Molding system

Abstract

A forming system includes a heating unit that causes a current to flow through a plated metal material to heat the metal material, a forming die that forms the heated metal material, and a plating deviation suppression mechanism that suppresses a deviation of a plating in the metal material due to energization heating.

What is claimed is: 
     
         1 . A forming system comprising:
 a heating unit that causes a current to flow through a plated metal material to heat the metal material;   a forming die that forms the heated metal material; and   a plating deviation suppression mechanism that suppresses a deviation of a plating in the metal material due to energization heating.   
     
     
         2 . The forming system according to  claim 1 , wherein the plating deviation suppression mechanism electrically suppresses the deviation of the plating. 
     
     
         3 . The forming system according to  claim 2 , wherein the plating deviation suppression mechanism suppresses a change in a current when energization heating is stopped. 
     
     
         4 . The forming system according to  claim 2 , wherein the plating deviation suppression mechanism suppresses a current for energization heating. 
     
     
         5 . The forming system according to  claim 2 , wherein the plating deviation suppression mechanism is configured by the heating unit and a control unit for controlling the heating unit, and the control unit is electrically connected to a power supply of the heating unit and controls a heating timing by the heating unit by transmitting a control signal to the power supply and controls a heating temperature by adjusting a magnitude of the current. 
     
     
         6 . The forming system according to  claim 1 , wherein the plating deviation suppression mechanism mechanically suppresses the deviation of the plating. 
     
     
         7 . The forming system according to  claim 6 , wherein the plating deviation suppression mechanism separates the metal material and a magnetic body from each other by a predetermined distance or more during energization heating. 
     
     
         8 . The forming system according to  claim 6 , wherein the plating deviation suppression mechanism is configured by the heating unit that heats the metal material outside the forming die. 
     
     
         9 . The forming system according to  claim 6 , wherein the plating deviation suppression mechanism is configured by a magnetic shield disposed around the metal material during energization heating. 
     
     
         10 . The forming system according to  claim 9 , wherein the magnetic shield is composed of two semi-circular members and covers the metal material by combining the two members during energization heating. 
     
     
         11 . The forming system according to  claim 10 , wherein the magnetic shield is retracted from a periphery of the metal material at the time of forming.