Card with fingerprint biometrics

Abstract

An inlay for a card can include a first overlay sheet, an antenna carrier sheet, a thickness compensation sheet, a second transparent overlay sheet, a module lead frame, a finger sensor lead frame, an antenna, and electrical wires. The module lead frame can be adapted for being milled and can include a plurality of first contact pads for contacting a contact module. The finger sensor lead frame can be adapted for being milled and can include a plurality of second contact pads for contacting a fingerprint sensor. The electrical wires can be connected to one of the first contact pads, the second contact pads, or the antenna.

That which is claimed is: 
     
         1 . An inlay for a card, the inlay comprising:
 a first overlay sheet;   an antenna carrier sheet being provided next to the first overlay sheet, the antenna carrier sheet defining a contact module lead frame opening and a finger sensor lead frame opening;   a module lead frame being adapted for being milled and being provided in the contact module lead frame opening, the module lead frame comprising a plurality of first contact pads for contacting a contact module;   a finger sensor lead frame being adapted for being milled and being provided in the finger sensor lead frame opening, the finger sensor lead frame comprising a plurality of second contact pads for contacting a fingerprint sensor;   an antenna comprising an electrical conductor and embedded in the antenna carrier sheet; and   a plurality of electrical wires, each of the plurality of electrical wires being connected to one of the first contact pads, one of the second contact pads, or the antenna.   
     
     
         2 . The inlay of  claim 1 , further comprising a microcontroller electrically connected to the antenna, the first contact pads, and the second contact pads. 
     
     
         3 . The inlay of  claim 2 , wherein the microcontroller is electrically connected to the first contact pads by one of thermal compression bonding and ultrasonic bonding. 
     
     
         4 . The inlay of  claim 2 , wherein each of the plurality of electrical wires is embedded in the antenna carrier sheet. 
     
     
         5 . The inlay of  claim 1 , further comprising at least a thick-ness compensation sheet being provided next to the antenna carrier sheet or a second overlay sheet being provided next to the thickness compensation sheet. 
     
     
         6 . The inlay of  claim 5 , further comprising an intermediate PVC sheet being provided next to the second overlay sheet. 
     
     
         7 . A method of producing the inlay of  claim 1 , the method comprising:
 providing an adhesive tape next to the antenna carrier sheet;   attaching the module lead frame and the sensor lead frame to the adhesive tape;   removing the adhesive tape from the antenna carrier sheet; and   providing a first overlay sheet next to the antenna carrier sheet.   
     
     
         8 . The method of  claim 7 , further comprising:
 providing a thickness compensation sheet with an opening adapted to receive a molded part of a microcontroller; and   providing the thickness compensation sheet next to the antenna carrier sheet.   
     
     
         9 . The method of  claim 8 , further comprising providing a second overlay sheet next to the thickness compensation sheet. 
     
     
         10 . The method of  claim 7 , wherein embedding an antenna in the antenna carrier sheet comprises pressing the antenna into the antenna carrier sheet with a heated tool. 
     
     
         11 . The method of  claim 7 , further comprising inserting the printed circuit board into the inlay. 
     
     
         12 . A card comprising:
 an inlay comprising
 a first overlay sheet; 
 an antenna carrier sheet being provided next to the first overlay sheet, the antenna carrier sheet defining a module lead frame opening and a sensor lead frame opening; 
 first contact pads of a module lead frame being provided in the module lead frame opening; 
 second contact pads of a sensor lead frame being provided in the sensor lead frame opening; 
 an antenna comprising an electrical conductor and embedded in the antenna carrier sheet; and 
 a plurality of electrical wires, each of the plurality of electrical wires being connected to the first contact pads, to the second contact pads, or the antenna; 
   a first printed PVC sheet being provided next to a first overlay sheet of the inlay; and   a first transparent PVC sheet being provided next to the first printed PVC sheet;   wherein:
 the first transparent PVC sheet, the first printed PVC sheet, and the first overlay sheet comprise a contact module opening and a fingerprint sensor opening; 
 a contact module is provided in the contact module opening and is electrically connected to the first contact pads via a first electrically conductive substance; and 
 a fingerprint sensor is provided in the fingerprint sensor opening and is electrically connected to the second contact pads via a second electrically conductive substance. 
   
     
     
         13 . The card of  claim 12 , wherein at least one electrical wire overlaps with another electrical wire. 
     
     
         14 . The card of  claim 12 , further comprising an electrically conductive substance for electrically connecting the contact module to the first contact pads or electrically connecting the fingerprint sensor to the second contact pads. 
     
     
         15 . The card of  claim 12 , further comprising:
 a thickness compensation sheet being provided next to the antenna carrier sheet; and   a second overlay sheet being provided next to the thickness compensation sheet.   
     
     
         16 . The card of  claim 15 , further comprising a second printed PVC sheet being provided next to the second overlay sheet of the inlay. 
     
     
         17 . The card of  claim 16 , furthering comprising
 an intermediate transparent PVC sheet being provided between the second overlay sheet and the second printed PVC sheet.   
     
     
         18 . A method of producing a card, the method comprising:
 producing an inlay;   providing a first printed PVC sheet next to a first overlay sheet of the inlay;   providing a first transparent PVC sheet next to the first printed PVC sheet;   milling a first major surface of the first transparent PVC sheet such that a module lead frame body of a module lead frame is electrically detached from a plurality of electrical contact pads of the module lead frame;   milling the first major surface such that a finger sensor lead frame body of the finger sensor lead frame is electrically detached from a plurality of electrical contact pads of the finger sensor lead frame;   milling the first major surface to define a first recess to receive a contact module; and   milling the first major surface to define a second recess to receive a fingerprint sensor.   
     
     
         19 . The method of  claim 18 , wherein producing the inlay comprises:
 providing an antenna carrier sheet with a contact module lead frame opening and a finger sensor lead frame opening;   providing an adhesive tape next to the antenna carrier sheet;   inserting a module lead frame into the contact module lead frame opening and inserting a finger sensor lead frame into the finger sensor lead frame opening; wherein the module lead frame and the finger sensor lead frame are attached to the adhesive tape;   embedding an antenna in the antenna carrier sheet, the antenna comprising an electrical conductor;   attaching each of a plurality of electrical wires to:
 an electrical contact pad of a plurality of electrical contact pads of a printed circuit board of the inlay; 
 an electrical contact pad of the plurality of electrical contact pads of the module lead frame; 
 an electrical contact pad of the plurality of electrical contact pads of the sensor lead frame; or 
   the antenna;   removing the adhesive tape from the antenna carrier sheet; and   providing the first overlay sheet next to the antenna carrier sheet.   
     
     
         20 . The method of  claim 18 , further comprising providing an electrically conductive substance to electrically connect the contact module to the plurality of electrical contact pads or to electrically connect the fingerprint sensor to the plurality of electrical contact pads.