US2023422401A1PendingUtilityA1

Connector Interface Assembly for Enclosed Vessels and Associated Systems and Methods

Assignee: FERMI RES ALLIANCE LLCPriority: Jul 29, 2021Filed: Sep 8, 2023Published: Dec 28, 2023
Est. expiryJul 29, 2041(~15 yrs left)· nominal 20-yr term from priority
H05K 1/18H01R 43/26H05K 3/02H01R 43/205H05K 3/282H05K 1/0216H05K 2201/10189H05K 2201/09063H05K 2201/0715H05K 2201/10507H05K 2201/09227H01R 13/6215
62
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Claims

Abstract

Systems, methods, and apparatus that employ a connector assembly having a substrate layer with an inner aperture and an outer periphery, and one or more signal traces disposed on the substrate that extend from an inner first location to an outer second location of the apparatus, for communicating data between electronic devices positioned within an interior volume of an enclosed vessel and complementary electronic devices positioned in an ambient environment external to the enclosed vessel. An inner connector is conductively connected the signal traces at the inner first location of each signal trace, and an outer connector is conductively connected to the one or more signal traces at the outer second location of each signal trace. A substantially flat exterior surface extends radially over at least a portion of a region between the respective first locations and the respective second locations.

Claims

exact text as granted — not AI-modified
That which is claimed is: 
     
         1 . A connector assembly comprising:
 a substrate layer having a first side, a second side substantially opposite the first side, an inner aperture and an outer periphery radially outwardly disposed relative to the inner aperture;   at least one signal trace disposed on the substrate layer, and each extending at least from a respective first location to a respective second location, wherein each of the second locations is radially outwardly disposed relative to the respective first locations;   an inner connector configured in electronic communication with the at least one signal trace at the respective first location of each of the at least one signal trace;   an outer connector configured in electronic communication with the at least one signal trace at the respective second location of each of the at least one signal trace;   a first substantially flat exterior surface disposed on the substrate layer and extending between the respective first locations and the respective second locations on the first side of the substrate layer; and   a second substantially flat exterior surface disposed on the substrate layer and extending between the respective first locations and the respective second locations on the second side of the substrate layer.   
     
     
         2 . The connector assembly according to  claim 1  further comprising at least one non-conductive epoxy layer encapsulating the at least one signal trace. 
     
     
         3 . The connector assembly according to  claim 2  further comprising:
 a first substantially flat hard layer disposed radially between the respective first locations and the respective second locations on the first side of the substrate layer, wherein a first non-conductive epoxy layer of the at least one non-conductive epoxy layer is disposed between the substrate layer and the first substantially flat hard layer; and 
 a second substantially flat hard layer disposed radially between the respective first locations and the respective second locations on the second side of the substrate layer, wherein the substrate layer is disposed between the first non-conductive epoxy layer and the second substantially flat hard layer. 
 
     
     
         4 . The connector assembly according to  claim 3  wherein the first substantially flat hard layer comprises the first substantially flat exterior surface. 
     
     
         5 . The connector assembly according to  claim 3  further comprising:
 an inner raised lip projecting from the first substantially flat hard layer and encircling the inner aperture; and 
 an outer raised lip projecting from the first substantially flat hard layer and radially outwardly disposed relative to the inner raised lip; 
 wherein the inner raised lip and the outer raised lip project from the first substantially flat hard layer in a substantially axial direction. 
 
     
     
         6 . The connector assembly according to  claim 3  wherein:
 the first substantially flat hard layer and the second substantially flat hard layer include a second inner aperture larger than the inner aperture of the substrate layer and a second outer periphery smaller than the outer periphery of the substrate layer, such that a first portion of the substrate layer extends radially inwardly beyond an inner extent of the second inner aperture and a second portion of the substrate layer extends radially outwardly beyond an outer extent of the second outer periphery; 
 the first location of each of the at least one signal trace is disposed on the first portion of the substrate layer; 
 the second location of each of the at least one signal traces is disposed on the second portion of the substrate layer. 
 
     
     
         7 . The connector assembly of  claim 6  wherein the inner connector is mounted on the first portion of the substrate layer and the outer connector is mounted on the second portion of the substrate layer. 
     
     
         8 . The connector assembly according to  claim 7  further comprising:
 at least one raised lip projecting from the first substantially flat hard layer and encircling the inner aperture. 
 
     
     
         9 . The connector assembly according to  claim 1  wherein the at least one signal trace comprises a first plurality of signal traces disposed on the first side of the substrate layer and a second plurality of signal traces disposed on the second side of the substrate layer. 
     
     
         10 . The connector assembly according to  claim 1  further comprising a plurality of apertures outwardly disposed from the inner aperture, and each configured to substantially fittedly receive a fastener through a portion of the connector assembly. 
     
     
         11 . The connector assembly according to  claim 1  wherein the inner connector and the outer connector are each of a multipin connector type. 
     
     
         12 . The connector assembly according to  claim 1  wherein the substrate layer, the at least one signal trace, the first substantially flat exterior surface, and the second substantially flat exterior surface comprise a printed circuit board (PCB). 
     
     
         13 . The connector assembly according to  claim 1  wherein the connector assembly is configured to be mounted between an interior and an exterior of an enclosed vessel, the interior and the exterior separated by first and second flange connectors each characterized by a flange face and an aperture, to form a seal between a volume defined at least in part by the interior of the enclosed vessel, the aperture of the first flange connector, the inner aperture of the connector assembly, and the aperture of the second flange connector with a first gasket disposed between the flange face of the first flange connector and the first substantially flat exterior surface of the connector assembly, with a second gasket disposed between the flange face of the second flange connector and the second substantially flat exterior surface of the connector assembly, and with the first flange connector mechanically connected to the second flange connector by one or more fasteners. 
     
     
         14 . A system for data communicating between an interior and an exterior of an enclosed vessel, the interior and the exterior separated by first and second flange connectors each characterized by a flange face and an aperture; the system comprising:
 a connector assembly including:
 a substrate layer having a first side, a second side substantially opposite the first side, an inner aperture and an outer periphery outwardly disposed relative to the inner aperture; 
 at least one signal trace disposed on the substrate layer, and each extending at least from a first location to a second location, wherein the second location is outwardly disposed relative to the first location; 
 an inner connector conductively connected to the at least one signal trace at the first location; 
 an outer connector conductively connected to the at least one signal trace at the second location; 
 a first substantially flat exterior surface disposed on the substrate layer and extending radially over a first region between the first location and the second location on the first side of the substrate layer; and 
 a second substantially flat exterior surface disposed on the substrate layer and extending radially over a second region between the first location and the second location on the second side of the substrate layer; 
   a first gasket; and   a second gasket;   wherein the connector assembly, the first gasket, and the second gasket are configured to form a seal between a volume defined at least in part by the interior of the enclosed vessel, the aperture of the first flange connector, the inner aperture of the connector assembly, and the aperture of the second flange connector with the first gasket disposed between the flange face of the first flange connector and the first substantially flat exterior surface of the connector assembly, with the second gasket disposed between the flange face of the second flange connector and the second substantially flat exterior surface of the connector assembly, and with the first flange connector mechanically connected to the second flange connector by one or more fasteners.   
     
     
         15 . The system of  claim 14  further comprising:
 a first component positioned in the volume; and 
 a second component positioned in the exterior of the enclosed vessel, wherein the first component and the second component are configured to communicate using electronic signals transmitted through the at least one signal trace of the connector assembly. 
 
     
     
         16 . A method of manufacturing a connector assembly, comprising:
 fabricating a substrate layer having a first side, a second side substantially opposite the first side, an inner aperture and an outer periphery radially outwardly disposed relative to the inner aperture;   laminating a copper layer on the first side of the substrate layer;   etching at least one signal trace from the copper layer, with each of the at least one signal trace extending at least from a respective first location to a respective second location, wherein the respective second location is radially outwardly disposed relative to the first respective location;   applying a non-conductive epoxy layer over the at least one signal trace;   laminating a substantially flat first metal layer over the non-conductive epoxy layer on the first side of the substrate layer, wherein the first metal layer extends radially over at least a portion of a first region between the respective first locations and the respective second locations on the first side of the substrate layer;   laminating a substantially flat second metal layer over the second side of the substrate layer, wherein the second metal layer extends radially over at least a portion of a second region between the respective first locations and the respective second locations on the second side of the substrate layer;   attaching an inner connector in electronic communication with the at least one signal trace at the respective first locations; and   attaching an outer connector in electronic communication with the at least one signal trace at the respective second locations.   
     
     
         17 . The method according to  claim 16  further comprising:
 forming an inner raised lip projecting axially from the first substantially flat metal layer and encircling the inner aperture. 
 
     
     
         18 . The method according to  claim 17  further comprising:
 forming an outer raised lip projecting axially from the first substantially flat metal layer and radially outwardly disposed relative to the inner raised lip. 
 
     
     
         19 . The method according to  claim 16  further comprising:
 forming a plurality of apertures outwardly disposed from the inner aperture, and each configured to substantially fittedly receive a fastener through a portion of the substrate layer. 
 
     
     
         20 . The method according to  claim 16  further comprising:
 milling a printed circuit board (PCB) comprising the substrate layer, the at least one signal trace, the first substantially flat exterior surface, and the second substantially flat exterior surface.

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