Atomic Layer Deposition (ALD) for Multi-Layer Ceramic Capacitors (MLCCs)

Abstract

The use of Atomic Layer Deposition (ALD) and Molecular Layer Deposition (MLD) applied to powders and intermediates of the MLCC fabrication process can provide significant advantages. Coating metal particles within a defined range of ALD cycles is shown to provide enhanced oxidation resistance. Surprisingly, a very thin ALD layer was found to substantially increase sintering temperature.

1 - 25 . (canceled) 
     
     
         26 . A method for increasing the flowability of a powder comprising:
 providing a powder comprising a metal or non-oxide ceramic,   applying at least 5 cycles to no more than 50 cycles of an ALD process to the powder,
 wherein the flow factor is increased by at least 10%; or at least 20%, or in the range of 5 to about 40% due to the 5 cycles to no more than 50 cycles of an ALD process; and 
 wherein the flow factor is measured at a Major Principal Consolidation Stress of 5 or 10 and tested in a Brookfield Powder Flow Tester (PFT3115) equipped with a PFT-405 5″ sample trough and a PFT-515 F″ 304 SS vane lid or similar device. 
   
     
     
         27 . The method of claim  1 , wherein the powder comprising the 5 cycles to no more than 50 cycles of an ALD process has a flow factor of at least 10. 
     
     
         28 . The method of claim  1 , wherein the ALD process produces an alumina coating on the powder comprising a metal or non-oxide ceramic. 
     
     
         29 . The method of claim  1 , wherein the powder comprising a metal or non-oxide ceramic is cohesive before applying at least 5 cycles to no more than 50 cycles of an ALD process to the powder, as defined by the flow factor measured at a Major Principal Consolidation Stress of 5 or 10 and tested in a Brookfield Powder Flow Tester (PFT3115) equipped with a PFT-405 5″ sample trough and a PFT-515 F″ 304 SS vane lid or similar device.