Substrate processing system carrier

Abstract

A carrier includes a carrier body configured to be supported on a robot to transport one or more process kit rings within a substrate processing system. The carrier further includes fingers extending from the carrier body. The fingers are configured to support the one or more process kit rings. A first finger of the plurality of fingers includes an upper surface that forms a recess to receive the one or more process kit rings.

What is claimed is: 
     
         1 . A carrier comprising:
 a carrier body configured to be supported on a robot to transport one or more process kit rings within a substrate processing system; and   a plurality of fingers extending from the carrier body, wherein the plurality of fingers are configured to support the one or more process kit rings, wherein a first finger of the plurality of fingers comprises an upper surface that forms a recess to receive the one or more process kit rings.   
     
     
         2 . The carrier of  claim 1 , wherein the upper surface comprises a first recess side surface, a second recess side surface opposite the first recess side surface, and a recess lower surface disposed between the first recess side surface and the second recess side surface. 
     
     
         3 . The carrier of  claim 2 , wherein:
 the first recess side surface is configured to be disposed proximate one or more inner surfaces of the one or more process kit rings;   the second recess side surface is configured to be disposed proximate one or more outer surfaces of the one or more process kit rings; and   the recess lower surface is configured to be disposed under the one or more process kit rings.   
     
     
         4 . The carrier of  claim 1 , wherein the one or more process kit rings comprise at least two process kit rings, wherein the first finger is configured to control concentricity of the at least two process kit rings relative to each other during transportation of the at least two process kit rings. 
     
     
         5 . The carrier of  claim 1 , wherein the one or more process kit rings comprise at least two process kit rings, wherein the first finger is configured to maintain a gap between the at least two process kit rings substantially same during transportation of the one or more process kit rings. 
     
     
         6 . The carrier of  claim 1 , wherein the first finger comprises:
 a first upper surface disposed substantially in a first plane, wherein the first upper surface is configured to receive the one or more process kit rings;   a second upper surface disposed substantially in a second plane that is above the first plane; and   a sidewall disposed between the first upper surface and the second upper surface.   
     
     
         7 . The carrier of  claim 6 , wherein the sidewall comprises an upper portion that has about a degree angle and a lower portion that has about a 5 degree angle relative to the first upper surface. 
     
     
         8 . The carrier of  claim 6 , wherein the first finger further comprises a chamfer between the first upper surface and the sidewall. 
     
     
         9 . The carrier of  claim 6 , wherein the sidewall has a first coefficient of friction and the first upper surface has a second coefficient of friction that is greater than the first coefficient of friction. 
     
     
         10 . The carrier of  claim 1 , the first finger is configured to dissipate electrostatic charge. 
     
     
         11 . The carrier of  claim 1 , wherein the one or more process kit rings contact the first finger without contacting the carrier body during transportation of the carrier. 
     
     
         12 . The carrier of  claim 1 , wherein the plurality of fingers further comprise a second finger and a third finger that each form a corresponding recess to receive the one or more process kit rings. 
     
     
         13 . The carrier of  claim 1 , wherein the carrier body forms an opening configured to receive a fastener, wherein the first finger is configured to be removably attached to the carrier body via the fastener and the opening. 
     
     
         14 . The carrier of  claim 13 , wherein the opening is a slot, wherein the first finger is adjustably located on the carrier body. 
     
     
         15 . A finger configured extend from a carrier body of a carrier of a substrate processing system, the finger comprising:
 a first recess side surface configured to be disposed proximate one or more inner surfaces of one or more process kit rings;   a second recess side surface opposite the first recess side surface, wherein the second recess side surface is configured to be disposed proximate one or more outer surfaces of the one or more process kit rings; and   a recess lower surface disposed between the first recess side surface and the second recess side surface, wherein the recess lower surface is configured to be disposed under the one or more process kit rings.   
     
     
         16 . The finger of  claim 15 , wherein the one or more process kit rings comprise at least two process kit rings, wherein the finger is configured to control concentricity of the at least two process kit rings relative to each other during transportation of the at least two process kit rings. 
     
     
         17 . The finger of  claim 15 , wherein the one or more process kit rings comprise at least two process kit rings, wherein the finger is configured to maintain a gap between the at least two process kit rings substantially same during transportation of the one or more process kit rings. 
     
     
         18 . The finger of  claim 15 , wherein the finger is configured to be removably attached to the carrier body via a fastener and an opening formed by the carrier body. 
     
     
         19 . A carrier comprising:
 a carrier body configured to be supported on a robot to transport two or more process kit rings within a substrate processing system; and   a plurality of fingers extending from the carrier body, wherein the plurality of fingers are configured to support the two or more process kit rings, wherein a first finger of the plurality of fingers is configured to control concentricity of the two or more process kit rings relative to each other during transportation of the two or more process kit rings.   
     
     
         20 . The carrier of  claim 19 , wherein the first finger is configured to maintain a gap between the two or more process kit rings substantially same during the transportation of the two or more process kit rings.