US2024003037A1PendingUtilityA1

Silver electroplating compositions and methods for electroplating rough matt silver

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Assignee: ROHM AND HAS ELECTRONIC MAT LLCPriority: Jun 29, 2022Filed: Feb 2, 2023Published: Jan 4, 2024
Est. expiryJun 29, 2042(~15.9 yrs left)· nominal 20-yr term from priority
Inventors:Fai Lung TingWeigang Wu
C25D 5/605C25D 5/627C25D 3/46C25D 7/12C25D 5/18C25D 5/08
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Claims

Abstract

Silver electroplating compositions deposit rough, matt silver having needle-like grain structures. The rough, matt, silver deposits enable good adhesion with dielectric materials, even in environments of high relative humidity.

Claims

exact text as granted — not AI-modified
1 .- 15 . (canceled) 
     
     
         16 . An article comprising a rough, matt silver layer adjacent a surface of a substrate, wherein the rough, matt silver layer has a Sa of 0.1-0.4 μm and an Sdr of 5-50%. 
     
     
         17 . The article of  claim 16 , wherein the surface of the substrate is copper or copper alloy.

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