US2023389544A1PendingUtilityA1
Food Contact Disinfecting/Sanitizing Formulation And Wipe
Est. expiryDec 18, 2032(~6.4 yrs left)· nominal 20-yr term from priority
A01N 33/12A01N 47/44
74
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Claims
Abstract
Disclosed is a sanitizing/disinfecting composition containing a quaternary ammonium compound and a polybiguanide. The composition is a food contact safe composition which does not need rinsing after being applied to a substrate. The composition may be saturated into a wipe.
Claims
exact text as granted — not AI-modifiedWhat is claimed:
1 .- 19 . (canceled)
20 . A sanitizing/disinfecting composition comprising:
(a) a quaternary ammonium compound, having the general formula:
wherein
R2 is benzyl or C6-18-alkyl;
R3 is C1-18-alkyl or [(CH2)2-O]nR6 where n=1-20;
R4 and R5 independently of one another are C1-4-alkyl;
R6 is hydrogen or unsubstituted or substituted phenyl; and
A− is a monovalent anion or one equivalent of a polyvalent anion of an inorganic or organic acid;
(b) a polybiguanide; and
(c) a non-ionic surfactant,
wherein the quaternary ammonium compound is present in an amount of about 50 ppm up to about 400 ppm and the polybiguanide is present in an amount of about 50 ppm up to about 550 ppm.
21 . The composition according to claim 20 , wherein the non-ionic surfactant comprises a linear alcohol ethoxylate, a secondary alcohol ethoxylate, or an ethoxylate ester.
22 . The composition according to claim 20 , wherein the quaternary ammonium compound is present in an amount of about 150 ppm up to about 400 ppm and the polybiguanide is present in an amount of about 150 ppm up to about 550 ppm.
23 . The composition according to claim 20 , wherein the polybiguanide comprises a polyalkylenebiguanide.
24 . The composition according to claim 23 , wherein the polyalkylenebiguanide comprises polyhexamethylene biguanide.
25 . The composition according to claim 20 , wherein the quaternary ammonium compound comprises didecyldimethylammonium chloride, or alkyldimethylbenzyl ammonium chloride.
26 . The composition according to claim 20 , wherein the anions comprise halides, carbonates, bicarbonate, carboxylates, sulfonates, phosphates or a mixture thereof.
27 . The composition according to claim 26 , wherein the anion comprises a chloride, a carbonate, a bicarbonate or mixtures thereof.
28 . The composition according to claim 20 , wherein the quaternary ammonium compound comprises one or more compounds selected from the group consisting of didecyldimethyl ammonium salt, alkyldimethylbenzyl ammonium salt, dioctyldimethyl ammonium salt, octyldecyldimethyl ammonium salt, dicocoalkyldimethyl ammonium salt, cocoalkyldimethylpoly(oxyethyl) ammonium salt, dicocoalkylmethyl-poly(oxyethyl) ammonium salt, decyldimethylpoly(oxyethyl) ammonium salt, didecylmethylpoly(oxyethyl) ammonium salt, octyidimethylpoly(oxy-ethyl) ammonium salt, dioctylmethylpoly(oxyethyl) ammonium salt, cocoalkydimethylbenzylammonium salt, benzyldodecyidimethylammonium salt, or benzyldimethylpoly(oxyethyl) ammonium salt and mixtures thereof.
29 . The composition according to claim 20 , further comprising a solvent.
30 . The composition according to claim 29 , wherein the solvent comprises water, an organic solvent or a mixture thereof.
31 . The composition according to claim 29 , further comprising one or more of the following: chelators, builder salts, dyes, or fragrances.
32 . A wipe comprising a wipe substrate, wherein the wipe substrate is saturated with the composition according to claim 20 .
33 . The wipe according to claim 32 , wherein the wipe substrate is selected from the group consisting of woven material, a nonwoven materials and laminates thereof.
34 . The wipe according to claim 33 , wherein the nonwoven material is selected from the group consisting of meltblown, coform, spunbond, airlaid, hydroentangled nonwovens, spunlace, bonded carded webs, and laminates thereof.
35 . The wipe according to claim 32 , wherein the quaternary ammonium compound is present in an amount of about 150 ppm up to about 400 ppm and the polybiguanide is present in an amount of about 150 ppm up to about 550 ppm.
36 . The wipe according to claim 35 , wherein the substrate is a nonwoven substrate selected from the group consisting of meltblown, coform, spunbond, airlaid, hydroentangled nonwovens, spunlace, bonded carded webs, and laminates thereof.
37 . The wipe according to claim 36 , further comprising a solvent, and optional contains one or more chelators, builder salts, dyes, or fragrances.
38 . A method of sanitizing or disinfecting a substrate comprising contacting a substrate with the composition according to claim 20 and allowing the composition to dry on the substrate.
39 . The method according to claim 35 , wherein the composition is impregnated into a wipe and the wipes applies the composition onto the substrate.Join the waitlist — get patent alerts
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