Deformed Mesh Thermal Ground Plane

Abstract

Some embodiments include a thermal ground plane comprising a first casing layer and a second casing layer where the outer periphery of the first casing layer and the outer periphery of the second casing layer are bonded to each other. The thermal ground plane including a working fluid disposed within the first casing layer and the second casing layer. The thermal ground plane may also include a permeable wick disposed between the first casing layer and the second casing layer; and a deformed mesh disposed between the first casing layer and the permeable wick, the deformed mesh comprising a mesh with deformed mesh portions that form vapor channels and nondeformed mesh portions that form liquid channels.

That which is claimed is: 
     
         1 . A thermal ground plane, including:
 a first casing layer;   a second casing layer where outer peripheries of the second casing layer are hermetically sealed with outer peripheries of the first casing layer to form a TGP housing case;   a vapor transport layer disposed nearby the first casing layer in the TGP housing case;   a vapor transport layer disposed nearby the second casing layer in the TGP housing case; and   a working fluid filled in the TGP housing case.   
     
     
         2 . The thermal ground plane according to  claim 1 , wherein the vapor transport layer comprises a first deformed mesh including:
 a plurality of vapor channels;   a plurality of first deformed mesh parts; and   a plurality of first mesh parts that are cross-connected to each other.   
     
     
         3 . The thermal ground plane according to  claim 2 , wherein the liquid transport layer comprises a second deformed mesh including:
 a plurality of liquid channels;   a plurality of second deformed mesh parts; and   a plurality of second mesh parts which are cross-connected to each other.   
     
     
         4 . The thermal ground plane according to  claim 3 , wherein a plurality of ridges in the first mesh parts are correspondingly stacked between each two of the ridges in the second mesh parts. 
     
     
         5 . The thermal ground plane according to  claim 1 , wherein the vapor transport layer and the liquid transport layer are formed into an integrated part structure by a compression step. 
     
     
         6 . The thermal ground plane according to  claim 3 , wherein the working fluid flows through the first mesh parts and the second mesh parts, and the first and second mesh parts are connected, respectively by the first deformed mesh parts and the second deformed mesh parts, wherein the first mesh parts are bonded to the first casing layer, and the second mesh parts are bonded to the second casing layer. 
     
     
         7 . The thermal ground plane according to  claim 3 , further including a planar mesh structure, which is disposed between the vapor transport layer and the liquid transport layer, to separate the vapor transport layer and the liquid transport layer, wherein the working fluid flows between the planar mesh structure, the vapor transport layer and the liquid transport layer. 
     
     
         8 . The thermal ground plane according to  claim 7 , wherein the first mesh part contacts an inner surface of the first casing layer, and the first deformed mesh parts include a plurality of first ridge to be a plurality of support pillars for keeping a space between the planar mesh structure and the first casing layer, to form a vapor transmission passage. 
     
     
         9 . The thermal ground plane according to  claim 8 , wherein the second mesh parts are stacked on the planar mesh structure, and the second deformed mesh parts include a plurality of second ridges to be a plurality of support pillars for keeping a space between the second casing layer and the planar mesh structure. 
     
     
         10 . The thermal ground plane according to  claim 3 , wherein the first mesh parts are correspondingly stacked on the second mesh parts to form a curved mesh structure. 
     
     
         11 . The thermal ground plane according to  claim 1 , wherein the liquid transport layer includes at least two mesh structures, each of the mesh structures includes at least one capillary channel which uses capillary phenomena to transport the working fluid. 
     
     
         12 . The thermal ground plane according to  claim 3 , wherein the first deformed mesh includes a plurality of first fiber parts which are interwoven with each other, and the second deformed mesh includes a plurality of second fiber parts which are interwoven with each other. 
     
     
         13 . The thermal ground plane according to  claim 3 , wherein the first deformed mesh includes a plurality of first mesh layers stacked on each other, and the second deformed mesh includes a plurality of second mesh layers stacked on each other. 
     
     
         14 . The thermal ground plane according to  claim 2 , wherein the vapor channels form an internal arterial network. 
     
     
         15 . The thermal ground plane according to  claim 7 , wherein the planar mesh structure includes a plurality of pores, and the pores include smaller sizes than the vapor channels to prevent the vapor in the vapor channels from flowing into the liquid transport layer. 
     
     
         16 . The thermal ground plane according to  claim 1 , wherein material of the first and second casing layers, includes a combination of copper, polymer, and composite material of copper and polymer. 
     
     
         17 . The thermal ground plane according to  claim 1 , wherein the hermetic seal between the first and second casing layers are shaped by thermocompression bonding or laser welding, to form the TGP housing case.