US2023383413A1PendingUtilityA1
Workpiece Plating Treatment Method and Workpiece Manufacturing Method
Assignee: TYCO ELECTRONICS SUZHOU LTDPriority: May 24, 2022Filed: May 24, 2023Published: Nov 30, 2023
Est. expiryMay 24, 2042(~15.9 yrs left)· nominal 20-yr term from priority
Inventors:Daiqiong (Diana) ZhangDongqing (Gates) PengJianhua NieZhongpu (Johnson) DengChunyan (Cherie) ZhouZhenyu ZhuJulian ZhangZhongxi Huang
C23C 28/023C23C 22/82C23C 22/78C23C 28/021C23C 28/02C25D 5/505C25D 5/52C25D 5/48C25D 7/00
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Claims
Abstract
A workpiece plating treatment method includes the steps of cleaning an outer surface of an outer plating layer of a workpiece to remove a plurality of oxides and dirt on the outer surface of the outer plating layer, and reflow melting the outer plating layer of the workpiece using a reflow melting device after the cleaning.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A workpiece plating treatment method, comprising the steps of:
cleaning an outer surface of an outer plating layer of a workpiece to remove a plurality of oxides and dirt on the outer surface of the outer plating layer; and reflow melting the outer plating layer of the workpiece using a reflow melting device after the cleaning.
2 . The workpiece plating treatment method according to claim 1 , further comprising:
polishing the outer surface of the outer plating layer of the workpiece after the reflow melting to flatten the outer surface of the outer plating layer.
3 . The workpiece plating treatment method according to claim 2 , further comprising:
forming a protective film on the outer surface of the outer plating layer of the workpiece after the polishing.
4 . The workpiece plating treatment method according to claim 1 , wherein the cleaning step includes using plasma, laser, flux, or any combination of the three to remove the oxides and dirt on the outer surface of the outer plating layer of the workpiece.
5 . The workpiece plating treatment method according to claim 1 , wherein the cleaning step increases a moisture content of the outer surface of the outer plating layer.
6 . The workpiece plating treatment method according to claim 2 , wherein, in the polishing step, the workpiece is immersed in an optical polishing liquid to perform a chemical polishing treatment on the outer surface of the outer plating layer of the workpiece.
7 . The workpiece plating treatment method according to claim 2 , wherein, in the polishing step, the outer surface of the outer plating layer of the workpiece is physically polished using a physical polishing device.
8 . The workpiece plating treatment method according to claim 7 , wherein the physical polishing device includes a sandblasting polishing device, a cloth wheel polishing device, or a plasma polishing device.
9 . The workpiece plating treatment method according to claim 2 , wherein, in the polishing step, the outer surface of the outer plating layer of the workpiece is subjected to a physicochemical mixed polishing treatment.
10 . The workpiece plating treatment method according to claim 3 , wherein the protective film includes at least one of a passivation protective film, a lubricating oil protective film, and a nano organic protective film.
11 . The workpiece plating treatment method according to claim 3 , wherein in forming step, the outer surface of the outer plating layer of the workpiece is passivated to form a passivation protective film on the outer surface of the outer plating layer.
12 . The workpiece plating treatment method according to claim 3 , wherein, in the forming step, the outer surface of the outer plating layer of the workpiece is lubricated to form a layer of lubricating oil protective film on the outer surface of the outer plating layer.
13 . The workpiece plating treatment method according to claim 3 , wherein, in the forming step, the outer surface of the outer plating layer of the workpiece is sputtered to form a layer of nano organic protective film on the outer surface of the outer plating layer.
14 . The workpiece plating treatment method according to claim 1 , wherein the reflow melting device includes at least one of a resistance wire melting furnace, an infrared radiation melting furnace, an inductance melting furnace, and a laser melting furnace.
15 . A workpiece manufacturing method, comprising steps of:
providing a workpiece having an outer plating layer; and processing the outer plating layer of the workpiece using the workpiece plating treatment method according to claim 1 .
16 . The workpiece manufacturing method according to claim 15 , wherein providing the workpiece includes providing a substrate and forming the outer plating layer on the substrate.
17 . The workpiece manufacturing method according to claim 16 , wherein providing the workpiece includes forming an intermediate plating layer on the substrate before forming the outer plating layer on the substrate.
18 . The workpiece manufacturing method according to claim 17 , wherein the substrate is a copper substrate or a steel substrate.
19 . The workpiece manufacturing method according to claim 18 , wherein the intermediate plating layer includes a nickel plating layer.
20 . The workpiece manufacturing method according to claim 15 , wherein the outer plating layer is a tin plating layer, an indium plating layer, a bismuth plating layer, or a lead plating layer.Join the waitlist — get patent alerts
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