US2023356421A1PendingUtilityA1

Precut processing of logs

Assignee: USNR LLCPriority: Mar 31, 2015Filed: Jul 13, 2023Published: Nov 9, 2023
Est. expiryMar 31, 2035(~8.7 yrs left)· nominal 20-yr term from priority
B26D 5/005B27B 1/002B26D 5/007B26D 11/00G05B 19/19G05B 2219/36515G05B 2219/45229G05B 2219/49372B27B 31/06B27B 1/00
85
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A precut module with one or more profiling heads and/or circular saws may be provided upstream of a saw module. The precut module may be used to implement a portion of a cut that would otherwise be made by the saw module, thereby reducing the depth of cut required at the saw module. In some embodiments, profiling heads may be used to profile a block that is wider than a desired side board. The block may be cut from the workpiece and sent to the edger. This may provide the same or better wood volume recovery and/or throughput speed than profiling the side board or cutting the side board from a flitch. In some embodiments, cut patterns for the precut module and other machine centers may be calculated and/or selected based on a desired depth of cut at the saw module, desired throughput speed, wood volume recovery, and/or other parameters.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method of processing a workpiece to obtain a desired cut product, the method comprising:
 calculating a first cut pattern configured to be implemented by a profiler module upstream of a saw module, wherein the first cut pattern defines a profile of a block that is wider than the desired cut product;   calculating a second cut pattern configured to be implemented by an edger downstream of the saw module;   forming the profile of the block along a first side of the workpiece according to the first cut pattern;   severing the block from a remaining portion of the workpiece with the saw module; and   cutting the block longitudinally according to the second cut pattern into at least a first piece and a second piece, wherein the first piece corresponds to the desired cut product.   
     
     
         2 . The method of  claim 1 , further including calculating a third cut pattern configured to be implemented by the saw module. 
     
     
         3 . The method of  claim 2 , further including cutting the first piece transversely into at least a third piece and a fourth piece downstream of the edger, wherein the fourth piece is the desired cut product. 
     
     
         4 . The method of  claim 1 , further including calculating a cut solution for the workpiece, wherein the cut solution defines the desired cut product. 
     
     
         5 . The method of  claim 4 , wherein the first and second cut patterns are calculated based at least on the cut solution. 
     
     
         6 . The method of  claim 4 , further including calculating, based at least on the cut solution, a third cut pattern configured to be implemented by the profiler module, wherein the third cut pattern defines a profile of the desired cut product to be formed along the workpiece. 
     
     
         7 . The method of  claim 6 , further comprising:
 determining a first difference, if any, in wood volume recovery for the first cut pattern relative to the third cut pattern;   determining a second difference, if any, in throughput for the third cut pattern relative to the first cut pattern;   comparing a value of the first difference to a value of the second difference; and   sending the first cut pattern to the profiler module based on said comparing.   
     
     
         8 . The method of  claim 6 , further including calculating an increase in wood volume recovery or a decrease, if any, in throughput speed through the first saw for the first cut pattern relative to the second cut pattern. 
     
     
         9 . The method of  claim 4 , wherein the cut solution further defines a second desired cut product, the method further comprising calculating a third cut pattern configured for implementation by a second profiler module upstream of the saw module, wherein the third cut pattern defines a second profile to be formed along the first side of the workpiece by the second profiler module, and the second profile is a profile of the second desired cut product or a profile of a second block that is wider than the desired cut product. 
     
     
         10 . The method of  claim 5 , wherein the cut solution defines a through-cut through the workpiece, and wherein calculating the first cut pattern includes determining a desired depth of cut for the one or more saws and comparing a total depth of the through-cut to the desired depth of cut. 
     
     
         11 . The method of  claim 10 , further including calculating a third cut pattern configured for implementation by saw module, wherein the first cut pattern defines a first portion of the through-cut and the third cut pattern defines a remaining second portion of the through-cut, and the second portion has a depth that is less than or substantially equal to the desired depth of cut for the one or more saws. 
     
     
         12 . The method of  claim 11 , wherein forming the profile of the block along the first side of the workpiece includes using the profiler module to cut the workpiece along the first portion of the through-cut, and cutting through the workpiece with the at least one saw includes using the saw module to cut the workpiece along the second portion of the through-cut. 
     
     
         13 . The method of  claim 1 , further including:
 forming a profile of a second block along a second side of the workpiece, wherein the second block is wider than a second desired cut product;   cutting through the workpiece to sever the second block from the remaining portion of the workpiece; and   cutting the second block longitudinally downstream of the saw module to obtain the second desired cut product from the second block.   
     
     
         14 . The method of  claim 13 , wherein the first side and the second side are generally opposite sides of the workpiece. 
     
     
         15 . The method of  claim 1 , further including:
 forming a profile of a second desired cut product along a second side of the workpiece, wherein the second desired cut product is a side board; and   severing the second desired cut product from the remaining portion of the workpiece.   
     
     
         16 . A system for processing a workpiece to obtain a desired cut product, the system comprising:
 a precut module having one or more profilers;   a first saw module downstream of the precut module;   a second saw module downstream of the first saw module; and   an optimizer operatively coupled with the precut module, the optimizer programmed with instructions operable, upon execution, to cause the optimizer to
 cause the precut module to form a profile of a block along the workpiece, wherein the block is wider than the desired cut product; 
 cause the first saw module to sever the block from a remaining portion of the workpiece; and 
 cause the second saw module to cut the block longitudinally into two or more pieces, wherein a first one of the pieces corresponds to the desired cut product. 
   
     
     
         17 . The system of  claim 16 , wherein the second saw module includes an edger. 
     
     
         18 . The system of  claim 17 , further including a trimmer downstream of the edger, wherein the instructions are further operable, upon execution, to cause the trimmer to cut the first one of the pieces transversely to thereby obtain the desired cut product. 
     
     
         19 . The system of  claim 16 , wherein the instructions are further operable, upon execution, to cause the optimizer to calculate a cut solution for the workpiece, wherein the cut solution defines the desired cut product. 
     
     
         20 . The system of  claim 19 , wherein the instructions are further operable, upon execution, to cause the optimizer calculate a first cut pattern for implementation by the precut module based at least on the cut solution, wherein the first cut pattern defines the longitudinal sides of the block.

Join the waitlist — get patent alerts

Track US2023356421A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.