Embedded Packaging Concepts for Integration of ASICs and Optical Components

Abstract

Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.

What is claimed is: 
     
         1 . An optical package comprising:
 a back side routing layer including a top side and bottom side;   a printed circuit board (PCB) core on the top side of the back side routing layer, the PCB core including a plurality of vertical vias and a cavity;   a controller chip face-up within the cavity;   a molding compound encapsulating the controller chip within the cavity;   a front side routing layer on top of the controller chip, the molding compound, and the PCB core; and   a photodetector (PD) mounted on a top side of the front side routing layer.   
     
     
         2 . The optical package of  claim 1 , further comprising an emitter mounted on the top side of the front side routing layer. 
     
     
         3 . The optical package of  claim 2 , wherein the PD includes a bottom electrode directly over a first contact pad of the front side routing layer, and a top electrode wire bonded to a second contact pad of the front side routing layer. 
     
     
         4 . The optical package of  claim 2 , wherein the PD is encapsulated in a first transparent molding compound, and the emitter is encapsulated in a second transparent molding compound, separate from the first transparent molding compound. 
     
     
         5 . The optical package of  claim 4 , further comprising a metal lid on the front side routing layer and surrounding the PD and the emitter. 
     
     
         6 . The optical package of  claim 4 , further comprising an opaque molding compound on the front side routing layer and surrounding the PD and the emitter. 
     
     
         7 . The optical package of  claim 2 , further comprising a plurality of solder bumps on the bottom side of the back side routing layer. 
     
     
         8 . The optical package of  claim 2 , wherein the PCB core comprises a laminate body. 
     
     
         9 . The optical package of  claim 1 , wherein the front side routing layer is a front redistribution layer (RDL) comprising one or more metal traces and one or more dielectric layers. 
     
     
         10 . The optical package of  claim 1 , wherein the back side routing layer is a redistribution layer (RDL) comprising the molding compound and a plurality of through vias through the molding compound. 
     
     
         11 . The optical package of  claim 2 , wherein the photodetector (PD) and the emitter both at least partially overlap the controller chip. 
     
     
         12 . The optical package of  claim 11 , wherein the PCB core comprises a laminate body. 
     
     
         13 . The optical package of  claim 11 , further comprising an opaque molding compound on the front side routing layer and surrounding the PD and the emitter, and laterally between the PD and the emitter. 
     
     
         14 . The optical package of  claim 13 , wherein the opaque molding compound spans over the PD and the emitter, and further comprising a first aperture in the opaque molding compound spanning over the PD and a second aperture in the opaque molding compound spanning over the emitter. 
     
     
         15 . The optical package of  claim 14 , wherein the opaque molding compound spans over a first top electrode of the PD and a second top electrode of the emitter, wherein the first top electrode is wire bonded to the front side routing layer with a first wire and the second top electrode is wire bonded to the front side routing layer with a second wire. 
     
     
         16 . The optical package of  claim 11 , further comprising metal lid on the front side routing layer and surrounding the PD and the emitter, and laterally between the PD and the emitter. 
     
     
         17 . The optical package of  claim 16 , wherein the metal lid spans over the PD and the emitter, and further comprising a first aperture in the metal lid spanning over the PD and a second aperture in the metal lid spanning over the emitter. 
     
     
         18 . The optical package of  claim 17 , wherein the metal lid spans over a first top electrode of the PD and a second top electrode of the emitter, wherein the first top electrode is wire bonded to the front side routing layer with a first wire and the second top electrode is wire bonded to the front side routing layer with a second wire.