US2023399735A1PendingUtilityA1
Sputtering techniques for biosensors
Est. expiryAug 1, 2038(~12 yrs left)· nominal 20-yr term from priority
C23C 14/542C23C 14/14C23C 14/34C23C 14/205C23C 14/025C23C 14/083C23C 14/562C23C 14/08A61B 5/14532A61B 5/0022A61B 2560/0214A61B 2562/125A61B 5/14503A61B 5/14865
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Claims
Abstract
Systems and methods for forming probes for a biosensor. In the systems and methods disclosed herein, a base substrate is provided; and a platinum layer is formed on the base substrate by sputtering platinum in the absence of oxygen. The platinum layer is formed using a sputtering pressure of at least 30 mtorr.
Claims
exact text as granted — not AI-modified1 . A method of forming a probe for a biosensor, the method comprising the steps of:
providing a base substrate; and forming a platinum layer overlying the base substrate by sputtering platinum in the absence of oxygen, wherein the platinum layer is formed using a sputtering pressure of at least 30 mtorr.
2 . The method of claim 1 , wherein the step of forming the platinum layer comprises forming the platinum layer having a thickness of between 15 nm and 2000 nm.
3 . The method of claim 1 , wherein the step of forming the platinum layer comprises forming the platinum layer using a sputtering power of at least 100 W.
4 . The method of claim 1 , wherein the step of providing the base substrate comprises providing a base substrate formed from polyethylene terephthalate (PET).
5 . The method of claim 1 , wherein the platinum layer is formed using a sputtering pressure of at least 50 mtorr.
6 . The method of claim 1 , wherein the method of forming the probe for a biosensor is a continuous process.
7 . The method of claim 1 , wherein the method comprises sputtering a first adhesion-promoting layer overlying the base substrate.
8 . The method of claim 7 , wherein the method comprises sputtering a second surface-roughness-promoting layer overlying the first adhesion-promoting layer.
9 . The method of claim 7 , wherein the step of sputtering the first adhesion-promoting layer overlying the base substrate comprises sputtering a titanium layer overlying the base substrate.
10 . The method of claim 8 , wherein the step of sputtering the second surface-roughness-promoting layer overlying the first adhesion-promoting layer comprises sputtering, in the presence of oxygen, a layer overlying the first adhesion-promoting layer using a sputtering source comprising a material selected from the group of platinum, iridium, ruthenium and zirconium.
11 . The method of claim 10 , wherein the step of sputtering the second surface-roughness-promoting layer is performed by gas flow sputtering.
12 . The method of claim 1 , wherein the step of providing the base substrate comprises providing a base substrate formed from polyethylene terephthalate (PET).
13 . The method of claim 11 , wherein the step of sputtering the platinum layer overlying the second surface-roughness-promoting layer comprises sputtering a platinum layer having a thickness of between 25 nm and 100 nm
14 . The method of claim 13 , wherein the step of sputtering the platinum layer overlying the second surface-roughness-promoting layer is performed at a sputtering pressure of above 30 mtorr.
15 . The method of claim 1 , wherein the method of forming the probe for the glucose biosensor is a continuous process using a conveyor to continuously move the base substrate through a sputtering chamber during sputtering in the sputtering chamber.Join the waitlist — get patent alerts
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