Method for making a black self-healing part having a precious metal substrate, and part thus obtained
Abstract
Disclosed is a method for making a part including a substrate made of a precious metal, including: a step of providing the substrate made of an alloy including between 94% and 99.5% of copper (Cu), between 0.5% and 6% of gold (Au), and between 0% and 4% of at least one added element, the substrate having a surface, called upper surface, and having a thickness of at least 100 μm starting from the upper surface; and a step of preparing a patina bath from a mixture including at least: between 3 g and 10 g of anhydrous or hydrated copper acetate (Cu(CH3COO)2), between 3 g and 20 g of anhydrous or hydrated copper sulphate (CuSO4), and between 0.5 g and 2 g of salt (NaCl); then a step of applying the patina bath over the upper surface of the substrate. A part obtained by such a method.
Claims
exact text as granted — not AI-modified1 . A method for making a part including a substrate made of a precious metal, the method including:
A step of providing the substrate made of an alloy including:
Between 94 wt. % and 99.5 wt. % of copper (Cu),
Between 0.5 wt. % and 6 wt. % of gold (Au),
Between 0 wt. % and 4 wt. % of at least one added element,
The total amounting to 100%;
The substrate having a surface, called upper surface, and having a thickness of at least 100 μm starting from the upper surface;
A step of preparing a patina bath from a mixture including at least:
Between 3 g and 10 g of anhydrous or hydrated copper acetate (Cu(CH 3 COO) 2 ),
Between 3 g and 20 g of anhydrous or hydrated copper sulphate (CuSO 4 ), and
Between 0.5 g and 2 g of salt (NaCl); then
A step of applying the patina bath over the upper surface of the substrate.
2 . The method according to claim 1 , wherein the step of preparing a patina bath includes:
A step of heating a litter of distilled or permuted water up to a temperature comprised between 80° C. and 100° C.; A step of adding 3 g to 10 g of anhydrous or hydrated copper acetate, and 3 g to 10 g of anhydrous or hydrated copper sulphate in the heated water, producing a first mixture; A step of stirring for a time period comprised between 30 minutes and 90 minutes of the first mixture; then A step of adding 0.5 g to 2 g of salt (NaCl), in the first mixture; A step of adding 3 g to 10 g of anhydrous or hydrated copper sulphate in the first mixture, producing a second mixture; then A step of stirring the second mixture for a time period comprised between 30 minutes and 90 minutes, producing the patina bath.
3 . The method according to claim 1 , including a step of forming the alloy of the substrate including:
a step of mixing, in proportions, at least 45 g to 55 g of gold (Au) with between 800 g and 1,200 g of pure copper (Cu).
4 . The method according to claim 1 , including a step of forming the substrate over a base.
5 . The method according to claim 4 , wherein the step of forming the substrate includes:
a step of galvanic deposition or projection of the alloy on the base, configured to form a thickness of the substrate of at least 100 μm.
6 . The method according to claim 1 , including prior to the step of applying patina:
A step of pickling the upper surface of the substrate; then A step of rinsing the substrate.
7 . The method according to claim 1 , wherein the step of applying the patina bath includes a step of immersing the substrate into the patina bath, the immersion step having a duration comprised between 45 minutes and 90 minutes, and the patina bath having a temperature comprised between 80° C. and 100° C.
8 . A part obtained by a method according to claim 1 , the part including:
At least one substrate made of an alloy including at least:
Between 94% and 99.5% of copper (Cu),
Between 0.5% and 6% of gold (Au),
Between 0% and 4% of at least one added element,
The total amounting to 100%;
The substrate having a surface, called upper surface, and having a thickness of at least 100 μm starting from the upper surface; and
And a patina applied over the upper surface of the substrate, the patina having a thickness of at least 5 μm, and the patina including at least:
a copper oxide, and
gold (Au).
9 . The part according to claim 8 , wherein the patina includes between 0% and of at least one amongst: carbon, oxygen, chlorine, potassium, calcium, or iron.
10 . The part according to claim 8 , wherein the added element has a concentration comprised between 0% and 1%.
11 . The part according to claim 8 , wherein the added element includes at least one amongst: silver (Ag); arsenic (As), zinc (Zn), lead (Pb), iron (Fe), or tin (Sn).
12 . The part according to claim 8 , wherein the patina includes a gold concentration comprised between 5% and 15%.
13 . The part according to claim 8 , wherein the alloy of the substrate includes 95.24% copper (Cu) and 4.76% gold (Au).
14 . The part according to claim 8 , having a black surface characterised by colorimetry in the L*a*b* CIE 1976 colour space with a “L” value comprised between 10 and 50, an “a” value comprised between −1.5 and 1; and a “b” value comprised between −8 and 1.
15 . The method according to claim 2 , including a step of forming the alloy of the substrate including:
a step of mixing, in proportions, at least 45 g to 55 g of gold (Au) with between 800 g and 1,200 g of pure copper (Cu).
16 . The method according to claim 2 , including a step of forming the substrate over a base.
17 . The method according to claim 3 , including a step of forming the substrate over a base.
18 . The method according to claim 2 , including prior to the step of applying patina:
A step of pickling the upper surface of the substrate; then A step of rinsing the substrate.
19 . The method according to claim 3 , including prior to the step of applying patina:
A step of pickling the upper surface of the substrate; then A step of rinsing the substrate.
20 . The method according to claim 4 , including prior to the step of applying patina:
A step of pickling the upper surface of the substrate; then A step of rinsing the substrate.Cited by (0)
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