Circuit board assembly

Abstract

The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and a plurality of shielding columns. The core layer has an accommodating space, in which the accommodating space has an inner sidewall. The electronic component is disposed in the accommodating space. The first shielding ring wall is disposed in the accommodating space and covers the inner sidewall, in which the first shielding ring wall surrounds the electronic component and is not in contact with the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The shielding columns are disposed in the first insulating layer.

What is claimed is: 
     
         1 . A circuit board assembly, comprising:
 a core layer having at least one accommodating space, wherein the at least one accommodating space has an inner sidewall;   at least one electronic component disposed in the at least one accommodating space;   at least one first shielding ring wall disposed in the at least one accommodating space and covering the inner sidewall, wherein the at least one first shielding ring wall surrounds the at least one electronic component and is not contact with the at least one electronic component;   at least one second shielding ring wall disposed in the core layer and surrounding the at least one first shielding ring wall;   a first circuit layer;   a second circuit layer, wherein the core layer is disposed between the first circuit layer and the second circuit layer;   a first insulating layer, wherein the second circuit layer is disposed between the first insulating layer and the core layer; and   a plurality of shielding columns disposed in the first insulating layer.   
     
     
         2 . The circuit board assembly of  claim 1 , wherein the shielding columns are electrically connected to the at least one first shielding ring wall. 
     
     
         3 . The circuit board assembly of  claim 1 , further comprising a shielding layer, wherein the shielding layer is disposed beneath the first insulating layer, and the first insulating layer is disposed between the shielding layer and the core layer, and the shielding columns extend to the core layer and the shielding layer. 
     
     
         4 . The circuit board assembly of  claim 1 , wherein the at least one second shielding ring wall comprises two metal layers and a conductive material, and the two metal layers are arranged in concentric rings, and one of the metal layers surrounds the other of the metal layers and the conductive material. 
     
     
         5 . The circuit board assembly of  claim 4 , wherein a surface of the at least one electronic component, one end of the conductive material, and a surface of the core layer are coplanar. 
     
     
         6 . The circuit board assembly of  claim 4 , wherein a height of the second shielding ring wall is greater than a thickness of the at least one electronic component. 
     
     
         7 . The circuit board assembly of  claim 1 , further comprising a second insulating layer, wherein the first circuit layer is disposed between the second insulating layer and the core layer. 
     
     
         8 . The circuit board assembly of  claim 7 , wherein a material of the core layer is a photosensitive dielectric material. 
     
     
         9 . The circuit board assembly of  claim 7 , further comprising a graphene layer, wherein the graphene layer is disposed in the at least one accommodating space and surrounds the at least one electronic component, and the graphene layer is continuously distributed around the at least one electronic component. 
     
     
         10 . The circuit board assembly of  claim 1 , wherein the at least one electronic component is electrically isolated from the at least one first shielding ring wall, the at least one second shielding ring wall, and the shielding columns.