Antennas for millimeter wave contactless communications

Abstract

Methods, systems, and apparatus for using antennas for millimeter wave contactless communication. One of the apparatuses is a communication device that includes a transducer configured to convert electrical signals into extremely high frequency (EHF) electromagnetic signals, the EHF electromagnetic signals substantially emitted from a first surface of the communication device, wherein the transducer is positioned on a substrate of the communication device, and an integrated circuit coupled to the substrate, wherein the transducer includes multiple parallel resonant antenna elements in an array.

What is claimed is: 
     
         1 . A transducer comprising:
 multiple parallel resonant antenna elements in an array, wherein the antenna elements are configured to convert electrical signals into extremely high frequency (EHF) electromagnetic signals.   
     
     
         2 . The transducer of  claim 1 , wherein the multiple parallel resonant antenna elements include one driven component and one director element. 
     
     
         3 . The transducer of  claim 2 , wherein the transducer is positioned on a substrate and wherein the director element is shorter in length than the driven element and is positioned on the substrate on the side of an intended transmission direction of the transducer. 
     
     
         4 . The transducer of  claim 2 , wherein the multiple parallel resonant antenna elements comprise a plurality of parasitic elements that receive and radiate EHF electromagnetic signals from the driven element. 
     
     
         5 . The transducer of  claim 4 , wherein the plurality of parasitic elements receive and re-radiate waves from the driven element but in a different phase based on lengths of the plurality of parasitic elements. 
     
     
         6 . The transducer of  claim 5 , wherein the re-radiated waves are superimposed to increase antenna gain in a transmission direction. 
     
     
         7 . The transducer of  claim 1 , wherein the array is an end-fire array. 
     
     
         8 . The transducer of  claim 1 , wherein the transducer has a directional side-fire radiation pattern at EHF. 
     
     
         9 . A transducer comprising:
 a trapezoid shaped conductor, a slot located along a central line of the transducer, a first set of side slots located at a first edge of the transducer, and a second set of side slots located at a second edge of the transducer,   wherein the transducer is configured to convert electrical signals into extremely high frequency (EHF) electromagnetic signals such that electrical signals fed to the transducer are emitted from the transducer as EHF signals.   
     
     
         10 . The transducer of  claim 9 , wherein the first set of side slots and the second set of side slots increase the current path of the transducer, which creates a wide EHF bandwidth. 
     
     
         11 . The transducer of  claim 9 , wherein the size and position of the first and second slots are configured such that the transducer emits EHF radiation across a particular frequency bandwidth. 
     
     
         12 . The transducer of  claim 9 , wherein the first set of side slots and the second set of side slots are spaced at equal intervals and side slots of the first set are aligned with respective side slots of the second set. 
     
     
         13 . The transducer of  claim 9 , wherein the first set of side slots and the second set of side slots are spaced at staggered intervals relative to each side. 
     
     
         14 . The transducer of  claim 9 , wherein the first edge and the second edge are not parallel to each other. 
     
     
         15 . The transducer of  claim 9 , wherein the slot is formed from spacing between microstrip conductors. 
     
     
         16 . The transducer of  claim 9 , further comprising:
 a chip coupled to the transducer; and   a second transducer coupled to the chip, wherein the second transducer comprises:   a trapezoid shaped conductor, a slot located along a central line of the second transducer, a third set of side slots located at a first edge of the second transducer, and a fourth set of side slots located at a second edge of the second transducer,   wherein the second transducer is configured to convert electrical signals into extremely high frequency (EHF) electromagnetic signals such that electrical signals fed to the second transducer are emitted from the second transducer as EHF signals.   
     
     
         17 . The transducer of  claim 16 , wherein the transducer has a first center frequency and wherein the second transducer has a second center frequency, wherein the first center frequency is different than the second center frequency. 
     
     
         18 . The transducer of  claim 16 , wherein a polarization of the transducer is different than a polarization of the second transducer. 
     
     
         19 . The transducer of  claim 16 , wherein polarization of the transducer and the second transducer are similar and wherein the transducer and the second transducer used in a common frequency band, and wherein the chip provides isolation among the transducer and the second transducer. 
     
     
         20 . The transducer of  claim 16 , wherein the transducer and the second transducer use the common frequency band separately or concurrently.