Substrate Transport Vacuum Platform

Abstract

An apparatus including a first device configured to support at least one substrate thereon; and a first transport having the device connected thereto. The transport is configured to carry the device. The transport includes a plurality of supports which are movable relative to one another along a linear path; at least one magnetic bearing which at least partially couples the supports to one another. A first one of the magnetic bearings includes a first permanent magnet and a second magnet. The first permanent magnet is connected to a first one of the supports. A magnetic field adjuster is connected to the first support which is configured to move the first permanent magnet and/or vary influence of a magnetic field of the first permanent magnet relative to the second magnet.

1 - 24 . (canceled) 
     
     
         25 . An apparatus comprising:
 a chamber configured to separate a first environment inside the chamber from a second environment outside of the chamber;   an enclosure movably mounted inside the chamber for movement along the chamber, where the enclosure is configured to separate a third environment inside the enclosure from the first environment inside the chamber;   a robot connected to the enclosure, where the robot is configured to support at least one substrate thereon;   a heat pump located inside the enclosure.   
     
     
         26 . The apparatus as claimed in  claim 25  where the robot comprises at least one movable arm configured to support the at least one substrate thereon, where the robot is at least partially inside the enclosure in the third environment and at least partially outside of the enclosure in the first environment of the chamber. 
     
     
         27 . The apparatus as claimed in  claim 25  where the apparatus further comprises:
 an enclosure heat transfer radiator on an exterior of the enclosure, where heat pump is connected to the enclosure heat transfer radiator; and 
 a chamber heat transfer radiator on the chamber, where the chamber heat transfer radiator is configured to transfer heat from the enclosure heat transfer radiator, received from across the first environment in the chamber, to the second environment outside of the chamber. 
 
     
     
         28 . The apparatus as claimed in  claim 25  where the apparatus further comprises:
 a stationary power transfer member located inside the chamber; 
 a movable power transfer member connected to the enclosure, where the movable power transfer member is configured to move with the enclosure when the enclosure is moved along the chamber, where the movable power transfer member is configured and located relative to the stationary power transfer member to transfer power from the stationary power transfer member to the movable power transfer member. 
 
     
     
         29 . The apparatus as claimed in  claim 28  where the stationary power transfer member comprises a first capacitive interface, where the movable power transfer member comprises a second capacitive interface, where the first and second capacitive interfaces are sized, shaped and located relative to each other to provide a non-contacting capacitive power coupling. 
     
     
         30 . The apparatus as claimed in  claim 29  where the first and second capacitive interfaces are sized, shaped and located relative to each other to allow heat transfer between the first and second capacitive interfaces. 
     
     
         31 . The apparatus as claimed in  claim 30  where the capacitive interfaces comprise interleaved opposing surfaces configured to transfer heat to one another by radiation and convection as a function of pressure. 
     
     
         32 . The apparatus as claimed in  claim 25  where the apparatus further comprises:
 a first voltage converter located outside of the chamber in the second environment; and 
 a second voltage converter located inside the enclosure, where the enclosure seals the second voltage converter from the first environment inside the chamber. 
 
     
     
         33 . The apparatus as claimed in  claim 25  where the heat pump comprises, inside the enclosure, a plate evaporator, a plate condenser, and a compressor connected to a heat pump controller. 
     
     
         34 . The apparatus as claimed in  claim 33  where the plate condenser is thermally sunk to the enclosure heat transfer radiator. 
     
     
         35 . The apparatus as claimed in  claim 25  where the heat pump comprises a thermoelectric heat pump. 
     
     
         36 . The apparatus as claimed in  claim 25  where the apparatus further comprises:
 at least one magnetic bearing which at least partially couples the enclosure with the chamber, where a first one of the magnetic bearings comprises a first permanent magnet and a second magnet, where the first permanent magnet is connected to a first support; and 
 a magnetic field adjuster connected to the first support which is configured to move the first permanent magnet and/or vary influence of a magnetic field of the first permanent magnet relative to the second magnet. 
 
     
     
         37 . The apparatus as claimed in  claim 25  further comprising:
 a first data communications link located outside of the chamber in the second environment; 
 a stationary communications feedthrough located inside the chamber and connected to the first data communications link, where the stationary communications feedthrough extends through a wall of the chamber into the chamber; 
 a movable communications feedthrough connected to the enclosure, where the movable communications feedthrough is configured to move with the enclosure when the enclosure is moved along the chamber, where the movable communications feedthrough is configured and located relative to the stationary communications feedthrough to transfer data signals between the stationary communications feedthrough and the movable communications feedthrough as the enclosure moves in the chamber, where the movable communications feedthrough does not physically contact the stationary communications feedthrough; 
 a second data communications link located inside the enclosure, where the enclosure seals the second data communications link from the first environment inside the chamber; 
 where the second data communications link is connected to at least one sensor and/or motor controller inside the third environment of the enclosure, where the enclosure seals the second data communications link from the first environment inside the chamber. 
 
     
     
         38 . An apparatus comprising:
 a chamber configured to separate a first environment inside the chamber from a second environment outside of the chamber;   an enclosure movably mounted inside the chamber for movement along the chamber, where the enclosure is configured to separate a third environment inside the enclosure from the first environment inside the chamber;   a robot connected to the enclosure, where the robot has at least one movable arm and is configured to support at least one substrate thereon, where the robot is at least partially inside the enclosure in the third environment and at least partially outside of the enclosure in the first environment of the chamber;   a heat pump located inside the enclosure, where the heat pump comprises a thermoelectric heat pump, where the heat pump comprises, inside the enclosure, a plate evaporator, a plate condenser, and a compressor connected to a heat pump controller, and where the plate condenser is thermally sunk to the enclosure heat transfer radiator; and   an enclosure heat transfer radiator on an exterior of the enclosure, where heat pump is connected to the enclosure heat transfer radiator; and   a chamber heat transfer radiator on the chamber, where the chamber heat transfer radiator is configured to transfer heat from the enclosure heat transfer radiator, received from across the first environment in the chamber, to the second environment outside of the chamber.   
     
     
         39 . The apparatus as claimed in  claim 38  where the apparatus further comprises:
 a stationary power transfer member located inside the chamber; 
 a movable power transfer member connected to the enclosure, where the movable power transfer member is configured to move with the enclosure when the enclosure is moved along the chamber, where the movable power transfer member is configured and located relative to the stationary power transfer member to transfer power from the stationary power transfer member to the movable power transfer member. 
 
     
     
         40 . The apparatus as claimed in  claim 39  where the stationary power transfer member comprises a first capacitive interface, where the movable power transfer member comprises a second capacitive interface, where the first and second capacitive interfaces are sized, shaped and located relative to each other to provide a non-contacting capacitive power coupling. 
     
     
         41 . A method comprising:
 movably mounting an enclosure inside a chamber for linear movement along the chamber, where the chamber is configured to provide a first environment sealed from a second environment located outside of the chamber, and where the enclosure is configured to provide a third environment sealed from the first environment;   connecting a robot to the enclosure, where the robot comprises at least one movable arm and is configured to support at least one substrate thereon, where the robot is at least partially inside the enclosure in the third environment and at least partially outside of the enclosure in the first environment of the chamber; and   locating a heat pump inside the enclosure.   
     
     
         42 . The method as claimed in  claim 41  further comprising:
 locating an enclosure heat transfer radiator on an exterior of the enclosure, where heat pump is connected to the enclosure heat transfer radiator; and 
 locating a chamber heat transfer radiator on the chamber, where the chamber heat transfer radiator is configured to transfer heat from the enclosure heat transfer radiator, received from across the first environment in the chamber, to the second environment outside of the chamber. 
 
     
     
         43 . The method as claimed in  claim 41  where the heat transfer pump comprises, inside the enclosure, a plate evaporator, a plate condenser, and a compressor connected to a heat pump controller, where the locating of the heat pump inside the enclosure comprises the plate condenser being thermally sunk to the enclosure heat transfer radiator. 
     
     
         44 . The method as claimed in  claim 41  where the heat transfer pump comprises a thermoelectric heat pump located inside the enclosure and sealed from the first environment with the enclosure. 
     
     
         45 . The method as claimed in  claim 44  where the locating of the heat pump inside the enclosure comprises the enclosure heat transfer radiator, on the exterior of the enclosure, being thermally sunk to a plate condenser of the heat pump located inside the enclosure. 
     
     
         46 . The method as claimed in  claim 41  further comprising:
 locating a first data communications link outside of a chamber; 
 connecting a stationary communications feedthrough to a wall of the chamber, where the stationary communications feedthrough is coupled to the first data communications link; 
 connecting a movable communications feedthrough to the enclosure, where the movable communications feedthrough is configured to move with the enclosure when the enclosure is moved along the chamber, where the movable communications feedthrough does not physically contact the stationary communications feedthrough; 
 locating a second data communications link inside the enclosure and coupled to the movable communications feedthrough, where the movable communications feedthrough is configured and located relative to the stationary communications feedthrough to allow transfer of data signals through the stationary communications feedthrough and the movable communications feedthrough between the first data communications link and the second data communications link as the enclosure moves in the chamber; and 
 coupling the second data communications link to at least one sensor and/or at least one motor controller inside the enclosure, where the enclosure and the movable communications feedthrough at least partially seal the second data communications link from the first environment inside the vacuum chamber. 
 
     
     
         47 . The method as claimed in  claim 41  further comprising:
 controlling a heat pump controller of the heat pump based, at least partially, upon pressure inside the chamber. 
 
     
     
         48 . A method comprising:
 determining pressure inside a chamber, where the chamber is configured to provide a first environment sealed from a second environment located outside of the chamber;   controlling a heat pump controller of a heat pump based, at least partially, upon the determined pressure inside the chamber, where the heat pump is located in an enclosure inside the chamber, where the enclosure is movably mounting for movement along the chamber, where the enclosure is configured to provide a third environment sealed from the first environment, where a robot is connected to the enclosure, where the robot comprises at least one movable arm and is configured to support at least one substrate thereon, where the robot is at least partially inside the enclosure in the third environment and at least partially outside of the enclosure in the first environment of the chamber, where an enclosure heat transfer radiator is located on an exterior of the enclosure, where heat pump is connected to the enclosure heat transfer radiator, where a chamber heat transfer radiator is located on the chamber, and where the heat pump controller controls the heat pump such that the chamber heat transfer radiator transfer heats from the enclosure heat transfer radiator across the first environment in the chamber to the second environment outside of the chamber.