Connectors for integrating conductive threads to non-compatible electromechanical devices

Abstract

An electrical circuit assembly comprising: a circuit component, a fabric-based component, and a fastener is disclosed along with methods for fabricating the electrical circuit assembly and for using the electrical circuit assembly. The circuit component may comprise: a substrate layer comprising an integrated circuit disposed on the substrate layer; and a first conductive linkage electrically coupled to the integrated circuit. The fabric-based component may comprise: a fabric layer comprising a first at least one conductive thread; and a second conductive linkage electrically coupled to the first at least one conductive thread. The fastener may be configured to couple the circuit component and the fabric-based component at the first conductive linkage and the second conductive linkage.

1 - 30 . (canceled) 
     
     
         31 . An electrical circuit assembly comprising:
 an integrated circuit disposed on a substrate layer;   a first conductive linkage electrically coupled to the integrated circuit;   a fabric layer comprising a first conductive thread and a second conductive linkage electrically coupled to the first conductive thread; and   a fastener configured to couple the substrate layer and the fabric layer by connecting the first conductive linkage and the second conductive linkage,   wherein the second conductive linkage is configured to have an increased conductivity compared to the fabric layer.   
     
     
         32 . The electrical circuit assembly of  claim 31 , wherein the first conductive linkage comprises at least one of:
 a hole extending from a first side of the substrate layer to a second side of the substrate layer, wherein an internal surface of the hole is covered with a conductive material;   a penetrable material configured to be embroidered with one or more stitching paths of a second conductive thread; or   a semi-permeable region configured to be penetrated by the fastener.   
     
     
         33 . The electrical circuit assembly of  claim 31 , wherein the first conductive thread is exposed on the fabric layer, and wherein an exposed region of the first conductive thread covers an area that is smaller than or equal to a conductive area on the fabric layer that is covered by the second conductive linkage. 
     
     
         34 . The electrical circuit assembly of  claim 31 , wherein:
 the fabric layer further comprises a non-conductive thread;   the first conductive thread being exposed on the fabric layer; and   an amount of an exposed region of the first conductive thread being variable based on at least one of:
 a first tension on the first conductive thread and a second tension on the non-conductive thread, 
 a feed length of a stitching pattern of the first conductive thread, 
 a weight of the first conductive thread, 
 a ply-count of the first conductive thread, 
 a density of the first conductive thread, or 
 a length of a cross-stitch of the first conductive thread. 
   
     
     
         35 . The electrical circuit assembly of  claim 31 , wherein:
 the fabric layer further comprises at least one conductive layer above or below the fabric layer;   the first conductive thread being exposed on the fabric layer; and   a first size of the at least one conductive layer and a second size of the second conductive linkage are proportional to a third size of an exposed region of the first conductive thread.   
     
     
         36 . The electrical circuit assembly of  claim 31 , wherein the second conductive linkage comprises a snapping mechanism that is crimped onto the fabric layer, wherein the snapping mechanism is configured to be received by a complementary receiver on the first conductive linkage. 
     
     
         37 . The electrical circuit assembly of  claim 31 , wherein the fastener is configured to couple the substrate layer and the fabric layer using a conductive linker, wherein the conductive linker is electrically coupled with the first conductive linkage and the second conductive linkage. 
     
     
         38 . The electrical circuit assembly of  claim 37 , further comprising one or more intermediate layers between the substrate layer and the fabric layer,
 wherein the conductive linker is configured to penetrate the one or more intermediate layers and electrically couple the first conductive linkage and the second conductive linkage.   
     
     
         39 . The electrical circuit assembly of  claim 31 , wherein the fastener is configured to irreversibly couple the integrated circuit and the fabric layer. 
     
     
         40 . The electrical circuit assembly of  claim 31 , wherein the fastener is configured to reversibly couple the integrated circuit and the fabric layer. 
     
     
         41 . The electrical circuit assembly of  claim 31 , wherein the fastener is configured to couple the substrate layer and the fabric layer using at least one of:
 a magnetic force, a chemical bondage, or a mechanical force.   
     
     
         42 . The electrical circuit assembly of  claim 31 , wherein the substrate layer and the fabric layer are arranged vertically, and wherein the first conductive linkage and the second conductive linkage are vertically aligned. 
     
     
         43 . The electrical circuit assembly of  claim 31 , wherein the substrate layer and the fabric layer are arranged horizontally, wherein the first conductive linkage is laterally offset from the second conductive linkage. 
     
     
         44 . The electrical circuit assembly of  claim 31 , wherein:
 the substrate layer comprises a flexible material folded onto the fabric layer,   the first conductive linkage is positioned on the flexible material, and   the first conductive linkage is configured to be electrically coupled to the first conductive thread.   
     
     
         45 . An electrical circuit assembly comprising:
 one or more circuit components, each comprising:
 a substrate layer comprising an integrated circuit disposed on the substrate layer; and 
 a first conductive linkage electrically coupled to the integrated circuit; 
   one or more fabric-based components, each comprising:
 one or more fabric layers, wherein a subset of the one or more fabric layers comprises a conductive thread; and 
 one or more second conductive linkages electrically coupled to the conductive thread; and 
   one or more fasteners configured to couple the one or more circuit components and the one or more fabric-based components at the one or more first conductive linkages and the one or more second conductive linkages,   wherein the one or more second conductive linkages are configured to have an increased conductivity compared to the one or more fabric-based components, and   wherein the one or more first conductive linkages and the one or more second conductive linkages are aligned to a common vertical axis or are laterally offset.   
     
     
         46 . A method of fabricating an electrical circuit assembly comprising:
 providing a substrate layer having an integrated circuit and a first conductive linkage disposed on the substrate layer, the first conductive linkage being electrically coupled to the integrated circuit;   providing a fabric layer comprising a first conductive thread and a second conductive linkage, the second conductive linkage being electrically coupled to the first conductive thread; and   coupling the substrate layer and the fabric layer using a fastener by connecting the first conductive linkage and the second conductive linkage,   wherein the second conductive linkage is configured to have an increased conductivity compared to the fabric layer.   
     
     
         47 . The method of  claim 46 , wherein forming the first conductive linkage comprises at least one of:
 making a hole extending from a first side of the substrate layer to a second side of the substrate layer, wherein an internal surface of the hole is covered with a conductive material;   disposing, on the substrate layer, penetrable material configured to be embroidered with one or more stitching paths of a second conductive thread; or   disposing, on the substrate layer, a semi-permeable region configured to be penetrated by the fastener.   
     
     
         48 . The method of  claim 46 , wherein the first conductive thread is exposed on the fabric substrate, and wherein an exposed region of the first conductive thread covers an area that is smaller than or equal to a conductive area on the fabric layer that is covered by the second conductive linkage. 
     
     
         49 . The method of  claim 46 , wherein
 the fabric layer further comprises a non-conductive thread;   the first conductive thread is exposed on the fabric layer; and   an amount of an exposed region of the first conductive thread is variable based on at least one of:
 a first tension on the first conductive thread and a second tension on the non-conductive thread, 
 a feed length of a stitching pattern of the first conductive thread, 
 a weight of the first conductive thread, 
 a ply-count of the first conductive thread, 
 a density of the first conductive thread, or 
 a length of a cross-stitch of the first conductive thread. 
   
     
     
         50 . The method of  claim 46 , further comprising:
 disposing at least one conductive layer above or below the fabric layer,
 wherein the first conductive thread is exposed on the fabric layer, and 
 wherein a first size of the at least one conductive layer and a second size of the second conductive linkage are proportional to a third size of an exposed region of the first conductive thread. 
   
     
     
         51 . The method of  claim 46 , wherein the second conductive linkage comprises a snapping mechanism that is crimped onto the fabric layer, wherein the snapping mechanism is configured to be received by a complementary receiver on the first conductive linkage. 
     
     
         52 . The method of  claim 46 , wherein coupling the substrate layer and the fabric layer includes installing a conductive linker electrically coupled with the first conductive linkage and the second conductive linkage. 
     
     
         53 . The method of  claim 52 , further comprising:
 disposing one or more intermediate layers between the substrate layer and the fabric layer,   wherein the conductive linker is configured to penetrate the one or more intermediate layers and electrically couple the first conductive linkage and the second conductive linkage.   
     
     
         54 . The method of  claim 46 , wherein the substrate layer and the fabric layer are coupled irreversibly. 
     
     
         55 . The method of  claim 46 , wherein the substrate layer and the fabric layer are coupled reversibly. 
     
     
         56 . The method of  claim 46 , wherein the substrate layer and the fabric layer are coupled using at least one of:
 a magnetic force, a chemical bondage, or a mechanical force.   
     
     
         57 . The method of  claim 46 , further comprising: arranging the substrate layer and the fabric layer in a vertical direction, wherein the first conductive linkage and the second conductive linkage are vertically aligned. 
     
     
         58 . The method of  claim 46 , further comprising: arranging the substrate layer and the fabric layer in a horizontal direction, wherein the first conductive linkage is laterally offset from the second conductive linkage. 
     
     
         59 . The method of  claim 46 ,
 wherein the substrate layer includes a flexible material, the method further comprising:   folding the substrate layer onto the fabric layer;   wherein the first conductive linkage is positioned on the flexible material; and   wherein the first conductive linkage is electrically coupled to the first conductive thread.   
     
     
         60 . A method of fabricating an electrical circuit assembly comprising:
 providing one or more substrate layers, each comprising an integrated circuit disposed on the corresponding substrate layer;   forming one or more first conductive linkages electrically coupled to the one or more integrated circuits;   providing one or more fabric layers having a first conductive thread;   forming one or more second conductive linkages electrically coupled to the first conductive thread;   arranging the one or more substrate layers and the one or more fabric layers, wherein the one or more first conductive linkages and the one or more second conductive linkages are aligned to a common vertical axis or are laterally offset; and   coupling the one or more substrate layers and the one or more fabric layers using a fastener at the one or more first conductive linkages and the one or more second conductive linkages,   wherein the one or more second conductive linkages are configured to have an increased conductivity compared to the one or more fabric layer.