Package structure for chemical system

Abstract

The present application provides a package structure for a chemical system, which comprises an inner glue frame and a first outer glue frame. The inner glue frame forms an accommodating space for accommodating a chemical system. The first outer glue frame is further disposed outside the inner glue frame and used for isolating the ambient environment and thus avoiding the influence of the ambient environment on the chemical system. A second outer glue frame is further disposed for avoiding damages such as side bumps and falls of the chemical system or contact with foreign metals. Thereby, the performance of the chemical system can be maintained.

What is claimed is: 
     
         1 . A package structure comprising:
 a first substrate;   a second substrate opposite to the first substrate;   an inner glue frame disposed between the first substrate and the second substrate for forming an accommodating space;   a first outer glue frame located on a side of the inner glue frame and disposed between the first substrate and the second substrate; and   a second protection layer disposed between the first outer glue frame and the first substrate.   
     
     
         2 . The package structure of  claim 2 , wherein the inner glue frame and the second protection layer are a thermosetting plastic; and the first outer glue frame is a thermoplastic. 
     
     
         3 . A package structure comprising:
 a first substrate;   a second substrate opposite to the first substrate and longer than the first substrate;   an inner glue frame disposed between the first substrate and the second substrate for forming an accommodating space;   a first protection layer disposed on a side of the first substrate and longer than the first substrate; and   a first outer glue frame, located on a side of the inner glue frame, disposed between the first substrate and the second substrate, and disposed between the first protection layer and the second substrate.   
     
     
         4 . The package structure of  claim 3 , further comprising a second protection layer disposed between the first substrate and the first outer glue frame and disposed between the first protection layer and the first outer glue frame. 
     
     
         5 . The package structure of  claim 4 , wherein the inner glue frame and the second protection layer are a thermosetting plastic; and the first outer glue frame is a thermoplastic. 
     
     
         6 . The package structure of  claim 3 , further comprising a second outer glue frame located on a side of the first outer glue frame and disposed between the first protection layer and the second substrate, wherein the second outer glue frame protrudes from the second substrate. 
     
     
         7 . The package structure of  claim 6 , further comprising a second protection layer disposed between the first outer glue frame and the first substrate and disposed among the first protection layer, the first outer glue frame, and the second outer glue frame. 
     
     
         8 . The package structure of  claim 7 , wherein the inner glue frame, the second protection layer, and the second outer glue frame are a thermosetting plastic; and the first outer glue frame is a thermoplastic. 
     
     
         9 . A package structure comprising:
 a first substrate;   a second substrate opposite to the first substrate;   an inner glue frame disposed between the first substrate and the second substrate for forming an accommodating space;   a first outer glue frame located on a side of the inner glue frame and disposed between the first substrate and the second substrate; and   a second outer glue frame located on a side of the first outer glue frame and disposed between the first substrate and the second substrate.   
     
     
         10 . The package structure of  claim 9 , wherein the second outer glue frame comprises a first outer glue layer, a third outer glue layer, and a second outer glue layer disposed between the first outer glue layer and the third outer glue layer, and wherein one of the first outer glue layer, the second outer glue layer, and the third outer glue layer protrudes from the first substrate and the second substrate and protrudes from the other two of the first outer glue layer, the second outer glue layer, and the third outer glue layer. 
     
     
         11 . The package structure of  claim 9 , wherein two of the first outer glue layer, the second outer glue layer, and the third outer glue layer protrude from the first substrate and the second substrate and protrude from the other one of the first outer glue layer, the second outer glue layer, and the third outer glue layer. 
     
     
         12 . The package structure of  claim 9 , wherein the second outer glue frame protrudes from the first substrate and the second substrate. 
     
     
         13 . The package structure of  claim 12 , further comprising a second protection layer disposed between the first substrate and the first outer glue frame and disposed between the first substrate and the second outer glue frame. 
     
     
         14 . The package structure of  claim 13 , wherein the inner glue frame, the second protection layer, and the second outer glue frame are a thermosetting plastic; and the first outer glue frame is a thermoplastic. 
     
     
         15 . The package structure of  claim 12 , wherein the second outer glue frame comprises a first outer glue layer, a third outer glue layer, and a second outer glue layer disposed between the first outer glue layer and the third outer glue layer. 
     
     
         16 . The package structure of  claim 15 , wherein the third outer glue layer protrudes from the second outer glue layer, and the second outer glue layer protrudes from the first outer glue layer.