Film plating machine and electroplating production line

Abstract

A film plating machine and electroplating production line are provided. The film plating machine has a plating solution tank, conductive substrate film conveying devices and a power supply. A plating solution and an anode member are provided in the plating solution tank. The conductive substrate film conveying devices are provided at both sides of the plating solution tank and configured to clamp two opposite side edges of a horizontally-placed conductive substrate film and drive the conductive substrate film to horizontally enter and exit the plating solution tank in a first direction. A positive electrode of the power supply is electrically connected with the anode member, and a negative electrode of the power supply is electrically connected with the conductive substrate film through the conductive substrate film conveying devices.

1 . A film plating machine comprising:
 a plating solution tank for accommodating a plating solution and an anode member;   conductive substrate film conveying devices provided at both sides of the plating solution tank respectively, wherein the conductive substrate film conveying devices are configured to clamp two opposite side edges of a horizontally-placed conductive substrate film and drive the conductive substrate film to horizontally enter and exit the plating solution tank in a first direction; and   a power supply having a positive electrode electrically connected with the anode member, and a negative electrode electrically connected with the conductive substrate film through the conductive substrate film conveying devices.   
     
     
         2 . The film plating machine according to  claim 1 , wherein the conductive substrate film conveying devices comprise:
 a first conveying device comprising a first conveying belt, a first driving assembly and a plurality of first conductive clamps; the first conveying belt extending along the first direction; the plurality of first conductive clamps being arranged on the first conveying belt along the first direction; the plurality of first conductive clamps being electrically communicated with the negative electrode of the power supply, and the first driving assembly being configured to drive the first conveying belt to convey the first conductive clamps along the first direction; and   a second conveying device comprising a second conveying belt, a second driving assembly and a plurality of second conductive clamps; the second conveying belt extending along the first direction; the plurality of second conductive clamps being arranged on the second conveying belt along the first direction; the plurality of second conductive clamps being electrically communicated with a negative electrode of the power supply, and the second driving assembly being configured to drive the second conveying belt to convey the second conductive clamps along the first direction;   wherein the first conveying belt and the second conveying belt are symmetrically provided on both sides of the plating solution tank, and the first conductive clamps and the second conductive clamps are respectively configured to clamp the two opposite side edges of the conductive substrate film.   
     
     
         3 . The film plating machine according to  claim 2 , wherein each of the first conductive clamp and the second conductive clamp comprises:
 a first clamping portion comprising a first clamping face, wherein the first clamping face is a conductive face and is electrically communicated with the negative electrode of the power supply; and   a second clamping portion comprising a second clamping face, wherein the second clamping face is a conductive face and is electrically communicated with the negative electrode of the power supply;   wherein the first clamping portion and the second clamping portion can move relative to each other, so that the conductive clamps are in a clamping state or an opening state, and the first clamping face and the second clamping face both contact and are electrically communicated with the conductive substrate film when the conductive clamp clamps the conductive substrate film; and   wherein surfaces of the first conductive clamp and the second conductive clamp are configured such that, except for the first clamping face and the second clamping face, remaining surfaces that can be immersed in the plating solution during film plating are insulating surfaces.   
     
     
         4 . The film plating machine according to  claim 3 , wherein
 a first sealing portion is formed on the first clamping portion around the first clamping face;   a second sealing portion is formed on the second clamping portion around the second clamping face; and   the first sealing portion and the second sealing portion cooperatively seal the first clamping face and the second clamping face when the conductive clamp clamps the conductive substrate film.   
     
     
         5 . The film plating machine according to  claim 4 , wherein
 the first sealing portion is a first sealing ring provided around the first clamping face;   the first sealing ring at least partially protrudes from the first clamping face; and   the second sealing portion is a first annular sealing slot provided around the second clamping face, and a portion of the first sealing ring protruding from the first clamping face cooperatively fits into the first annular sealing slot when the conductive clamp is in the clamping state.   
     
     
         6 . The film plating machine according to  claim 3 , further comprising an opening and closing mechanism;
 wherein   the opening and closing mechanism comprises a first guide rail and a second guide rail symmetrically provided on both sides of the plating solution tank;   the first guide rail and the second guide rail both extend along the first direction; and   the first guide rail is configured to cooperate with the first conductive clamp to guide opening or closing of the first conductive clamp, and the second guide rail is configured to cooperate with the second conductive clamp to guide opening or closing of the second conductive clamp.   
     
     
         7 . The film plating machine according to  claim 6 , wherein
 the first conductive clamp is a normally open conductive clamp;   the first guide rail corresponds to a position of the plating solution tank;   the first guide rail comprises a closing guide section, a horizontal guide section and an opening guide section provided in sequence along the first direction;   the first conductive clamp is gradually closed under a guiding action of the closing guide section when the first conductive clamp slides along the closing guide section;   the first conductive clamp keeps moving in the clamping state when the first conductive clamp slides along the horizontal guide section; and   the first conductive clamp is gradually opened under a guiding action of the opening guide section when the first conductive clamp slides along the opening guide section.   
     
     
         8 . The film plating machine according to  claim 7 , wherein the normally open conductive clamp comprises a bracket on which a guide column is provided; the first clamping portion and the second clamping portion are both slidably connected to the guide column; and an elastic member is provided between the first clamping portion and the second clamping portion, and the elastic member is configured to keep the first clamping portion and the second clamping portion in the opening state; and
 wherein the first guide rail comprises an upper guide rail and a lower guide rail oppositely provided; a movement trajectory of the first conductive clamp is located between the upper guide rail and the lower guide rail; along a movement direction of the first conductive clamp, a gap between a lower surface of the upper guide rail and an upper surface of the lower guide rail first gradually narrows, subsequently remains unchanged, and finally increases gradually, and a portion of the first guide rail where the gap remains unchanged corresponds to a position of the plating solution tank.   
     
     
         9 . The film plating machine according to  claim 6 , wherein the conductive clamp is a normally closed conductive clamp; the first guide rail comprises a first guide section and a second guide section; the first guide section corresponds to an entering side of the plating solution tank; the second guide section corresponds to an exiting side of the plating solution tank; the first guide section guides the first conductive clamp to open when the first conductive clamp slides along the first guide section; the first conductive clamp is in a normally closed state when the first conductive clamp slides between the first guide section and the second guide section; and the second guide section guides the first conductive clamp to open again when the first conductive clamp slides along the second guide section. 
     
     
         10 . The film plating machine according to  claim 9 , wherein the first clamping portion is fixed relative to the first conveying belt; the second clamping portion is movably connected with the first clamping portion; the second clamping portion can move up and down relative to the first clamping portion and the second clamping face is located above the first clamping face, and
 wherein the first guide section and the second guide section comprise an ascending slope and a descending slope provided in sequence along the first direction; the second clamping portion is gradually lifted when the second clamping portion cooperates with the ascending slope, so that the first conductive clamp is opened, and the second clamping portion is gradually lowered under an action of gravity when the second clamping portion cooperates with the descending slope, so that the first conductive clamp is closed.   
     
     
         11 . The film plating machine according to  claim 2 , wherein the first conveying belt and the second conveying belt are each an elliptical conveying belt. 
     
     
         12 . The film plating machine according to  claim 11 , wherein
 the first conveying belt comprises a first horizontal section and a second horizontal section; the first horizontal section and the second horizontal section are parallel to each other and extend along the first direction; one end of the first horizontal section is connected with one end of the second horizontal section by a first arc section, and the other end of the first horizontal section is connected with the other end of the second horizontal section by a second arc section; and   wherein the first driving assembly comprises a motor, a driving wheel and a driven wheel; a rotating shaft of the driving wheel and a rotating shaft of the driven wheel are parallel to each other; the motor is configured to drive the mater wheel to rotate, the first arc section is sleeved on the driving wheel, and the second arc section is sleeved on the driven wheel.   
     
     
         13 . The film plating machine according to  claim 2 , wherein the film plating machine further comprises a first conductive clamp cleaning mechanism and a second conductive clamp cleaning mechanism symmetrically provided on both sides of the plating solution tank; the first conductive clamp cleaning mechanism is configured to clean the first conductive clamp, and the second conductive clamp cleaning mechanism is configured to clean the second conductive clamp, the first conductive clamp cleaning mechanism comprising:
 a first water washing device provided downstream from the plating solution tank along the movement trajectory of the first conductive clamp, the first water washing device being configured to wash the first conductive clamp with water to remove plating solution on an exterior of the first conductive clamp;   an acid pickling and electrolyzing device provided downstream from the first water washing device along the movement trajectory of the first conductive clamp, the acid pickling and electrolyzing device performing acid pickling and electrolysis on the first conductive clamp with acid pickling solution to remove a metal plating layer on an exterior of the first conductive clamp; and   a second water washing device provided downstream from the acid pickling and electrolyzing device along the movement trajectory of the first conductive clamp, the second water washing device being configured to wash the first conductive clamp with water to remove acid pickling solution on an exterior of the first conductive clamp.   
     
     
         14 . The film plating machine according to  claim 2 , wherein a conducting mechanism is further comprised, the conducting mechanism comprising:
 a first conductive assembly comprising a plurality of first electric brushes arranged along the first direction, and a plurality of first conductive blocks provided on the first conveying belt, wherein the plurality of first electric brushes are fixed relative to the plating solution tank and are electrically connected to the negative electrode of the power supply; the first conductive blocks can form a sliding electrical connection with the first electric brushes when the first conveying belt drives the first conductive blocks to move to positions of the first electric brushes; and   a second conductive assembly comprising a plurality of second electric brushes arranged along the first direction, and a plurality of second conductive blocks provided on the second conveying belt, wherein the plurality of second electric brushes are fixed relative to the plating solution tank and are electrically connected to the negative electrode of the power supply; the second conductive block can form a sliding electrical connection with the second electric brushes when the second conveying belt drives the second conductive block to move to positions of the second electric brushes.   
     
     
         15 . The film plating machine according to  claim 1 , wherein the plating solution tank comprises:
 a main tank in which the plating solution is provided;   an auxiliary tank in which the plating solution is provided, and the plating solution in the main tank can overflow into the auxiliary tank after reaching a preset solution level; and   a circulating pump configured to extract the plating solution in the auxiliary tank and transport it into the main tank.   
     
     
         16 . The film plating machine according to  claim 1 , wherein the anode member is formed by splicing a plurality of anode member splicing units; the plurality of anode member splicing units are arranged along a width direction of the plating solution tank, and two adjacent anode member splicing units are separated by an insulating medium; and each anode member splicing unit is connected with the positive electrode of the power supply. 
     
     
         17 . An electroplating production line comprising:
 an unwinding mechanism configured to unwind a conductive substrate film not plated with a film;   the film plating machine according to  claim 1 ; and   a winding mechanism configured to wind the conductive substrate film plated with the film,   wherein the unwinding mechanism, the film plating machine and the winding mechanism are sequentially provided along a conveying direction of the conductive substrate film.   
     
     
         18 . The electroplating production line according to  claim 17 , further comprising:
 a cleaning tank configured to clean the plating solution on a surface of the conductive substrate film;   a passivation tank configured to form an anti-oxidation plating layer on the surface of the conductive substrate film;   an oven configured to remove antioxidant solution remaining on a surface of the conductive substrate film; and   a splitting device configured to cut off regions on both sides of the conductive substrate film clamped by the conductive substrate film conveying device,   wherein the cleaning tank, the passivation tank, the oven and the splitting device are provided in sequence between the film plating machine and the winding mechanism.