Engineered wood adhesives and engineered wood therefrom
Abstract
According to various examples of the present disclosure, an engineered wood precursor mixture includes a plurality of wood substrates and a binder reaction mixture present in a range of from 3 parts to 25 parts per 100 parts of the dry weight of the plurality of wood substrates. The binder composition includes an aqueous portion. The aqueous portion includes a carbohydrate-containing component in a range of from 2 wt% to 85 wt% based on a dry weight of the binder reaction mixture. The carbohydrate-containing component includes glucose, fructose, or a mixture thereof. The combined wt% of glucose, fructose, or mixture thereof in the carbohydrate-containing component is at least 60 wt%. The aqueous portion further includes 0.1 wt% to 10 wt% sodium trimetaphosphate based on a dry weight of the binder reaction mixture.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An engineered wood precursor mixture comprising:
a plurality of wood substrates; a binder reaction mixture present in a range of from 3 parts to 25 parts per 100 parts of the dry weight of the plurality of wood substrates, the binder composition comprising:
an aqueous portion comprising:
a carbohydrate-containing component in a range of from 2 wt% to 85 wt% based on a dry weight of the binder reaction mixture, the carbohydrate-containing component comprising glucose, fructose, or a mixture thereof, and the combined wt% of glucose, fructose, or mixture thereof in the carbohydrate-containing component is at least 60 wt%;
a base is present at 1 wt% to 33 wt% of a base based on a dry weight of the binder reaction mixture; and
0.1 wt% to 10 wt% sodium trimetaphosphate based on a dry weight of the binder reaction mixture; and
an at least partially non-dissolved polypeptide-containing component comprising soy flour, in a range of from 20 wt% to 85 wt% based on the dry weight of the binder reaction mixture.
2 . The engineered wood precursor mixture of claim 1 , wherein the carbohydrate-containing component is in a range of from 15 wt% to 65 wt% based on the dry weight of the binder reaction mixture.
3 . (canceled)
4 . (canceled)
5 . The engineered wood precursor mixture of claim 2 , wherein the total weight percent of glucose and fructose is in the range of 20 wt% to 60 wt% based on dry weight of the binder reaction mixture.
6 . (canceled)
7 . The engineered wood precursor mixture of claim 1 , wherein the soy flour comprises from 30 wt% to 80 wt% of the dry weight of the binder reaction mixture.
8 - 10 . (canceled)
11 . The engineered wood precursor mixture of claim 1 , wherein the base is in a range of from 3 wt% to 21 wt% based on the dry weight of the binder reaction mixture.
12 . (canceled)
13 . The engineered wood precursor mixture of claim 1 , wherein the base comprises NaOH.
14 . (canceled)
15 . (canceled)
16 . The engineered wood precursor mixture of claim 1 , wherein the pH of the aqueous portion is in a range of from 11 to 14.
17 . (canceled)
18 . The engineered wood precursor mixture of claim 1 , wherein the carbohydrate-containing component comprises a glucose syrup having a dextrose equivalent (DE) of at least 80.
19 . (canceled)
20 . The engineered wood precursor mixture of claim 1 , wherein the carbohydrate-containing component comprises a high fructose corn syrup comprising at least 90 wt% fructose and glucose.
21 . The engineered wood precursor mixture of claim 20 , wherein the high fructose corn syrup comprises at least 94 wt% fructose and glucose.
22 . The engineered wood precursor mixture of claim 21 , wherein the high fructose corn syrup comprises from 30 wt% to 70 wt% glucose.
23 - 26 . (canceled)
27 . The engineered wood precursor mixture of claim 1 , wherein the soy flour has a protein dispersibility index (PDI) in a range of from 70 to 95.
28 . (canceled)
29 . (canceled)
30 . The engineered wood precursor mixture of claim 1 , wherein the plurality of wood substrates comprise one or more strands, one or more particles, one or more fibers, or a mixture thereof.
31 . (canceled)
32 . (canceled)
33 . The engineered wood precursor mixture of claim 1 , further comprising sodium sulfite, sodium bisulfite, sodium metabisulfite, or a mixture thereof.
34 . (canceled)
35 . The engineered wood precursor mixture of claim 1 , wherein the binder reaction mixture present in a range of from 8 parts to 17 parts per 100 parts of the dry weight of the plurality of wood substrates.
36 . (canceled)
37 . The engineered wood precursor mixture of claim 1 , wherein a moisture content of the engineered wood precursor mixture is in a range of from 9% to 13%.
38 . The engineered wood precursor of claim 1 , wherein the sodium trimetaphosphate is in a range of from 0.4 wt% to 0.9 wt% based on the dry weight of the binder reaction mixture.
39 . (canceled)
40 . (canceled)
41 . An engineered wood comprising a reaction product of the engineered wood precursor of claim 1 .
42 . The engineered wood of claim 41 , wherein the engineered wood comprises particle board, medium density fiber board, high density fiberboard, oriented strand board, engineered wood flooring, and combinations thereof.
43 - 57 . (canceled)
58 . The engineered wood precursor mixture of claim 1 , further comprising a swell-retardant agent.
59 - 139 . (canceled)Join the waitlist — get patent alerts
Track US2023312930A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.