assembly of  claim 13 , wherein the substrate comprises an aluminum plate. 
     
     
         16 . The assembly of  claim 13 , wherein the cavity has a floor, and further comprising structure on the floor to hold the finstock in position relative to the floor. 
     
     
         17 . The assembly of  claim 13 , wherein the cover comprises multiple layers, and wherein a first layer joined to the substrate and the finstock structure has a softer temper than subsequent layers. 
     
     
         18 . The assembly of  claim 13 , wherein the finstock is in compression between the substrate and the cover. 
     
     
         19 . The assembly of  claim 16 , wherein the finstock structure is integrally joined to the floor. 
     
     
         20 . The assembly of  claim 13 , wherein the finstock structure comprises a material selected from the group consisting of aluminum, copper, stainless steel, titanium, and alloys and/or combinations thereof. 
     
     
         21 . The assembly of  claim 13 , wherein the substrate, finstock and cover each comprise compatible ultrasonic welding material.

Join the waitlist — get patent alerts

Track US2023302567A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.