Temperature modulation assembly and a multi-layer retention mechanism for a temperature therapy device

Abstract

A temperature modulation assembly and a multi-layer retention mechanism for such a temperature therapy device are disclosed. According to one embodiment, a temperature modulation assembly for a temperature therapy device has a heat spreader and a mounting plate coupled to a bottom portion of a spacer, wherein the heat spreader is disposed between the mounting plate and the spacer. The temperature modulation assembly has a heatsink and a fan coupled to a top portion of the spacer, wherein the heatsink is disposed between the top portion of the spacer and the fan. The temperature modulation assembly further includes a heating and/or cooling device disposed within a central opening of the spacer, wherein the heating and/or cooling device is located between the heatsink and the heat spreader.

1 . A temperature modulation assembly for a temperature therapy device, the temperature modulation assembly comprising:
 a heat spreader;   a spacer comprising a central opening and a support structure, wherein the support structure directly contacts a fan;   a mounting plate coupled to a bottom portion of a spacer, wherein the heat spreader is disposed between the mounting plate and the spacer;   a heating and/or cooling device disposed within a central opening of the spacer, wherein the heating and/or cooling device is located on the heat spreader, wherein the fan is coupled to a top portion of the spacer.   
     
     
         2 . The temperature modulation assembly of  claim 1 , wherein the mounting plate comprises aluminum or anodized aluminum. 
     
     
         3 . The temperature modulation assembly of  claim 1 , wherein the spacer comprises one or more materials selected from the group consisting of Nylon 66, Dupont 801, and Dupont 2801. 
     
     
         4 . (canceled) 
     
     
         5 . The temperature modulation assembly of  claim 1 , wherein the heat spreader comprises graphene and/or graphite. 
     
     
         6 . The temperature modulation assembly of  claim 1 , wherein the heat spreader comprises:
 a top layer comprising silicone adhesive;   a middle layer comprising graphene and/or graphite; and   a bottom layer comprising silicone adhesive, wherein the middle layer is disposed between the top layer and the bottom layer.   
     
     
         7 . The temperature modulation assembly of  claim 1 , wherein one or more strain relief fingers are formed in the heat spreader. 
     
     
         8 . The temperature modulation assembly of  claim 7 , wherein the one or more strain relief fingers extend radially from an edge of the heat spreader toward a central portion of the heat spreader. 
     
     
         9 . The temperature modulation assembly of  claim 1 , further comprising a primer layer disposed between the heat spreader and the mounting plate. 
     
     
         10 . The temperature modulation assembly of  claim 1 , further comprising:
 a cover disposed over the spacer and disposed circumferentially around the fan; and   a portion of a multi-layer retention mechanism disposed between the cover and the spacer.   
     
     
         11 . The temperature modulation assembly of  claim 10 , wherein the portion of the multi-layer retention mechanism disposed between the cover and the spacer includes a portion of a top layer of the multi-layer retention mechanism and a ring feature of the multi-layer retention mechanism. 
     
     
         12 . The temperature modulation assembly of  claim 1 , further comprising a cap coupled to the cover, wherein the cap comprises a plurality of openings configured to provide air flow into and/or out of the temperature modulation assembly. 
     
     
         13 . The temperature modulation assembly of  claim 1 , wherein the heating and/or cooling device comprises a thermoelectric cooler (TEC). 
     
     
         14 - 30 . (canceled)