Electrode array packaging system

Abstract

An apparatus, including a sterilely sealed package, and an electrode assembly sterilely sealed in the package, wherein the apparatus is configured to enable testing for an open circuit between two electrodes of the electrode assembly with the electrode assembly sterilely sealed in the package.

What is claimed is: 
     
         1 . An apparatus, comprising:
 a sterilely sealed package; and   an electrode assembly sterilely sealed in the package, wherein   the apparatus is configured to enable testing for an open circuit between two electrodes of the electrode assembly with the electrode assembly sterilely sealed in the package.   
     
     
         2 . The apparatus of  claim 1 , wherein:
 the electrode assembly is in a state prepared for direct implantation into a recipient upon opening of the package.   
     
     
         3 . The apparatus of  claim 1 , wherein:
 the apparatus provides conductivity between two electrodes of the electrode assembly sufficient to enable testing for an open circuit between the two electrodes while also enabling testing for a short circuit between the two electrodes with the conductivity present between the two electrodes.   
     
     
         4 . The apparatus of  claim 3 , the apparatus includes a portion made of a material that directly contacts the two electrodes to establish the conductivity therebetween having an impedance of about 200 ohms to about 4.7 megaohms. 
     
     
         5 . The apparatus of  claim 3 , wherein the apparatus includes an electrically conductive foam portion that directly contacts the two electrodes. 
     
     
         6 . The apparatus of  claim 1 , wherein the apparatus includes an electrically conductive foam portion that is in electrical contact with two electrodes of the electrode assembly. 
     
     
         7 . The apparatus of  claim 1 , wherein the apparatus is configured to disable the enablement of the testing for the open circuit while the electrode assembly is sterilely sealed in the package. 
     
     
         8 . The apparatus of  claim 1 , wherein at least a portion of the package is made of a conductive material in direct contact with electrodes of the electrode assembly. 
     
     
         9 . A method, comprising:
 obtaining an electrode array sterilely isolated from an external environment thereof; and   testing for an open circuit between two electrodes of the electrode array while the electrode array is sterilely sealed from the external environment.   
     
     
         10 . The method of  claim 9 , further comprising:
 eliminating the sterile isolation after testing and implanting the electrode assembly in a human recipient.   
     
     
         11 . The method of  claim 10 , wherein:
 the action of implanting the electrode array includes implanting the electrode array into the human recipient after eliminating the sterile isolation without adding material to or removing material from the implantable assembly.   
     
     
         12 . The method of  claim 10 , wherein:
 the action of testing for an open circuit includes testing for the open circuit while the recipient is under anesthesia and prepared for implantation; and   the method further includes determining whether to implant the electrode array in the recipient based on the testing.   
     
     
         13 . The method of  claim 9 , further comprising:
 testing for a short circuit in the electrode array while the electrode array is sterilely isolated from the external environment.   
     
     
         14 . The method of  claim 9 , further comprising:
 manipulating package material forming the sterile isolation from a first state to a second state and subsequently testing for one of the open circuit or a short circuit of the electrode assembly while the electrode array is sterilely isolated from the ambient environment.   
     
     
         15 . The method of  claim 14 , further comprising:
 testing for the other of the open circuit or the short circuit while the package material is in the first state.   
     
     
         16 . The method of  claim 9 , wherein:
 the testing for the open circuit is executed using inductive communication to activate a stimulator to provide an electrical signal to the electrode array.   
     
     
         17 . An apparatus, comprising:
 a package; and   an electrode array sterilely sealed in the package, wherein   the apparatus is configured to provide electrical conductivity between two electrodes of the electrode array.   
     
     
         18 . The apparatus of  claim 17 , wherein:
 the electrical conductivity is between 200 ohms and 4.7 megaohms.   
     
     
         19 . The apparatus of  claim 17 , wherein:
 the apparatus is configured to alternately provide and eliminate the electrical conductivity between the two electrodes.   
     
     
         20 . The apparatus of  claim 17 , wherein:
 the apparatus is configured to vary an impedance between electrodes of the electrode array from less than 90 ohms to more than 2000 ohms.