Driver chip

Abstract

A driver chip is provided. The driver chip includes a light-emitting module and a wafer substrate. The light-emitting module has multiple pins. The wafer substrate has a first surface and a second surface. The wafer substrate includes a photodiode, an image sensing circuit, and a light-emitting driving circuit. The photodiode is disposed on the second surface of the wafer substrate. The image sensing circuit is disposed in the wafer substrate and is electrically connected to the photodiode to drive the photodiode. The light-emitting driving circuit is disposed in the wafer substrate, and is electrically connected to the multiple pins of the light-emitting module via multiple connection units on the first surface of the wafer substrate to drive the light-emitting module.

What is claimed is: 
     
         1 . A driver chip, comprising:
 a light-emitting module having a plurality of pins; and   a wafer substrate having a first surface and a second surface, wherein the wafer substrate comprises:
 a photodiode disposed on the second surface of the wafer substrate; 
 an image sensing circuit disposed in the wafer substrate and electrically connected to the photodiode to drive the photodiode; and 
 a light-emitting driving circuit disposed in the wafer substrate and electrically connected to the plurality of pins of the light-emitting module via a plurality of connection units on the first surface of the wafer substrate to drive the light-emitting module. 
   
     
     
         2 . The driver chip according to  claim 1 , wherein the first surface and the second surface are respectively positioned on two opposite sides of the wafer substrate. 
     
     
         3 . The driver chip according to  claim 1 , wherein a light-emitting direction of the light-emitting module is opposite to a sensing direction of the photodiode. 
     
     
         4 . The driver chip according to  claim 1 , wherein the light-emitting module comprises a plurality of light-emitting diodes (LEDs). 
     
     
         5 . The driver chip according to  claim 1 , wherein the plurality of connection units comprise a plurality of routings and through silicon vias (TSVs). 
     
     
         6 . The driver chip according to  claim 1 , wherein the first surface of the wafer substrate is adjacent to a device layer of the wafer substrate, and the second surface of the wafer substrate is adjacent to a substrate layer of the wafer substrate. 
     
     
         7 . The driver chip according to  claim 1 , wherein the photodiode and the image sensing circuit of the wafer substrate form a back side illumination (BSI) sensor. 
     
     
         8 . The driver chip according to  claim 1 , wherein the image sensing circuit and the light-emitting driving circuit share an input output interface and a power source generate circuit. 
     
     
         9 . The driver chip according to  claim 1 , wherein the image sensing circuit and the light-emitting driving circuit share a clock signal generate circuit, and a timing control circuit integrates timing control of the image sensing circuit and the light-emitting driving circuit. 
     
     
         10 . The driver chip according to  claim 1 , wherein the image sensing circuit and the light-emitting driving circuit share a reference current generate circuit and a reference voltage generate circuit.