US2024084476A1PendingUtilityA1

Method for smoothing and polishing metals via ion transport via free solid bodies and solid bodies for performing the method

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Assignee: DRYLYTE SLPriority: Apr 28, 2016Filed: Nov 17, 2023Published: Mar 14, 2024
Est. expiryApr 28, 2036(~9.8 yrs left)· nominal 20-yr term from priority
C25F 3/16B24B 31/003C25F 7/00C25F 3/24
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Claims

Abstract

A method for smoothing and polishing metals via ion transport by free solid bodies. The method includes connecting a part to be treated to a pole of a current generator and subjecting the part to friction with a set of particles that includes electrically charged and electrically conductive free solid bodies in a gaseous environment.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method comprising:
 electrically coupling a metal part to a first pole of a power supply, the metal part having a surface; and   removing metal at the surface of the metal part via ion transport by subjecting the surface to friction with a plurality of free solid bodies that are electrically conductive and electrically coupled to a second pole of the power supply, the second pole having an opposite polarity of the first pole, the plurality of free solid bodies comprising a plurality of non-electrically conductive structures containing an amount of electrolyte liquid to cause the free solid bodies to be electrically conductive.   
     
     
         2 . The method according to  claim 1 , wherein the first pole is a positive pole of the power supply and the second pole is a negative pole of the power supply. 
     
     
         3 . The method according to  claim 1 , wherein the plurality of free solid bodies are in a gaseous environment. 
     
     
         4 . The method according to  claim 1 , wherein the metal part and plurality of free solid bodies are disposed inside a receptacle, the plurality of free solid bodies being electrically coupled to the second pole of the power supply through an electrically conductive apparatus located inside the receptacle. 
     
     
         5 . The method according to  claim 1 , wherein the metal part and plurality of free solid bodies are disposed inside a receptacle, the free solid bodies being electrically coupled to the second pole of the power supply through the receptacle. 
     
     
         6 . The method according to  claim 1 , wherein the metal part is coupled to a securing element that moves the metal part relative to the plurality of particles. 
     
     
         7 . The method according to  claim 6 , wherein the securing element is electrically conductive and is electrically coupled to the first pole of the power supply. 
     
     
         8 . The method according to  claim 6 , wherein the securing element moves the metal part in an orbital motion about an axis and on a plane. 
     
     
         9 . The method according to  claim 8 , wherein the securing element simultaneously moves the metal part in a plane perpendicular to the plane of the orbital motion. 
     
     
         10 . The method according to  claim 3 , wherein the gaseous environment comprises air. 
     
     
         11 . The method according to  claim 1 , wherein each of the plurality of free solid bodies has an outer surface, the amount of electrolyte liquid contained in the non-electrically conductive structure being below a saturation level such that the electrolyte liquid does not reside on the outer surface as a free liquid. 
     
     
         12 . The method according to  claim 1 , wherein the electrolyte liquid comprises 90% to 99% H 2 O. 
     
     
         13 . The method according to  claim 1 , wherein the electrolyte liquid comprises 90% to 99% H 2 O and 10% to 1% HF. 
     
     
         14 . The method according to  claim 1 , wherein the plurality of free solid bodies comprises free solid bodies of different shapes. 
     
     
         15 . The method according to  claim 1 , wherein the plurality of free solid bodies comprises free solid bodies having a spherical shape of different sizes. 
     
     
         16 . The method according to  claim 1 , wherein the free solid bodies are spherical shaped and have diameters ranging from 0.3 to 0.8 mm. 
     
     
         17 . The method according to  claim 1 , wherein the non-electrically conductive structure comprises sulfonated styrene-divinylbenzene copolymer. 
     
     
         18 . The method according to  claim 1 , wherein the non-electrically conductive structure is a porous structure. 
     
     
         19 . The method according to  claim 4 , wherein the electrically conductive apparatus is in the form of a ring.

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