Heat pump
Abstract
A heat pump includes a refrigerant circuit for a refrigerant, a refrigerant collector belonging to the refrigerant circuit and through which the refrigerant flows, an expansion device through which the refrigerant flows and connected downstream of the refrigerant collector as seen in the flow direction of the refrigerant, an evaporator belonging to the refrigerant circuit and through which the refrigerant flows and connected downstream of the expansion device as seen in the flow direction of the refrigerant, and a condensate pan that is assigned to the evaporator and is designed to catch condensate forming on the evaporator. The refrigerant collector is designed to be connected in a thermally conductive manner to the condensate pan. In order for heat present externally at the refrigerant collector to be transferred by thermal conduction to the condensate pan, a distance between the refrigerant collector and the condensate pan is at most 15 cm.
Claims
exact text as granted — not AI-modified1 : A heat pump comprising a refrigerant circuit ( 1 ) for a refrigerant, a refrigerant collector ( 2 ) that belongs to the refrigerant circuit ( 1 ) and through which the refrigerant flows, an expansion device ( 3 ) that belongs to the refrigerant circuit ( 1 ) and through which the refrigerant flows and which is connected downstream of the refrigerant collector ( 2 ) as seen in the flow direction of the refrigerant, an evaporator ( 4 ) that belongs to the refrigerant circuit ( 1 ) and through which the refrigerant flows and which is connected downstream of the expansion device ( 3 ) as seen in the flow direction of the refrigerant, and a condensate pan ( 5 ) assigned to the evaporator ( 4 ) to catch condensate forming on the evaporator ( 4 ), wherein the refrigerant collector ( 2 ) is designed to be connected in a thermally conductive manner to the condensate pan ( 5 ),
wherein, in order to transfer heat present externally on the refrigerant collector ( 2 ) to the condensate pan by thermal conduction, a distance between the refrigerant collector ( 2 ) and the condensate pan ( 5 ) is at most 15 cm.
2 : The heat pump according to claim 1 ,
wherein a distance between the refrigerant collector ( 2 ) and the condensate pan ( 5 ) is less than 10 cm, more preferably less than 5 cm, or 0 cm.
3 : The heat pump according to claim 1 ,
wherein a thermal conductive element ( 6 ) is arranged between the refrigerant collector ( 2 ) and the condensate pan ( 5 ).
4 : The heat pump according to claim 3 ,
wherein the thermal conductive element ( 6 ) is designed to be contact-free from the refrigerant.
5 : The heat pump according to claim 1 ,
wherein the refrigerant collector ( 2 ) is located below the condensate pan ( 5 ) when the heat pump is operated as intended.
6 : The heat pump according to claim 1 , wherein the condensate pan ( 5 ) comprises a drainage channel, wherein the refrigerant collector ( 2 ) is at least designed to be connected to the drainage channel in a thermally conductive manner.
7 : The heat pump according to claim 1 ,
wherein the refrigerant collector ( 2 ) is designed as a high-pressure collector.
8 : The heat pump according to claim 1 , wherein the refrigerant circuit ( 1 ) comprises a high-pressure side ( 1 . 1 ) and a low-pressure side ( 1 . 2 ),
wherein the refrigerant collector ( 2 ) is located on the high-pressure side ( 1 . 1 ) of the refrigerant circuit ( 1 ).
9 : The heat pump according to claim 1 ,
wherein the refrigerant circuit ( 1 ) comprises a compressor ( 7 ) through which the refrigerant flows and which is downstream of the evaporator ( 4 ) as seen in the flow direction of the refrigerant.
10 : The heat pump according to claim 9 ,
wherein the refrigerant circuit ( 1 ) comprises a condenser ( 8 ) through which the refrigerant flows and which is downstream of the compressor ( 7 ) as seen in the flow direction of the refrigerant.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.